• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
• /
• pp.533-536
• /
• 2006

VIATRON TECHNOLOGIES has developed Field-Enhanced Rapid Thermal Processor (FERTP) system that enables LTPS LCD and AMOLED manufacturers to produce poly-Si films at low cost, high throughput, and high yield. The FE-RTP allows the diverse process options including crystallization, thermal oxidation of gate oxides and fast pre-compactions. The process and equipment compatibility with a-Si TFT lines is able to provide a viable solution to produce poly-Si TFTs using a-Si TFT lines.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1988년도 전기.전자공학 학술대회 논문집
• /
• pp.383-386
• /
• 1988

In MOS integrated circuits, annealing after oxidation process is necessary to improve physical properties of silicon dioxide. With subsequent annealing in inert gases such as nitrogen or argon, and excess silicon bond is allowed time to complete the oxidation and surface charge density is reduced. In this paper, we will present effects of the rapid thermal annealing on silicon dioxide. In order to evaluate characteristics of silicon dioxide, we analyzed C-V curve dependent on annealing time and temperature, and presented variation of fixed oxide charge.

• 한국세라믹학회지
• /
• 제31권7호
• /
• pp.753-758
• /
• 1994

(100) Si and 4$^{\circ}$off (100) Si were oxidized in dry oxygen, and the differences in thermal oxidation behavior and electrical characteristics between two specimens were investigated. Ellipsometer measurements of the oxide thickness produced by oxidation in dry oxygen from 1000 to 120$0^{\circ}C$ showed that the oxidation rates of the 5$^{\circ}$ off (100) Si were more rapid than those of the (100) Si and the differences between them decreased as the oxidation temperature increased. The activation energies based on the parabolic rate constant, B for (100) and 4$^{\circ}$off (100) Si were 25.8, 28.6 kcal/mol and those on the linear rate constant, B/A were 56.8, 54.9 kcal/mol, respectively. Variation of C-V characteristics with the oxidation temperature showed that the flat band voltages were shifted positively and surface state charge densities decreased as the oxidation temperature increased, and the surface state charge density of the 4$^{\circ}$off (100) Si was lower than that of the (100) Si. Also considerable decrease in the density of oxidation induced stacking faults (OSF) for the 4$^{\circ}$off (100) Si was observed through optical microscopy after preferentially etching off the oxide layer.

• 제어로봇시스템학회:학술대회논문집
• /
• 제어로봇시스템학회 1995년도 Proceedings of the Korea Automation Control Conference, 10th (KACC); Seoul, Korea; 23-25 Oct. 1995
• /
• pp.79-82
• /
• 1995

The problem of temperature control for rapid thermal processing (RTP) in semiconductor manufacturing is discussed in this paper. Among sub=micron technologies for VLSI devices, reducing the junction depth of doped region is of great importance. This paper investigates existing methods for manufacturing wafers, focusing on the RPT which is considered to be good for formation of shallow junctions and performs the wafer fabrication operation in a single chamber of annealing, oxidation, chemical vapor deposition, etc., within a few minutes. In RTP for semiconductor manufacturing, accurate and uniform control of the wafer temperature is essential. In this paper, a robustr controller is designed using a recently developed optimization technique. The controller designed is then tested via computer simulation and compared with the other results.

• 한국재료학회지
• /
• 제3권1호
• /
• pp.7-11
• /
• 1993

실리콘 산화막을 $N_2$O 분위기에서 RTP로 제조하여 그 성장 기구를 고찰 했다. 산화막과 기판 실리콘 계면 사이에 질소성분이 포함된 oxynitride층이 존재한다. $N_2$O 기체를 이용한 산화막 성장은 삼화제 확산에 의해 성장이 지배되는 포물선 성장론을 따르고 산화제 확산 억제작용은 실리콘 산화막과 실리콘 기판사이에 존재하는 oxynitride막에서 일어난다. 확산이 산화막 성장을 결정하는 구간에서 포물선 성장율 상수 B의 활성화 에너지는 약 1.5 eV이고 산화막 두께 증가에 따라 증가한다.

• 한국분말재료학회지
• /
• 제3권2호
• /
• pp.91-96
• /
• 1996

The effect of vacuum annealing on the oxidation behavior of milled WC-15%Co powder mixture has been studied. A cobalt component in the milled powder mixture was oxidized preferentially above 175$^{\circ}C$ in air. The specimens showed a steady increase in weight at 175$^{\circ}C$ but did constant weight followed by rapid increase in specimen weight at the beginning above 20$0^{\circ}C$. Oxidation of the milled powder mixture was significantly suppressed by vacuum annealing at 30$0^{\circ}C$ for 10 h. Suppression of oxidation by vacuum annealing and different oxidation behaviors of the milled powder mixture between 175$^{\circ}C$ and 20$0^{\circ}C$, were attributed to removal of strain energy stored in the cobalt powder during vacuum annealing or oxidation treatment above 20$0^{\circ}C$. The role of stored strain energy on oxidation of milled WC-15%Co powder mixture was proved by X-ray diffraction method and differential thermal analysis.

