• 제목/요약/키워드: process-monitoring

검색결과 3,443건 처리시간 0.036초

티타늄 합금의 슬롯가공에서 엔드밀 공구마멸 감시 (Tool wear monitoring of end mill in slot machining of titanium alloy)

  • 하건호;구세진;김정석;양순철
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1995년도 추계학술대회 논문집
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    • pp.101-104
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    • 1995
  • A acoustic emission (AE) sensor has been used to monitor tool were during milling process. The relation between tool wear and AE RMS (Root mean Square) signal was investigated experimentally. A avaliable monitoring index for monitoring toolwear was newly extracted form AE RMS. And on-line monitoring program was developed. The proposed monitoring system has verified experimentally by roughing end milling titanium alloy with TIN coated HSS tool.

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A Preliminary Research on Optical In-Situ Monitoring of RF Plasma Induced Ion Current Using Optical Plasma Monitoring System (OPMS)

  • Kim, Hye-Jeong;Lee, Jun-Yong;Chun, Sang-Hyun;Hong, Sang-Jeen
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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    • pp.523-523
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    • 2012
  • As the wafer geometric requirements continuously complicated and minutes in tens of nanometers, the expectation of real-time add-on sensors for in-situ plasma process monitoring is rapidly increasing. Various industry applications, utilizing plasma impedance monitor (PIM) and optical emission spectroscopy (OES), on etch end point detection, etch chemistry investigation, health monitoring, fault detection and classification, and advanced process control are good examples. However, process monitoring in semiconductor manufacturing industry requires non-invasiveness. The hypothesis behind the optical monitoring of plasma induced ion current is for the monitoring of plasma induced charging damage in non-invasive optical way. In plasma dielectric via etching, the bombardment of reactive ions on exposed conductor patterns may induce electrical current. Induced electrical charge can further flow down to device level, and accumulated charges in the consecutive plasma processes during back-end metallization can create plasma induced charging damage to shift the threshold voltage of device. As a preliminary research for the hypothesis, we performed two phases experiment to measure the plasma induced current in etch environmental condition. We fabricated electrical test circuits to convert induced current to flickering frequency of LED output, and the flickering frequency was measured by high speed optical plasma monitoring system (OPMS) in 10 kHz. Current-frequency calibration was done in offline by applying stepwise current increase while LED flickering was measured. Once the performance of the test circuits was evaluated, a metal pad for collecting ion bombardment during plasma etch condition was placed inside etch chamber, and the LED output frequency was measured in real-time. It was successful to acquire high speed optical emission data acquisition in 10 kHz. Offline measurement with the test circuitry was satisfactory, and we are continuously investigating the potential of real-time in-situ plasma induce current measurement via OPMS.

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ARIMA(0,1,1)모형에서 통계적 공정탐색절차의 MARKOV연쇄 표현 (A Markov Chain Representation of Statistical Process Monitoring Procedure under an ARIMA(0,1,1) Model)

  • 박창순
    • 응용통계연구
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    • 제16권1호
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    • pp.71-85
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    • 2003
  • 일정 시간간격으로 품질을 측정하는 공정관리절차의 경제적 설계에서는 그 특성의 규명이 측정시점의 이산성 (discreteness) 때문에 복잡하고 어렵다. 이 논문에서는 공정 탐색 절차를 Markov 연쇄(chain)로 표현하는 과정을 개발하였고, 공정분포가 공정주기 내에서 발생하는 잡음과 이상원인의 효과를 설명할 수 있는 ARIMA(0,1,1) 모형을 따를 때에 Markov 연쇄의 표현을 이용하여 공정탐색절차의 특성을 도출하였다. Markov 연쇄의 특성은 전이행렬에 따라 달라지며, 전이행렬은 관리절차와 공정분포에 의해 결정된다. 이 논문에서 도출된 Markov 연쇄의 표현은 많은 다른 형태의 관리절차나 공정분포에서도 그에 해당하는 전이행렬을 구하면 쉽게 적용될 수 있다.

An Interpretation of Process Capability Index and Process Performance Index

  • 남호수
    • Journal of the Korean Data and Information Science Society
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    • 제13권2호
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    • pp.285-294
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    • 2002
  • The control chart is widely used tool for monitoring of the process. This paper deals with an interpretation of the process capability index(PCI) and process performance index(PPI) when the control chart is used for monitoring of the process. The main difference between the PCI and PPI is how we did estimate the process deviation. The PCI uses the within process variation and the PPI uses the total process variation, which is conceptually defined as sum of between process variation and within process variation. Easy interpretations of the PCI and PPI for field engineers are described. And some new approaches to interpretation of the process capability and performance index may be useful in early stabilization of new process.

