• Title/Summary/Keyword: resistance change

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Effect of Maximum Aggregate, Porosity, and Temperature on Crack Resistance and Moisture Susceptibility of Porous Asphalt Mixtures (최대입경, 공극률, 온도가 다공성 아스팔트 혼합물의 균열저항성 및 수분민감성에 미치는 영향)

  • Yoo, In-Kyoon;Lee, Su-Hyung;Park, Ki-Soo;Yoon, Kang-Hoon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.22 no.3
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    • pp.611-619
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    • 2021
  • Porous asphalt pavement (PAP) has many functions, such as reducing accidents and decreasing noise. On the other hand, vulnerability is inevitable because PAP contains approximately 20% porosity. This study evaluated the effects of the maximum aggregate size (MAS), temperature, and porosity on the PAP durability. The indirect tensile strength measures durability. This study tested the samples that stayed dry and were moisturized by freezing and thawing for mixtures having the same porosity of 20% and MAS of 13mm, 10mm, and 8mm. The same test was performed on a mixture of 20% and 22% voids made of the same material with a MAS of 10mm. As a result, for 20% porosity, significant differences in the changes in MAS and temperature were found. A clear difference was observed between 8mm and 13mm under dry conditions, but there were no other significant differences in the MAS change. Furthermore, there was a clear difference in temperature for the change in porosity and temperature, but the gap in 2% porosity at 20% did not show a clear difference. Therefore, it is necessary to develop a more durable PAP through quantitative evaluations of the factors affecting the PAP durability.

Centrifugal Test on Behavior of the Dolphin Structure under Ship Collision (선박충돌 시 돌핀 구조물의 거동에 대한 원심모형실험)

  • Oh, SeungTak;Bae, WooSeok;Cho, SungMin;Heo, Yol
    • Journal of the Korean GEO-environmental Society
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    • v.12 no.1
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    • pp.61-70
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    • 2011
  • The impact protection system consists of an arrangement of circular sheet pile cofferdams-denoted dolphin structuredeeply embedded in the seabed, filled with crushed rock and closed at the top with a robust concrete cap. Centrifuge model tests were performed to investigation the behaviors of dolphins in this study. Total 7 quasi-model tests and 11 dynamic model tests were performed. The main experimental results can be summarized as follows. Firstly, The experimental force-displacement results for quasi-static tests show a limited influence on the initial stiffness of the structure from the change in fill density and the related change in the stiffness of the fill. And by comparing the dissipation at the same dolphin displacement it was found that the denser fill increase the dissipation by 16% for the 20m dolphin and by 23% for the 30m dolphin. The larger sensitivity for the large dolphin is explained by a larger contribution to the dissipation from strain in the fill. In low level impacts the dynamic force-response is up to 26~58% larger than the quasi-static and the dissipation response is showed larger in small displacement. Hence, it is concluded conservative to use the quasi-static response characteristics in the approximation of the response, and it is further concluded that the dolphin resistance to low level impacts is demonstrated to be equivalent and even superior to the high level impacts.

Molecular dynamics study of liquid sodium film evaporation and condensation by Lennard-Jones potential

  • Wang, Zetao;Guo, Kailun;Wang, Chenglong;Zhang, Dalin;Tian, Wenxi;Qiu, Suizheng;Su, Guanghui
    • Nuclear Engineering and Technology
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    • v.54 no.8
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    • pp.3117-3129
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    • 2022
  • Deeply understanding the phase change of thin liquid sodium film inside wick pore is very important for further studying high-temperature sodium heat pipe's heat transfer. For the first time, the evaporation and condensation of thin liquid sodium film are investigated by the Lennard-Jones potential of molecular dynamics. Based on the startup and normal operation of the sodium heat pipe, three different cases are simulated. First, the equilibrium is achieved and the Mass Accommodation Coefficients of the three cases are 0.3886, 0.2119, 0.2615 respectively. Secondly, the non-equilibrium is built. The change of liquid film thickness, the number of gas atoms, the net evaporation flux (Jnet), the heat transfer coefficient (h) at the liquid-gas interface are acquired. Results indicate that the magnitude of the Jnet and the h increase with the basic equilibrium temperature. In 520-600 K (the startup of the heat pipe), the h has approached 5-6 W m-2 K-1 while liquid film thickness is in 11-13 nm. The fact shows that during the initial startup of the sodium heat pipe, the thermal resistance at the liquid-gas interface can't be negligible. This work is the complement and extension for macroscopic investigation of heat transfer inside sodium heat pipe. It can provide a reference for further numerical simulation and optimal design of the sodium heat pipe in the future.