• 한국지하수토양환경학회지:지하수토양환경
• /
• 제12권3호
• /
• pp.29-35
• /
• 2007

본 연구에서는 산소플라즈마로 티타늄을 산화하고 급속열처리하여 티타니아 광촉매 박막을 제조하고 휴믹산 제거실험을 수행하였다. 플라즈마 화학기상증착장치에서의 산소플라즈마는 티타늄 표면을 산화시킴으로써 광촉매 피막을 생성하게 된다. 증착조건에서 RF power는 최대 500 W 이하에서 100 W, 150 W, 300 W, 처리시간은 5분, 10분에서 조절되었다. 박막의 특성은 XPS와 XRD로 측정하였다. 실험으로서 우리는 박막이 높은 성능을 나타내는 최적을 조건을 찾았다. 또한 제조된 박막의 경우 기존 Thermal spray Titania film에 비해 2배정도 우수하였고 분말만큼 광촉매 성능을 갖는다.

• 전자공학회논문지D
• /
• 제34D권8호
• /
• pp.26-34
• /
• 1997

To develop ultrathin gate oxide for ULSI MOSFETs, for the first time, we fabricated MOS capacitors with 65.angs. thick initial oxide grown by high pressure oxidation (HIPOX) at 700.deg. C in 5 atmosphere $O_{2}$ ambient and then followed by rapid thermal nitridation (RTN) in N$_{2}$O ambient. The dielectric breakdown fields of the initial HIPOX oxide are 13.0 MV/cm and 13.8MV/cm for negative and positive gate bias, respectively and are dependent on nitridation temeprature and time.The lifetimes of the HIPOX oxides extractd by TDDB method are 1.1*10$^{8}$ sec and 3.4 * 10$^{9}$ sec for negative and positive stress current, respectively. The lifetime of the HIPOX oxide dfor negative stress current increases with nitridation time in N$_{2}$O ambient at 1100.deg.C, reaching maximum value stress curretn increases with nitridation time in N$_{2}$O ambient at 1100.deg. C reacing maximum value of 1.2*10$^{9}$ sec for 30 sec of nitridation time, and then subsequently decreases at the longer nitridation time. The lifetimes of the nitrided-HIPOX oxides are longer than 10 years when nitridations are carried out longer than about 50 sec and 12 sec at 1000.deg. C, and 1100.deg. C, respectively.

• 한국결정성장학회지
• /
• 제6권2호
• /
• pp.185-193
• /
• 1996

(100) Si wafer를 $2.5^{\circ},\;5^{\circ}$ 기울인 뒤, dry $O_{2}$ 분위기에서 산화시킴으로써, 시편들 간의 산화 거동 및 산화에 의한 적층 결함 특성의 차이를 알아보았다. 시편을 $900~1200^{\circ}C$에서 산화시키고 ellipsometer로 두께를 측정한 결과 저탈각 (100) Si이 (100) Si보다 산화 속도가 빨랐으며, $5^{\circ}$ off면이 $2.5^{\circ}$ off면보다 더 빨랐다. 결정방향에 따른 산화속도 차이는 산화 온도가 높아질수록 줄어들었다. 각 시편의 속도 상수에 대한 활성화 에너지는 포물 성장 속도 상수의 경우 (100) Si, $2.5^{\circ}$ off (100) Si, $5^{\circ}$ off Si이 각각 27.3, 25.9, 27.6 kcal/mol이였고, 선형 성장 속도 상수는 58.6, 56.6, 57.4 kcal/mol이였다. 또한, 두 시편에 대해 산화막을 선택 식각하 고 광학 현미경으로 관찰하여, (100) Si에 비해 $5^{\circ}$ off된 면의 산화에 의한 적층 결함 밀도가 훨씬 낮음을 확인하였고, 적층 결함 간의 각도가 달라짐을 확인하였다.

• ETRI Journal
• /
• 제26권4호
• /
• pp.315-320
• /
• 2004

This paper proposes a 10-${\mu}m$ thick oxide layer structure that can be used as a substrate for RF circuits. The structure has been fabricated using an anodic reaction and complex oxidation, which is a combined process of low-temperature thermal oxidation (500 $^{\circ}C$ for 1 hr at $H_2O/O_2$) and a rapid thermal oxidation (RTO) process (1050 ${\circ}C$, for 1 min). The electrical characteristics of the oxidized porous silicon layer (OPSL) were almost the same as those of standard thermal silicon dioxide. The leakage current density through the OPSL of 10 ${\mu}m$ was about 10 to 50 $nA/cm^2$ in the range of 0 to 50 V. The average value of the breakdown field was about 3.9 MV/cm. From the X-ray photo-electron spectroscopy (XPS) analysis, surface and internal oxide films of OPSL prepared by a complex process were confirmed to be completely oxidized. The role of the RTO process was also important for the densification of the porous silicon layer (PSL) oxidized at a lower temperature. The measured working frequency of the coplanar waveguide (CPW) type short stub on an OPSL prepared by the complex oxidation process was 27.5 GHz, and the return loss was 4.2 dB, similar to that of the CPW-type short stub on an OPSL prepared at a temperature of 1050 $^{\circ}C$ (1 hr at $H_2O/O_2$). Also, the measured working frequency of the CPW-type open stub on an OPSL prepared by the complex oxidation process was 30.5 GHz, and the return was 15 dB at midband, similar to that of the CPW-type open stub on an OPSL prepared at a temperature of $1050^{\circ}C$ (1 hr at $H_2O/O_2$).