• 제목/요약/키워드: recrystallization behavior

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체결용 Ti 합금의 미세조직 특성 및 기계적/전기화학적 거동 분석 연구 (A Study of the Microstructure Properties and Mechanical/electrochemical Behavior of Ti Alloy for Fastening)

  • 이효주;;최정묵;이근호;박이주;조훈휘
    • 소성∙가공
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    • 제31권3호
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    • pp.151-159
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    • 2022
  • Ti alloys are used in a wide range of applications, especially for aviation and medical purposes, because of their high specific strength and excellent corrosion properties. When subjected to various manufacturing processes, one of the most popular Ti alloys, Ti-6Al-4V, exhibits a variety of microstructural and mechanical properties that makes it an attractive lightweight metal. The purpose of this study was to analyze the microstructure and mechanical properties of Ti alloy wires. Subsequently, the microstructure and electrochemical behavior of Ti alloy bolts produced from these wires were analyzed. The Ti alloy wires are manufactured with different diameters (6.22, 7.81 mm alloys), and their microstructures are measured using electron backscatter diffraction. Recrystallization was observed to occur significantly in the 7.81 alloy than in the 6.81 alloy, and the strain distribution of 7.81 alloy is seen to be likely more uniform than 6.22 alloy. Ti alloy bolt was then forged under moderate temperature by using the 7.81 alloy. Results of the electrochemical analysis indicate that the Ti alloy bolt has excellent corrosion resistance.

재결정 PLGA와 단량체를 이용한 5-FU/PLGA 웨이퍼의 방출거동 (Release Behavior of 5-FU from 5-FU/PLGA Wafer using Recrystallized PLGA and Monomer)

  • 박정수;최명규;김윤태;이준희;모종현;강길선;이종문;신형식;이해방
    • Korean Chemical Engineering Research
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    • 제46권2호
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    • pp.205-210
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    • 2008
  • PLGA는 생분해성 고분자이며 생체적합성을 갖는 고분자로서 약물전달을 위한 연구에 많이 이용되고 있는 고분자이다. 그러나 PLGA를 약물전달에 이용할 때 약물의 급격한 초기방출 이후에 일정기간동안 약물이 방출되지 않는 지연시간이 존재하게 된다. 이러한 문제를 해결하기 위하여 PLGA 웨이퍼에 단량체를 첨가하여 제조하였다. 또한 PLGA를 재결정하여 약물의 급격한 방출 현상을 억제하도록 하였다. SEM을 이용하여 재결정된 PLGA의 형태학적 차이를 관찰하였으며 생체외 약물 방출거동은 HPLC를 이용하여 측정하였다. PLGA의 분해과정에서 단량체의 영향을 알아보기 위하여 GPC를 이용하여 분자량 변화를 측정하였다. 본 연구를 통하여 PLGA의 벌크분해에 기인한 지연시간을 없앨 수 있었으며 약물의 방출 기간을 3일까지 앞당길 수 있었다.

$SiC_p$ 크기를 달리한 $SiC_p$/Al2024 복합재료의 열간 변형특성에 관한연구 (A Study on Hot Deformation Behavior of $SiC_p$/AI2024 Composites Reinforced with Different Sizes of $SiC_p$)

  • 고병철;홍흥기;유연철
    • 소성∙가공
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    • 제7권2호
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    • pp.158-167
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    • 1998
  • Hot restoration mechanism flow stress and stain of the Al2024 composites reinforced with 1,8,15,36, and $44{\mu}m\;SiC_p$(10 vol. %) were studied by hot torsion tests. The hot restoration mechanism of all the composites was found to be dynamic recrystallization(DRX) at $320^{\circ}C$ while that of the composites reinforced with 1 and $8{\mu}m\;SiC_p$ was found to be dynamic recovery(DRX) at $480^{\circ}C$. It was found that the Al2024 composite with $15{\mu}m\;SiC_p$ showed the highest flow stress(${\sim}$223 MPa) at $320^{\circ}C$ under a strain rate of 1.0/sec. Also the highest flow strain of the composites was obtained at $430^{\circ}C$. The com-posites reinforced with 1 and $8{\mu}m\;SiC_p$ showed lower flow stress and higher flow strain at $480^{\circ}C$ than those of the composites reinforced with 15, 36, and $44\;{\mu}m\;SiC_p$ These result were discussed in relation to the transition of the hot restoration mechanism. $DRX{\leftrightarrow}DRV$. The dependence of flow stress on strain rate and temperature was attempted to fit with the hyperbolic sine equation ($\dot{\varepsilon}=A[sinh({\alpha}{\cdot}{\sigma}_p]^n$ exp(-Q/RT)and Zener-Hollomon parameter($Z=\;\dot{\varepsilon}\;exp(Q/RT))$.

