• Journal of the Korean Home Economics Association
• /
• v.40 no.10
• /
• pp.77-85
• /
• 2002

This study was conducted to evaluate the efficiency of various fabrics in protecting from solar radiation and ultraviolet radiation(UV). Six kinds of fabrics were selected and examined in singles or doubles. It was studied how the materials and the thickness of air layer between the fabric and the floor affected the protection efficiency of fabrics from sunlight. The results were as followes; 1) Protection from solar radiation: In the case of over 2 cm air layer, doubled fabric composed of aluminum coating-nylon and white or black polyester/cotton(T/C) was the most protective(p<0.001). In the case of 0 cm air layer, the case without fabric and white T/C were more effective(p<0.001). And the thicker the air layer the more effective the protection. 2) Protection from UV : Doubled fabric composed of aluminum coating-nylon and black T/C was the most protective(p<0.001) and the thinner the air layer the more effective the protection(p<0.001).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1997.11a
• /
• pp.432-435
• /
• 1997

In AC PDP, electrodes are covered with dielectric layer and the discharge is formed on the surface of the dielectric layer. MgO protection layer on the dielectric layer in PDP prevents a dielectric layer from sputtering and lowers the firing voltage due to a large secondary electron emission yield( ${\gamma}$ ). Until now, the MgO protection layer is mainly prepared by E-beam evaporation. However, there are some problems that is easy pollution and change of its characteristics with time and delamination. Therefore, in this study, MgO protection layer is prepared on dielectric layer by reactive R.F. magnetron sputtering with MgO target. Discharge characteristics and secondary electron emission coefficients of PDP are studied as a parameter of preparation conditions. Discharge voltage characteristics of the prepared MgO layer can be stable and improved by the annealing process in vacuum chamber.

• Proceedings of the Korean Geotechical Society Conference
• /
• 2008.10a
• /
• pp.1727-1734
• /
• 2008

After the final closure of sea dyke, seepage behaviour of embankment is highly changed by variation of water head different between tide wave and controlled water level at fresh lake. Especially, the seepage behaviour of bottom protection layer of final closure section is more important factor for structural and functional stability of sea dyke, because of the bottom protection layer of final closure section is penetrated sea side to fresh lake. Even though bottom protection layer was filled with dredged fine sand, it has a high permeability. In this paper, mainly described about the seepage velocity and borehole image of bottom protection layer filled with dredged sand after final closure. Various in-situ tests such as BIPS (Borehole Image Processing System) and ABI (Acoustic Borehole Imager) survey, wave velocity measuring, and color tracer survey were conducted to evaluate the seepage behavior of bottom protection layer. Based on the in-situ tests, the bottom protection layer of final closure section was almost filled with dredged sand which is slightly coarse grain sand and there have sea water flow by water head different between tide wave and controlled water level at fresh lake. Also, comply with tracer survey results, the sea water flow path was not exist or generated in the bottom protection layer. However, because of this result not only short term survey but also just one test borehole survey results, additional long term and other borehole tests are needed.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.16 no.4
• /
• pp.470-480
• /
• 2016

The reversal of a silicon chip to find out its security structure is common and possible at the present time. Thanks to reversing, it is possible to use a probing attack to obtain useful information such as personal information or a cryptographic key. For this reason, security-related blocks such as DES (Data Encryption Standard), AES (Advanced Encryption Standard), and RSA (Rivest Shamir Adleman) engines should be located in the lower layer of the chip to guard against a probing attack; in this regard, the addition of a silicon-surface-protection layer onto the chip surface is a crucial protective measure. But, for manufacturers, the implementation of an additional silicon layer is burdensome, because the addition of just one layer to a chip significantly increases the overall production cost; furthermore, the chip size is increased due to the bulk of the secure logic part and routing area of the silicon protection layer. To resolve this issue, this paper proposes a practical silicon-surface-protection method using a metal layer that increases the security level of the chip while minimizing its size and cost. The proposed method uses a shift register for the alternation and variation of the metal-layer data, and the inter-connection area is removed to minimize the size and cost of the chip in a more extensive manner than related methods.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2017.05a
• /
• pp.97-97
• /
• 2017

This study investigated the corrosion protection by electrodeposited copper layer on AZ31 Mg alloy with and without additional silver layer by immersion test, salt spray test, OCP transient and potentiodynamic polarization experiment. The single electrodeposited Cu layer on AZ31 Mg alloy showed a nodular structure with many imperfections of crevices between the nodules, which resulted in the fast initiation of pitting corrosion within first few hours of immersion. Double-layer coating of Cu and outer Ag layer slightly increased the initiation time for pitting corrosion. Triple-layer coatings of Cu/Ag/Cu exhibited the most efficient corrosion protection of AZ31 Mg alloy, compared to the single- and double-layer coatings. Surface morphology of the outer Cu layer in the triple-layer was changed from the nodular structure to fine particle structure with no crevices due to the presence of an additional Ag layer. Thus, the improved corrosion resistance of AZ31 Mg alloy by electrodeposited Cu/Ag or Cu/Ag/Cu layers is readily ascribed to the decreased number of imperfections in the electrodeposited layers due to the additional silver layer. It is concluded that the additional silver layer provides many nucleation sites for the second Cu plating, resulting in the formation of finer and denser structure than the first Cu electrodeposit.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1996.11a
• /
• pp.357-360
• /
• 1996