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ELID 연삭에서 가공 상태 감시 시스템 개발 (Development of process monitoring system in ELID grinding)

  • 서영호;김화영;안중환
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 춘계학술대회 논문집
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    • pp.599-602
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    • 2000
  • A new dressing technique with utilizes electrolytic phenomenon for realizing effective mirror surface grindings with metal bonded super-abrasive wheels is called “Electrolytic In-process Dressing Grinding”. This technique enabled metal bonded micro-grain wheels, such as micro-grain cast iron fiber bonded wheels, to be used for mirror surface finish processes effectively. But this technique requires a lot of knowledge and experience to perform. And the condition of dressing is variable according to the time. Therefore adaptation of Monitoring and Control technique is needed.

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AE센서에 의한 다중 절삭트러블 감시에 관한 연구 (A Study on the Monitoring of multi-Cutting Troubles Using an AE Sensor)

  • 원종식
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2000년도 춘계학술대회논문집 - 한국공작기계학회
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    • pp.39-45
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    • 2000
  • This paper describes the fundamental investigations on the in-process monitoring techniques focused on Acoustic Emission(AE) based on analytical method. Experiments were conducted on a CNC lathe using conventional carbide insert tools under various cutting conditions. As the result of this study a suggestion is given about the multi-purpose use of AE-signals detected with a single sensor for the monitoring of tool wear, built-up edge and chatter vibration in turning process.

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$C^{++}$과 신경망을 이용한 In-process 감시 시스템의 구축 (Construction of In-process Monitoring System using $C^{++}$ and Neural network)

  • 조종래;정윤교
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 2002년도 추계학술대회 논문집
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    • pp.95-98
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    • 2002
  • Monitoring of the cutting trouble is necessarily required to do Factory Automation and Intelligent manufacturing system. Therefore, we constructed a monitoring system using neural network in order to monitor of the cutting trouble. From obtained result, it is shown that the cutting trouble can be monitored effectively by neural network

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AR(l) 공정을 탐지하는 VSS $\overline{A}$ 관리도의 통계적 설계 (Statistical Design of VSS $\overline{A}$ Charts for Monitoring an AR(1) Process)

  • 이재헌
    • 품질경영학회지
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    • 제31권3호
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    • pp.126-135
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    • 2003
  • A basic assumption in standard applications of control charts is that the observations are statistically independent. However, this assumption is often violated from processes in many industries. The presence of autocorrelation has a serious impact on the performance of control charts, causing a dramatic increase in the frequency of false alarms. This paper considers a process in which the observations can be modeled as a first order autoregressive(AR(1)) process, and develops (equation omitted) charts with the variable sample size(VSS) scheme for monitoring the mean of this process.

The CV Control Chart

  • Kang, Chang-W;Lee, Man-S;Hawkins, Douglas M.
    • 한국품질경영학회:학술대회논문집
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    • 한국품질경영학회 2006년도 추계 학술대회
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    • pp.211-216
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    • 2006
  • Monitoring variability is a vital part of modem statistical process control. The conventional Shewhart Rand S charts address the setting where the in-control process readings have a constant variance. In some settings, however, it is the coefficient of variation, rather than the variance, that should be constant. This paper develops a chart, equivalent to the S chart, for monitoring the coefficient of variation using rational groups of observations.

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미세 음향방출 감시장치 개발 - 고정도 미세입자 가공상태 감시에의 적용 - (Development of Acoustic Emission Monitoring System for Fine Machining - Application to Cutting State Monitoring in a Fine Fixed-abrasive Machining -)

  • 김화영;안중환;김성렬
    • 한국정밀공학회지
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    • 제22권6호
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    • pp.109-117
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    • 2005
  • In case of fine machining processes, the cutting state monitoring by a skilled operator is impossible because the physical changes generated during fine machining are very weak. To realize the high efficient and precise fine machining, it is necessary to develop the sensor based monitoring system which is able to detect the fine changes of cutting state. In this paper, the fine acoustic emission monitoring system is developed to monitor the state of the fine machining process. The developed system consists of the AE sensor and the AE signal processing unit. And this has the high-sensitivity and bandwidth which can detect fine AE signal generated during fine machining process. In order to investigate the feasibility of the developed system, evaluation experiments were performed in the fine fixed-abrasive machining processes such as polishing and glass ferrule slicing. Experimental results show that the developed monitoring system possesses an excellent real-time monitoring capability at fine machining processes.