The efficacy and safety of Dendropanax morbifera leaf extract on the metabolic syndrome: a 12-week, placebo controlled, double blind, and randomized controlled trial

  • Jun, Ji Eun;Hwang, You-Cheol;Ahn, Kyu Jeung;Chung, Ho Yeon;Choung, Se Young;Jeong, In-Kyung
    • Nutrition Research and Practice
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    • v.16 no.1
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    • pp.60-73
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    • 2022
  • BACKGROUND/OBJECTIVES: The extract from Dendropanax morbifera exhibited diverse therapeutic potentials. We aimed to evaluate the efficacy and safety of D. morbifera leaf extract for improving metabolic parameters in human. SUBJECTS/METHODS: A 12-week, double blind, placebo-controlled and randomized trial included a total of 74 adults, and they were assigned to the placebo group (n = 38) or 700 mg/day of D. morbifera group (n = 36). The efficacy endpoints were changes in glycemic, lipid, obesity, and blood pressure (BP) parameters, in addition to the prevalence of metabolic syndrome (MetS) and the numbers of MetS components. Safety was assessed by monitoring adverse events (AEs). RESULTS: After 12 weeks of treatment, the hemoglobin A1c (HbA1c) level significantly decreased in the D. morbifera group compared to that of the placebo group (difference: -0.13 ± 0.20% vs. 0.00 ± 0.28%, P = 0.031; % of change: -2.27 ± 3.63% vs. 0.10 ± 5.10%, P = 0.025). The homeostatic model assessment for insulin resistance level also decreased significantly from its baseline in the D. morbifera group. The systolic BP of D. morbifera group decreased significantly than that of placebo group (difference: -3.9 ± 9.8 mmHg vs. 3.3 ± 11.7 mmHg, P = 0.005; % of change: -2.8 ± 7.7% vs. 3.3 ± 10.2%, P = 0.005). However, the lipid parameters and body composition including body weight did not differ between the groups. The prevalence of MetS (36.8% vs. 13.9%, P = 0.022) and the incidence of MetS (10.5% vs. 13.9%, P = 0.027) at 12 weeks was significantly lower in the D. morbifera group than it was in the placebo group. No serious AEs occurred in either group. CONCLUSIONS: Supplementation with D. morbifera extracts over a 12-week period improved metabolic parameters such as HbA1c and BP and reduced the prevalence of MetS.

Analysis of Community Stability and Characteristics of Macroinvertebrates in Paddy Fields by Cultivation Method (논 재배방식에 따른 저서성대형무척추동물 군집특성 및 군집안정성 분석)

  • Shin, I-Chan;Kim, Myung-Hyun;Eo, Jinu
    • Ecology and Resilient Infrastructure
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    • v.9 no.1
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    • pp.15-23
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    • 2022
  • This study was conducted to investigate in relation to characteristic of macroinvertebrates in conventional and organic paddy fields. The investigation was conducted five times a year for Suwon, Ansung, Boeun, Gunsan, Gimje, Hamyang, divide into conventional paddy fields and organic paddy fields from 2009 to 2011. The macroinvertebrates collected from the surveyed between conventional and organic paddy fields belonged to 84 species, 47 families, 16 orders, and 6 classes in 3 phyla. In the habitat orientied groups, climbers, swimmers and sprawlers were considerably occupied in conventional and organic paddy fields. In relation to the functional feeding groups, predators such as Odonata, Coleoptera, and Hemiptera were only the highest in paddy field ecosystem, regardless of cultivation method. As a result of community stability analysis, orgainc paddy fields has been identified much as species high resistance and resilience to environmental change in paddy field ecosystem. Species belonging to the I groups is considered to be important in organic paddy field such as Sternolophus rufipes, Hydrochara affinis, Helochares nipponicus, which has high mobility. In conclusion, it was found that the introduction of coleoptera as a food source was higher than that of conventional paddy fields in organic paddy field where primary consumers were abundant such as Chironomidae spp. and Dixidae sp..

Assessment of physical condition of old large Chionanthus retusus(Chinese Fringe Tree) using structural stability analysis (천연기념물 이팝나무 노거수 구조안정성 진단을 통한 물리적 생육상태 평가)

  • SON Jiwon;SHIN Jinho
    • Korean Journal of Heritage: History & Science
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    • v.56 no.1
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    • pp.118-130
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    • 2023
  • Decay or large cavities inside trees are the main causes of trees overturning and broken branches, and structurally weakened trees are more vulnerable to strong winds and heavy snowfall. Recently, as strong winds and typhoons increase due to climate change, the damage to human life and property due to trees overturning continues to increase, and cultural assets are in a similar situation. In particular, old big trees are structurally vulnerable to external shocks such as strong winds and heavy snowfall. This study was aimed at providing a scientific basis for preventive protection measures by conducting a structural stability diagnosis of seven retusa fringe trees designated as natural monuments. For the structural stability diagnosis, tree risk assessment and internal tree defect measurements were performed. As a result of the tree risk assessment, the Retusa Fringe Trees in Sinjeon-ri, Yangsan and Gwangyangeupsu had the highest risk of broken branches due to weak branch attachment strength. As a result of the diagnosis of internal defects of cross sections of measured trees, there were suspected cavities or severe decay in all except two trees of the population of Retusa Fringe Trees in Pyeongji-ri. Natural disasters due to climate change are increasing, and the scale is getting larger, so it is very important to preemptively manage large old trees through scientific structural safety diagnosis to manage trees that are vulnerable to environmental changes.

