• Title/Summary/Keyword: pressing temperature

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Effects of Sintering Temperature on Fabrication Properties of LPS-SiC Ceramics (LPS-SiC 세라믹스 제조특성에 미치는 소결온도의 영향)

  • Park, Yi-Hyun;Jung, Hun-Chae;Kim, Dong-Hyun;Yoon, Han-Ki;Kohyam, Akira
    • Proceedings of the KSME Conference
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    • 2004.04a
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    • pp.204-209
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    • 2004
  • SiC materials have been extensively studied for high temperature components in advanced energy system and advanced gas turbine. However, the brittle characteristics of SiC such as low fracture toughness and low strain-to fracture still impose a severe limitation on practical applications of SiC materials. For these reasons, $SiC_f/SiC$ composites can be considered as a promising for various structural materials, because of their good fracture toughness compared with monolithic SiC ceramics. But, high temperature and pressure lead to the degradation of the reinforcing fiber during the hot pressing. Therefore, reduction of sintering temperature and pressure is key requirements for the fabrication of $SiC_f/SiC$ composites by hot pressing method. In the present work, Monolithic LPS-SiC was fabricated by hot pressing method in Ar atmosphere at 1760 $^{\circ}C$, 1780 $^{\circ}C$, 1800 $^{\circ}C$ and 1820 $^{\circ}C$ under 20 MPa using $Al_2O_3-Y_2O_3$ system as sintering additives in order to low sintering temperature. The starting powder was high purity ${\beta}-SiC$ nano-powder with an average particle size of 30 nm. Monolithic LPS-SiC was evaluated in terms of sintering density, micro-structure, flexural strength, elastic modulus and so on. Sintered density, flexural strength and elastic modulus of fabricated LPS-SiC increased with increasing the sintering temperature. In the micro-structure of this specimen, it was found that grain of sintered body was grown from 30 nm to 200 nm.

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Bonding Performance of Maltodextrin and Citric Acid for Particleboard Made From Nipa Fronds

  • Santoso, Mahdi;Widyorini, Ragil;Prayitno, Tibertius Agus;Sulistyo, Joko
    • Journal of the Korean Wood Science and Technology
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    • v.45 no.4
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    • pp.432-443
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    • 2017
  • Maltodextrin and citric acid are two types of natural materials with the potential as an eco-friendly binder. Maltodextrin is a natural substance rich in hydroxyl groups and can form hydrogen bonds with lignoselulosic material, while citric acid is a polycarboxylic acid which can form an ester bond with a hydroxyl group at lignoselulosic material. The combination of maltodextrin and citric acid as a natural binder materials supposed to be increase the ester bonds formed within the particleboard. This research determined to investigate the bonding properties of a new adhesive composed of maltodextrin/citric acid for nipa frond particleboard. Maltodextrin and citric acid were dissolved in distillated water at the ratios of 100/0, 87.5/12.5, 75/25 and 0/100, and the concentration of the solution was adjusted to 50% for maltodextrin and 60% citric acid (wt%). This adhesive solution was sprayed onto the particles at 20% resin content based on the weight of oven dried particles. Particleboards with a size of $25{\times}25{\times}1cm$, a target density $800kg/m^3$ were prepared by hot-pressing at press temperatures of $180^{\circ}C$ or $200^{\circ}C$, a press time of 10 minute and board pressure 3.6 MPa. Physical and mechanical properties of particleboard were tested by a standard method (JIS A 5908). The results showed that added citric acid level in maltodextrin/citric acid composition and hot-pressing temperature had affected to the properties of particleboard. The optimum properties of the board were achieved at a pressing temperature of $180^{\circ}C$ and the addition of only 20% citric acid. The results also indicated that the peak intensity of C=O group increased and OH group decreased with the addition of citric acid and an increase in the pressing temperature, suggesting an interreaction between the hydroxyl groups from the lignocellulosic materials and carboxyl groups from citric acid to form the ester groups.