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저온공정에 의한 자기이온주입된 비정질 실리콘 박막의 재결정화 (Low Temperature Recrystallization of Self-Implanted Amorphous Silicon Films)

  • 이만형;최덕균;김정태
    • 한국재료학회지
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    • 제2권6호
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    • pp.417-427
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    • 1992
  • 저압화학기상증착(LPCVD)법에 의해 비정질 실리콘 박막을 증착한 후, 자기 이온주입 (self-implantation)과 저온 열처리에 의해 결정화와 입자성장을 유도하였다. 그리고 여러가지 공정변수의 변화에 따른 결정화 양상을 관찰함으로써 최적의 물리적 성질 즉, 입자크기 및 분포를 갖는 공정조건을 도출하였다. 다결정 성장막의 균일성은 광학현미경 분석에 의존하였으며, 이를 위해 KOH : (IPA) : $H_2$O $K_2$C${r_2}{O_7}$, 에칭용액을 개발하였다. 비정질 박막의 결정화 양상에 있어서는 XRD와 TEM 분석결과 결정들이 (111) 우선방위를 갖고 수지상(dendrite) 형태로 성장하였으며, 이온 주입량의 증가에 따라 입자 크기는 증가하였다. 최대 입자는 3${\times}{10^{15}}$c$m^2$의 농도로 Si 이은주입한 비정질 Si박막을 55$0^{\circ}C$에서 40시간 이상 결정화시켜 얻었으며, 이때의 최대 입자크기는 3.2${\mu}$m로 측정되었다.

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강화공정에 따른 비균질 티타늄 금속기 복합재료 모델링 (Modeling the Heterogeneous Microstructures of Ti-MMCs in Consolidation Process)

  • 이수윤;김태원
    • Composites Research
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    • 제18권3호
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    • pp.21-30
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    • 2005
  • 고온진공간압 성형기술 및 포일-섬유-포일 방식을 이용하여 티타늄금속기 복합재료를 개발하였다. 이와 관련하여 강화공정 전후의 비균질 미시조직의 변화를 관측하였으며 공정 진행에 따른 충진거동도 함께 비교분석하였다. 결과에서 알 수 있듯이 강화공정 동안 섬유의 분포 형태에 따라 등축 $\alpha$, transformed $\beta$$ Widmanst\ddot{a}tten$ $\alpha$ 등 상당한 미시조직의 변화가 확인되었다. 공정 진행에 따른 미시조직의 변화는 따라서 변형에 대한 기지재료의 불균일 정도와 관련한 결정립성장 및 재결정과 같은 변형기구들로 설명할 수 있었다. 이와 같은 변형기구 해석을 바탕으로 공정에 따른 기공의 충진 정도와 조직의 변화를 예측하기 위한 미시역학적 구성방정식이 개발되었으며, 또한 유한요소 해석을 통해 실공정 과정을 보다 정밀하게 예측할 수 있었다.

트윈롤 주조 후 열간압연된 Mg-0.6wt.%Zn-0.6wt.%Ca 합금 판재의 열처리에 따른 결정립 성장 거동 (Grain Growth Behavior of Heat Treated Mg-0.6wt.%Zn-0.6wt.%Ca Alloy Sheet Manufactured via Twin Roll Casting and Hot Rolling)

  • 이희재;박노진
    • 열처리공학회지
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    • 제35권2호
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    • pp.74-81
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    • 2022
  • This study aims to mitigate the microstructural heterogeneity arising from the manufacture of magnesium alloy plates using the twin roll casting (TRC) process. Homogenization was introduced through hot rolling and heat treatment, followed by confirmation of observed changes in the microstructure. Following the TRC process, the hot rolled 2mm plate exhibited a dendritic cast structure tilted in the roll rotation direction, while central segregation were developed. This nonuniform structure and central segregation disappeared upon heat treatment, followed by recrystallization to form uniform and fine grains. Abnormal grain growth (AGG) was observed over the course of heat treatment; grains exhibiting AGG occupied up to 75% of the total area after having held the sample at 400℃ for 64 h. The formation of coarse grains was also observed during heat treatment at 340℃ over a relatively long duration, though the maximum grain size was significantly smaller than that corresponding to the heat treatment at 400℃. AGG in the 400℃ heat treatment occurred because of movement of the grain boundary, which had been fixed prior as a result of the grain boundary fixing effect of the precipitation phase. The re-dissolution of the Ca2Mg5Zn5 precipitated phase over the long duration of the high-temperature annealing process caused the surrounding grains to disappear and regrow.