MgO protection layer in ac PDP(plasma display panel) prevents the dielectric layer from ion bombarding in discharge plasma. The MgO layer also has the additional important role in lowering the firing voltage due to a large secondary electron emission coefficient. Until now, the MgO protection layer is mainly prepared by E-beam evaporation. In this study, MgO protection layer is prepared on dielectric layer of ac PDP cell by reactive R.F magnetron sputtering with Mg target under various conditions of oxygen partial pressure. Discharge characteristics of PDP is also studied as a parameter of MgO preparation conditions. The sputtered MgO shows the better discharge characteristics compared with MgO deposited by E-beam evaporator.

• Journal of Astronomy and Space Sciences
• /
• v.41 no.1
• /
• pp.17-23
• /
• 2024

The safety of electronic components used in aerospace systems against cosmic rays is one of the most important requirements in their design and construction (especially satellites). In this work, by calculating the dose caused by proton beams in geostationary Earth orbit (GEO) orbit using the MCNPX Monte Carlo code and the MULLASSIS code, the effect of different structures in the protection of cosmic rays has been evaluated. A multi-layer radiation shield composed of aluminum, water and polyethylene was designed and its performance was compared with shielding made of aluminum alone. The results show that the absorbed dose by the simulated protective layers has increased by 35.3% and 44.1% for two-layer (aluminum, polyethylene) and three-layer (aluminum, water, polyethylene) protection respectively, and it is effective in the protection of electronic components. In addition to that, by replacing the multi-layer shield instead of the conventional aluminum shield, the mass reduction percentage will be 38.88 and 39.69, respectively, for the two-layer and three-layer shield compared to the aluminum shield.

• Geomechanics and Engineering
• /
• v.28 no.3
• /
• pp.209-224
• /
• 2022

In this study, the numerical analysis model of π-beam explosion is established to compare and analyze the failure modes of the π-beam under the action of explosive loads, thus verifying the accuracy of the numerical model. Then, based on the numerical analysis of different protection forms of π beams under explosive loads, the peak pressure of π beam under different protection conditions, the law of structural energy consumption, the damage pattern of the π beam after protection, and the protection efficiency of different protective layers was studied. The testing results indicate that the pressure peak of π beam is relatively small under the combined protection of steel plate and aluminum foam, and the peak value of pressure decays quickly along the beam longitudinal. Besides, as the longitudinal distance increases, the pressure peak attenuates most heavily on the roof's explosion-facing surface. Meanwhile, the combined protective layer has a strong energy consumption capacity, the energy consumed accounts for 90% of the three parts of the π beam (concrete, steel, and protective layer). The damaged area of π beam is relatively small under the combined protection of steel plate and aluminum foam. We also calculate the protection efficiency of π beams under different protection conditions using the maximum spalling area of concrete. The results show that the protective efficiency of the combined protective layer is 45%, demonstrating a relatively good protective ability.

• Proceedings of the KIEE Conference
• /
• 1997.07e
• /
• pp.1840-1842
• /
• 1997

MgO protection layer on the dielectric layer in PDP prevents a dielectric layer from sputtering and lowers the firing voltage due to a large $\gamma$-Coefficients. Until now, the MgO protection layer is mainly prepared by E-beam evaporation. However, there are some problems that is easy pollution and change of its characteristics with time and delamination. Therefore in this study. MgO protection layer is prepared on dielectric layer by R.F. magnetron sputtering with Mg target under various conditions. The sputtered MgO shows the better discharge characteristics compared with MgO deposited by E-beam evaporatior.

• Proceedings of the Korean Society of Broadcast Engineers Conference
• /
• 2011.07a
• /
• pp.294-295
• /
• 2011

The fundamental problem of selective protection scheme for encoded bitstreams is to find an efficient algorithm to select the set of frames required to be encrypted that can maximize protection effect with the minimum amount of protected data is required. In this paper, we propose an optimal selective protection scheme for SVC bitstreams by protecting the best combination of frames for selective protection in the sense that the amount of data required for protection is minimized and the resulting visual quality degradation is maximized. The selection of the frames to be encrypted is done by first expressing R-Q (protection rate - visual quality) relationship with Lagragian cost model. The experimental results show that, compared to protecting SVC bitstreams layer by layer, the proposed scheme gives superior performance in terms of protection effectiveness due to its better selection of frames for protection given protection bit budgets.