Treatment Response Evaluation by Computed Tomography Pulmonary Vasculature Analysis in Patients With Chronic Thromboembolic Pulmonary Hypertension

  • Yu-Sen Huang;Zheng-Wei Chen;Wen-Jeng Lee;Cho-Kai Wu;Ping-Hung Kuo;Hsao-Hsun Hsu;Shu-Yu Tang;Cheng-Hsuan Tsai;Mao-Yuan Su;Chi-Lun Ko;Juey-Jen Hwang;Yen-Hung Lin;Yeun-Chung Chang
    • Korean Journal of Radiology
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    • v.24 no.4
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    • pp.349-361
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    • 2023
  • Objective: To quantitatively assess the pulmonary vasculature using non-contrast computed tomography (CT) in patients with chronic thromboembolic pulmonary hypertension (CTEPH) pre- and post-treatment and correlate CT-based parameters with right heart catheterization (RHC) hemodynamic and clinical parameters. Materials and Methods: A total of 30 patients with CTEPH (mean age, 57.9 years; 53% female) who received multimodal treatment, including riociguat for ≥ 16 weeks with or without balloon pulmonary angioplasty and underwent both non-contrast CT for pulmonary vasculature analysis and RHC pre- and post-treatment were included. The radiographic analysis included subpleural perfusion parameters, including blood volume in small vessels with a cross-sectional area ≤ 5 mm2 (BV5) and total blood vessel volume (TBV) in the lungs. The RHC parameters included mean pulmonary artery pressure (mPAP), pulmonary vascular resistance (PVR), and cardiac index (CI). Clinical parameters included the World Health Organization (WHO) functional class and 6-minute walking distance (6MWD). Results: The number, area, and density of the subpleural small vessels increased after treatment by 35.7% (P < 0.001), 13.3% (P = 0.028), and 39.3% (P < 0.001), respectively. The blood volume shifted from larger to smaller vessels, as indicated by an 11.3% increase in the BV5/TBV ratio (P = 0.042). The BV5/TBV ratio was negatively correlated with PVR (r = -0.26; P = 0.035) and positively correlated with CI (r = 0.33; P = 0.009). The percent change across treatment in the BV5/TBV ratio correlated with the percent change in mPAP (r = -0.56; P = 0.001), PVR (r = -0.64; P < 0.001), and CI (r = 0.28; P = 0.049). Furthermore, the BV5/TBV ratio was inversely associated with the WHO functional classes I-IV (P = 0.004) and positively associated with 6MWD (P = 0.013). Conclusion: Non-contrast CT measures could quantitatively assess changes in the pulmonary vasculature in response to treatment and were correlated with hemodynamic and clinical parameters.

Optical and Electrical Properties of ZnO Hybrid Structure Grown on Glass Substrate by Metal Organic Chemical Vapor Deposition (유기금속화학증착법으로 유리기판 위에 성장된 산화아연 하이브리드 구조의 광학적 전기적 특성)

  • Kim, Dae-Sik;Kang, Byung Hoon;Lee, Chang-Min;Byun, Dongjin
    • Korean Journal of Materials Research
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    • v.24 no.10
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    • pp.543-549
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    • 2014
  • A zinc oxide (ZnO) hybrid structure was successfully fabricated on a glass substrate by metal organic chemical vapor deposition (MOCVD). In-situ growth of a multi-dimensional ZnO hybrid structure was achieved by adjusting the growth temperature to determine the morphologies of either film or nanorods without any catalysts such as Au, Cu, Co, or Sn. The ZnO hybrid structure was composed of one-dimensional (1D) nanorods grown continuously on the two-dimensional (2D) ZnO film. The ZnO film of 2D mode was grown at a relatively low temperature, whereas the ZnO nanorods of 1D mode were grown at a higher temperature. The change of the morphologies of these materials led to improvements of the electrical and optical properties. The ZnO hybrid structure was characterized using various analytical tools. Scanning electron microscopy (SEM) was used to determine the surface morphology of the nanorods, which had grown well on the thin film. The structural characteristics of the polycrystalline ZnO hybrid grown on amorphous glass substrate were investigated by X-ray diffraction (XRD). Hall-effect measurement and a four-point probe were used to characterize the electrical properties. The hybrid structure was shown to be very effective at improving the electrical and the optical properties, decreasing the sheet resistance and the reflectance, and increasing the transmittance via refractive index (RI) engineering. The ZnO hybrid structure grown by MOCVD is very promising for opto-electronic devices as Photoconductive UV Detectors, anti-reflection coatings (ARC), and transparent conductive oxides (TCO).

New Generation of Lead Free Paste Development

  • Albrecht Hans Juergen;Trodler K. G.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2004.09a
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    • pp.233-241
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    • 2004
  • A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

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New Generation of Lead Free Solder Spheres 'Landal - Seal'

  • Walter H.;Trodler K. G.
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2004.09a
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    • pp.211-219
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    • 2004
  • A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

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