Coercivity of Hot-pressed Compacts of Nd-Fe-B-type HDDR-treated Powder

  • Abdul Matin, Md.;Kwon, Hae-Woong;Lee, Jung-Goo;Yu, Ji-Hun
    • Journal of Magnetics
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    • v.19 no.2
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    • pp.106-110
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    • 2014
  • $Nd_{12.5}Fe_{80.6}B_{6.4}Ga_{0.3}Nb_{0.2}$ HDDR-treated powder was compacted by hot-pressing using different configurations of dies and heating rates. The die configurations were especially different in terms of the evacuation system that was used in heating for hot-pressing. The coercivity in the compacts was influenced by the evacuation system of the die and heating rate. In spite of the identical hot-pressing temperature and heating rate, coercivity was radically reduced above $600^{\circ}C$ in the compacts prepared in the closed-type die compared to that in the compacts prepared in the open-type die. The coercivity in the compacts prepared in the closed-type die decreased with increasing heating rate and the value further increased when extreme high heating rate was employed. $Nd_{12.5}Fe_{80.6}B_{6.4}Ga_{0.3}Nb_{0.2}$ HDDR-treated powder contained a significant amount of residual hydrogen (approx. 1500 ppm) in the form of $Nd_2Fe_{14}BH_x$ hydride. The dramatic coercivity decrease in the compact prepared in the closed die is attributed to the disproportionation of $Nd_2Fe_{14}BH_x$ hydride. High coercivity is mainly due to the effective desorption of hydrogen or the suppression of hydrogen-related disproportionation upon hot-pressing.

A study on Linear Pattern Fabrication of Plate-type Polymer by Using Thermal Nano Imprint Lithography Process (열간나노임프린트공정을 이용한 평판형 폴리머 소재의 선형 패턴 제작에 관한 연구)

  • Joung, Y.N.;Lee, C.S.;Youn, S.W.;Kang, C.G.
    • Transactions of Materials Processing
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    • v.18 no.8
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    • pp.616-624
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    • 2009
  • In this work we demonstrate the hot-embossing process under different forming conditions such as forming temperature, load, and holding time in pressing, in order to determine the suitable conditions required for linear patterning on polymer plates (PC). Results showed that the replicated pattern depth increased in proportion to an increase in the forming temperature, load, and time. The reduction of the workpiece thickness increased according to the holding time in the pressing process. In the process of time, the reduction ratio of the workpiece thickness decreased due to the surface area increment of the workpiece, while the pressure on the workpiece declined. In order to reduce the bulging ratio we introduced a temperature difference between the upper and the lower punch.

Preparation of Titanium Carbide Fiber-Reinforced Alumina Ceramic Matrix Composites by Self-Propagating High-Temperature Synthesis

  • Yun, Jondo;Bang, Hwancheol
    • The Korean Journal of Ceramics
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    • v.4 no.3
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    • pp.171-175
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    • 1998
  • $Al_2O_3$-TiC composites were prepared from aluminum, titanium oxide, and carbon fibers by self-propagating high-temperature synthesis(SHS). After the SHS reaction, the TiC phase in the sample was found either fibrous or non-fibrous shape. The fraction of the fibrous TiC phase varied with the amount of $Al_2O_3$ diluent addition. The optimum amount of diluent to make fibrous carbide was determined to be 30%. The fibers were hollow inside and made of multiple grains with a composition of titanium carbide. The hollow fiber formation mechanism was suggested and discussed. The synthesized powders were consolidated to dense composites by hot pressing at $1750^{\circ}C$ under 30 MPa.

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Thermal Shock Behavior of Barium Titanate Ceramics

  • Jae Yeon Kim;Young Wook Kim;Kyeong Sik Cho;June Gunn Lee
    • The Korean Journal of Ceramics
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    • v.3 no.3
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    • pp.195-198
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    • 1997
  • Post-firing process of electronic ceramic, such as electroding and encapsultion with resin, often causes damage by thermal shock. The thermal shock behavior of $BaTiO_3$ ceramics was investigated by the down-quench test, where the relative strength retained is determined after the sample is quenched from an elevated temperature into a fixed temperature bath. The critical temperature drop, $\DeltaTc$, was evaluated for three kinds of sintered $BaTiO_3$ ceramics, which were formed by extrustioin, uniaxial pressing using granules, and uniaxial pressing using powders. A drastic loss in strength caused by microcracking was observed for the specimens quenched with $\DeltaT\geq150^{\circ}C$. This concentp can be adopted as a method of the quality control by monitoring the sudden drop of the strength of capacitor products after each exposure to heat.

