• Title/Summary/Keyword: process measurement

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A study on design of assembly and evaluation system for optical micro film filter (필름형 마이크로 광필터 조립 평가 시스템 설계에 관한 연구)

  • 최두선;제태진;황경현;박한수
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1191-1194
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    • 2003
  • At present, the fabrication of optical filter for optical communication mostly depends on handwork, and only a few companies are propelling semi-automatic systems compounded with automatic and hand-operated methods. The measurement evaluation of optical filters is not commonly useful, so it causes difficulties in the producing field. And the packaging process becomes a very unstable process because the filters are judged from the results that they are not measured and immediately packaged during that process. In this situation, the automatic assembly system of optical filter for communication is extremely important and has begun to make its appearance as the most necessary technology for developing optical communication component with high-functionality. In this paper, we constructed systems of assembly and performance evaluation for micro optical collimator. And by using that, we designed a system capable of performance evaluation and assembly of film filter of about 30 $\mu\textrm{m}$ thickness as well as optical filter for common communication.

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A Study on Enhancement of Grinding Accuracy by an Active Tool Control

  • Oh, Chang-Jin;Kim, Ock-Hyun
    • Journal of Mechanical Science and Technology
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    • v.16 no.5
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    • pp.633-638
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    • 2002
  • An approach to enhance dimensional accuracy of the grinding process has been presented, and grinding of a glass material with a metal-bonded diamond wheel has been studied. In this study, a grinding tool is suspended flexibly and controlled by an electromagnetic actuator. During grinding, profile error of a ground surface is indirectly measured and fed back to a control system. A model of grinding error has been suggested on which the indirect measurement has been based. An optimal PID control is adopted and effectiveness of the in-process feedback control has been verified experimentally.

Effect of the $CO_2$ on Viscosity Change in Continuous Microcellular Foaming Processing (초미세 발포 연속공정을 위한 $CO_2$ 사용이 재료의 점도변화에 미치는 영향)

  • 문용락;차성운
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1394-1397
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    • 2003
  • The first thing in developing injection molding and extrusion with microcellular foaming process is to get a grip on one phase state's rheology of gas and polymer solution. Understanding rheology is essential to design mold or die. and it is so important to control the condition of process. Also, this data is got the utmost out of simulation carrying out. In this paper, we will see the measurement of rheology in one phase that mixed polypropylene which contains talc with carbon dioxide of super critical fluid state, and will compare its result with the simulation result.

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Influence of Wet Annealing on the Performance of SiZnSnO Thin Film Transistors

  • Han, Sangmin;Lee, Sang Yeol
    • Transactions on Electrical and Electronic Materials
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    • v.16 no.1
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    • pp.34-36
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    • 2015
  • Amorphous SiZnSnO(SZTO) thin film transistors(TFTs) have been fabricated by RF magnetron sputtering process, and they were annealed in air and in wet ambient. The electrical performance and the structure were analyzed by I-V measurement, XPS, AFM, and XRD. The results showed improvement in device performance by wet annealing process compared to air annealing treatment, because free electron was shown to be increased due to reaction of oxygen and hydrogen generating oxygen vacancy. This is understood by the generation of free electrons. We expect the wet annealing process to be a promising candidate to contributing to high electrical performance of oxide thin film transistors for backplane device applications.

Bootstrap Confidence Regions of 2-dimensional Vector-valued Process Capability Indices $C_p\;and\;C_{pk}$

  • Park Byoung-Sun;Nam Kyung-Hyun;Cho Joong-Jae
    • Proceedings of the Korean Society for Quality Management Conference
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    • 2004.04a
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    • pp.70-75
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    • 2004
  • In actual manufacturing industries, process capability indices(PCI) are used to determine whether a production process is capable of producing items within a specified specification limits. We study some vector-valued PCIs $C_p=(C_{px},\;C_{py})$ and $C_{pk}=(C_{pkx},\; C_{pky})$ in this article. We propose some asymptotic confidence regions of PCIs with bootstrapping and examine the performance of those asymptotic confidence regions under the assumption of bivariate normal distribution.

