Abstract
The p-type $(Bi_{0.2}Sb_{0.8})_2Te_3$ powers were fabricated by mechanical alloying and hot-pressed at temperatures of $350{\sim}550^{\circ}C$. Themoelectric properties of the hot-pressed $(Bi_{0.2}Sb_{0.8})_2Te_3$ were characterized as a function of the hot-pressing temperature. With increasing the hot-pressing temperature from $350^{\circ}C$ to $550^{\circ}C$, the Seebeck coefficient and the electrical resistivity decreased from 237 ${\mu}V/K$ to 210 ${\mu}V/K$ and 2.25 $m{\Omega}-cm$ to 1.34 $m{\Omega}-cm$, respectively. The power factor of the hot-pressed $(Bi_{0.2}Sb_{0.8})_2Te_3$ became larger from $24.95{\times}10^{-4}W/m-K^2$ to $32.85{\times}10^{-4}W/m-K^2$ with increasing the hot-pressing temperature from $350^{\circ}C$ to $550^{\circ}C$. Among the specimens hot-pressed at $350{\sim}550^{\circ}C$, the $(Bi_{0.2}Sb_{0.8})_2Te_3$ hot-pressed at $500^{\circ}C$ exhibited the maximum dimensionless figure-of-merit of 1.09 at $25^{\circ}C$ and 1.2 at $75^{\circ}C$.
p형 $(Bi_{0.2}Sb_{0.8})_2Te_3$ 분말을 기계적 합금화 공정으로 제조하여 가압소결 후 가압소결온도에 따른 열전특성을 분석하였다. 가압소결온도를 $350^{\circ}C$에서 $550^{\circ}C$로 증가시킴에 따라 상온에서 측정한 Seebeck 계수가 237 ${\mu}V/K$에서 210 ${\mu}V/K$로 감소하고 전기비저항이 2.25 $m{\Omega}-cm$에서 1.34 $m{\Omega}-cm$로 감소하였으며, power factor가 $25.0{\times}10^{-4}W/m-K^2$에서 $32.9{\times}10^{-4}W/m-K^2$로 증가하였다. $350{\sim}550^{\circ}C$의 온도범위에서 가압소결한 시편들 중에서, $500^{\circ}C$에서 가압소결한 $(Bi_{0.2}Sb_{0.8})_2Te_3$ 가압소결체가 상온에서 1.09 및 $75^{\circ}C$에서 1.2의 가장 높은 무차원 성능지수를 나타내었다.