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Synthesis and Sinteirng of $MoSi_2$ by SHS Process (SHS법에 의한 고온발열체용 $MoSi_2$의 합성 및 소결)

  • 이승재;장윤식;김인술;박홍채;오기동
    • Journal of the Korean Ceramic Society
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    • v.32 no.9
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    • pp.1085-1091
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    • 1995
  • Molybdenum disilicide (MoSi2) was synthesized from Mo, MoO3, Si and Al powders by self-propagating high temperature synthesis (SHS). The effect of processing parameters such as Mo/MoO3 molar ratio, Ar gas pressure in the reactor and pressing pressure of compacts in synthesis of MoSi2 were investigated. h-MoSi2 was transformed into t-MoSi2 with increasing the Mo/MoO3 mole ratio, and only t-MoSi2 phase was identified above 3.5 : 1 (molar ratio). The synthesized phases did not change with the variation of Ar gas pressure and pressing pressure of compacts. It was found that the combustion temperature was above 2,50$0^{\circ}C$. The products were separated into MoSi2 (s) and $\alpha$-Al2O3 by the difference of their specific grativities. Bending strength, hardness and density of sintered specimen exhibited 82 MPa, 5.368 GPa and 5.43 g/㎤, respectively.

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Finite Element Analysis for High Temperature Densification Processing of Alumina Powder Compacts (알루미나 분말 성형체의 고온 치밀화 성형 공정을 위한 유한요소 해석)

  • 권영삼;김기태
    • Journal of the Korean Ceramic Society
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    • v.31 no.4
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    • pp.347-358
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    • 1994
  • Creep densification and grain growth of alumina powder compacts during high temperature processing were investigated. The creep densification and grain growth of alumina powder compacts during various sintering processes were analyzed by employing the consitutive model by Kwon and Kim. Theoretical results from the constitutive model were compared with various experimental data of alumina powder compacts in the literature including pressureless sintering, sinter forging and hot pressing. The proposed constitutive equations were implemented into finite element analysis program (ABAQUS) to simulate densification for more complicated geometry and loading conditions. The effects of friction between die and powder compact or punch and powder compact during sinter forging and hot pressing are investigated by using the finite element method. Also, high temperature forming processing of alumina compact with complicated shape was simulated.

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Thermoelectric Properties of the p-type (Bi0.2Sb0.8)2Te3 with Variation of the Hot-Pressing Temperature (가압소결온도에 따른 p형 (Bi0.2Sb0.8)2Te3 가압소결체의 열전특성)

  • Choi, Jung-Yeol;Oh, Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.4
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    • pp.33-38
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    • 2011
  • The p-type $(Bi_{0.2}Sb_{0.8})_2Te_3$ powers were fabricated by mechanical alloying and hot-pressed at temperatures of $350{\sim}550^{\circ}C$. Themoelectric properties of the hot-pressed $(Bi_{0.2}Sb_{0.8})_2Te_3$ were characterized as a function of the hot-pressing temperature. With increasing the hot-pressing temperature from $350^{\circ}C$ to $550^{\circ}C$, the Seebeck coefficient and the electrical resistivity decreased from 237 ${\mu}V/K$ to 210 ${\mu}V/K$ and 2.25 $m{\Omega}-cm$ to 1.34 $m{\Omega}-cm$, respectively. The power factor of the hot-pressed $(Bi_{0.2}Sb_{0.8})_2Te_3$ became larger from $24.95{\times}10^{-4}W/m-K^2$ to $32.85{\times}10^{-4}W/m-K^2$ with increasing the hot-pressing temperature from $350^{\circ}C$ to $550^{\circ}C$. Among the specimens hot-pressed at $350{\sim}550^{\circ}C$, the $(Bi_{0.2}Sb_{0.8})_2Te_3$ hot-pressed at $500^{\circ}C$ exhibited the maximum dimensionless figure-of-merit of 1.09 at $25^{\circ}C$ and 1.2 at $75^{\circ}C$.

Development of New Micro Pattern Fabrication Process by U sing Isostatic Pressing (정수압을 이용한 미세 패턴 전사 신공정 개발)

  • Seol, J.W.;Joo, B.Y.;Rhim, S.H.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2009.10a
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    • pp.267-270
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    • 2009
  • In the present investigation, we are newly developing a new forming process which can fabricate micro patterns on large-area polymeric substrates for high speed mass production. The key idea of the new process is to pressurize multiple vacuum-packed substrate-mold stacks above the glass transition temperature ($T_g$) of the polymeric substrates. The new process is thought to be promising micro-pattern fabrication technique in three aspects; firstly, isostatic pressing ensures the uniform micro-pattern replicating condition regardless of the substrate area. Secondly, the control of forming condition such as temperature and pressure can realize well-defined process condition exploited in the conventional hot embossing research field. Thirdly, multiple substrates can be patterned at the same time. A prototype forming machine for the new process was developed with the design consideration realizing the present idea. With a developed machine, micro prismatic array patterns with 50 um in size were successfully made on the $380{\times}300{\times}6\;mm$ PMMA plate.

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