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Device Wafer의 평탄화와 AFM에 의한 평가

  • 김호윤;정해도
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.11a
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    • pp.167-171
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    • 1996
  • Chemical mechanical polishing (CMP) has become widely accepted for the planarization of multi-interconnect structures in semiconductor manufacturing. However, perfect planarization is not so easily achieved because it depends on the pattern sensitivity, the large number of controllable process parameters, and the absence of a reliable process model, etc. In this paper, we realized the planarization of deposited oxide layers followed by metal (W) polishing as a replacement for tungsten etchback process for via formation. Atomic force microscope (AFM) is used for the evaluation of pattern topography during CMP. As a result, AFM evaluation is very attractive compared to conventional methods for the measurement of planarity. Moreover, it will contribute to analyze planarization characteristics and establish CMP model.

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A Study of Surface Roughness Prediction using Spindle Displacement (주축변위를 이용한 표면품위 예측에 관한 연구)

  • Chang H.K.;Jang D.Y.;Han D.C.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.15-16
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    • 2006
  • In-process surface roughness prediction is studied in this research. To implement in-process prediction, spindle displacement is introduced. Machined surface's roughness is assumed to be expressed in terms of spindle displacement. In-process measurement of spindle displacement is conducted using CCDS (cylindrical capacitive displacement sensor). Two prediction models are developed. One is simple linear model between measured surface roughness and values by spindle displacement. The other is multiple regression model including machining parameters like spindle speed, fee rate and radial depth of cut. Relation between machined surface roughness and roughness by spindle displacement are verified.

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Optimal Design of Accelerated Degradation Tests under the Constraint of Total Experimental Cost in the Case that the Degradation Characteristic Follows a Wiener Process (열화가 Wiener process를 따르는 경우의 비용을 고려한 가속열화시험 계획)

  • Lim, Heon-Sang
    • Journal of Korean Society for Quality Management
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    • v.40 no.2
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    • pp.117-125
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    • 2012
  • For the highly reliable products, an accelerated degradation test (ADT) is a useful tool which has been employed in industry to obtain reliability-related information within an affordable amount of time and cost. In an ADT, as all other reliability tests, it is important to carefully design the ADT beforehand to obtain estimates of the quantities of interest as precisely as possible. In this paper, optimal ADTs are developed assuming that the constant-stress loading method is employed and the degradation characteristic follows a Wiener process. Under the constraint that the total cost does not exceed a pre-specified budget, the stress levels, the number of test units allocated to each stress level and the number of measurement (termination time) are determined such that the asymptotic variance of the maximum likelihood estimator of the q-th quantile of the lifetime distribution at the use condition is minimized.

A Study on the Characteristics of the Precision Blanking of Lead Frame (1): Influences of Blanking Process Variables (리드 프레임 타발공정의 전단특성에 관한 연구(1) -전단 공정 인자의 영향)

  • 임상헌;서의권;심현보
    • Transactions of Materials Processing
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    • v.10 no.5
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    • pp.425-432
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    • 2001
  • In order to investigate the influences of process parameters on the shape of lead frame, experimental study has been carried out. In the experiment, dimensional accuracy of the die sets, measurement accuracy has been managed carefully enough to simulate actual lead frame blanking process. With the blanking of square-shaped specimen, the effects of clearance, strip holding pressure and bridge width on the shape of blanked profile have been investigated. Experimental results show that the burnish ratio is increased as the clearance decreases. the strip holding pressure increases, and bridge width increases. Although the results seems to be similar to the ordinary blanking, the lead frame blanking shows a subtle different characteristics to the ordinary blanking due to the narrow bridge width.

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A Study on the Unified Molding for a Box Shaped Thick Part Using Gas-Assisted Injection Molding (가스사출성형을 이용한 두꺼운 박스형 제품의 일체화 성형 연구)

  • 이호상
    • Transactions of Materials Processing
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    • v.10 no.5
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    • pp.402-410
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    • 2001
  • The gas-assisted injection molding process is often perceived to be unpredictable, because of the extreme sensitivity of the gas. Since a slight change in design or process parameters can significantly change the resulting gas penetration, few designers and molders have the level of experience with the new gas-assisted injection molding process required for the development of new parts. This paper is concerned with the unified molding for a thick cosmetic chest by using gas-assisted injection molding. CAE analysis was carried out to design the part and the gas channel without inducing sink marks. And based on the part weight measurement, the processing parameters to control gas penetration percentage were chosen through the method of design of experiments. A thick cosmetic chest was successfully produced using the gas assist technology. The sink mark issue associated with the conventional injection molded parts was resolved. Weight savings and cycle-time reduction were also achieved.

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