Ni계 초내열합금 NIMONIC 80A의 고온변형거동 (High Temperature Deformation Behavior of a NIMONIC 80A Ni-based Superalloy)

  • 하민철;황시우;김종수;김철유;박경태
    • 소성∙가공
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    • 제22권5호
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    • pp.258-263
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    • 2013
  • The deformation behavior of NIMONIC 80A was studied in the high temperature range of $900{\sim}1200^{\circ}C$ and for strain rates varying between 0.02 and $20s^{-1}$ via the hot compression test. Processing maps for hot working were constructed on the basis of the power dissipation efficiency using a dynamic material model. The results showed that the strength during hot compression increased with increasing strain rate and decreasing temperature. At low strains, the processing map of NIMONIC 80A did not reveal any instability domain regardless of the strain rate and temperature. However, at high strains, the processing map exhibited an instability domain at a low strain rate of $0.2s^{-1}$ and within a temperature range of $900{\sim}960^{\circ}C$. In the instability domain, the deformed microstructure exhibited shear bands and carbide precipitation while, in the safe domain, full recrystallization occurred.

Ti-6Al-4V 합금의 고온변형거동 규명 (Characterization of Hot Deformation Behavior of Ti-6Al-4V Alloy)

  • 염종택;김두현;나영상;박노광
    • 소성∙가공
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    • 제10권4호
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    • pp.347-354
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    • 2001
  • Compression tests were carried out to investigate the hot-deformation behavior of Ti-6Al-4V alloy in the temperature range of $915^{\circ}C$ to $1015^{\circ}C$ and the strain rate range of $10^{-3}s^{-i}$ to $10s^{-1}$. Under the given test conditions, the hot-deformation of Ti-6Al-4V alloy was mainly led by dynamic recovery rather than by dynamic recrystallization. The activation energy for the plastic deformation in $\alpha+\beta$ field was about 894 kJ/mol and $\beta$ field was 332kJ/mo1. Processing map for hot working are developed on the basis of the variations of efficiency of power dissipation($\eta$=2m/m+1) and flow instability criterion using the dynamic material model. The optimum process condition in the ($\alpha+\beta$) field was obtained at the temperature ranges of $930^{\circ}C$ to $955^{\circ}C$$^{\circ}C$ and a strain rate of $10^{-3}s{-1}$.

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Synthesis, Structure, and Thermal Property of Poly(trimethylene terephthalate- co-trimethylene 2,6-naphthalate) Copolymers

  • Jeong, Young-Gyu;Jo, Won-Ho;Lee, Sang-Cheol
    • Fibers and Polymers
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    • 제5권3호
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    • pp.245-251
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    • 2004
  • Poly(trimethylene terephthalate-co-trimethylene 2,6-naphthalate)s (P(TT-co-TN)s) with various copolymer composition were synthesized, and their chain structure, thermal property and crystalline structure were investigated by using $^1$H-NMR spectroscopy, differential scanning calorimetry (DSC) and wide-angle X-ray diffraction (WAXD), respectively. It was found from sequence analysis that all the P(TT-co-TN) copolymers synthesized have a statistical random distribution of TT and TN units. It was also observed from DSC thermograms that the glass transition temperature increases linearly with increasing the TN comonomer content, whereas the melting temperature of copolymer decreases with increasing the corresponding comonomer content in respective PTT- and PTN-based copolymer, showing pseudo-eutectic melting behavior. All the samples melt-crystallized isothermally except for P(TT-co-66 mol % TN) exhibit multiple melting endotherms and clear X-ray diffraction patterns. The multiple melting behavior originates from the dual lamellar population and/or the melting-recrystallization-remelting. The X-ray diffraction patterns are largely divided into two classes depending on the copolymer composition, i.e., PTT and PTN $\beta$-form diffraction patterns, without exhibiting cocrystallization.

실리콘 박막에서 이온 질량 도핑에 의해 주입된 인의 전기적 활성화에 관한 연구 (A study on the electrical activation of ion mass doped phosphorous on silicon films)

  • 김진호;주승기;최덕균
    • 전자공학회논문지A
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    • 제32A권1호
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    • pp.179-184
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    • 1995
  • Phosphorous was deped in silicon thin films by Ion Mass Doping and Changes in the electrical resistance with respect tko heat treatments were investigated. SOI(Silicon On Insulator) thin films which contain few grain boundaries prepared by ZMR(Zone Melting Recrystallization) of polysilicon films, polysilicon films which have about 1500 $A^{\rarw}$ of grain size prepared by LPCVD at 625.deg. C, and amorphous silicon thin films prepared by LPCVD at low temperature were used as substrates and thermal behavior of phosphorous after RTA(Rapid Thermal Annealing) and furnace annealing was carefully studied. Amorphous thin films showed about 10$^{6}$ .OMEGA./ㅁbefore any heat treatment, while polycrystalline and SOI films about 10$^{3}$.OMEGA./¤. All these films, however, showed about 10.OMEGA./ㅁafter furnace annealing at 700.deg. C for 3hrs and RTA showed about the same trend. Films with grain boundaries showed a certain range of heat treatment which rendered increase of the electrical resistance upon annealing, which could not be observed in amorphous films and segregation of doped phosphorous by diffusion with annealing was thought to be responsible for this abnormal behavior.

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