• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1553-1555
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• 2008

Super-hydrophobic treated Polyimide film was used as a flexible substrate for developing a new method of metallization. Hydrophilic patterns were fabricated by IN irradiation through shadow mask. Patterned super-hydrophobic substrate was dipped into a bath containing silver nano ink Silver ink was only coated on hydrophilic patterned area. Metal lines of $600{\mu}m$ pitch were fabricated successfully. However, their thickness was too thin to serve as interconnection. To overcome this problem, iterative dipping was conducted. After repeating five times, the thickness of silver metal lines were increased to over than $2{\mu}$. After heat treatment of silver lines, their resistivities were reduced to order of $30{\mu}{\Omega}$-cm the similar level of values reported in other literatures. So, a new method of metallization has high potential for application of RFID antenna and flexible electronics substrates.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.273-273
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• 2010

Recently, extensive research on hetero-junction arrays has been reported owing to its unique band gaps dissimilar to that of homo-junctions. These hetero-junction devices can be used in laser, solar cells, and various sensors. We report on the facile method to fabricate SWCNTs/SnO2 nanowires hetero-junction arrays on flexible polyimide substrate. Each SWCNT field effect transistor (FET) and SnO2 nanowire FET exhibits the purely p- and n-type charactersistics with ohmic contact properties. Such formed pn-junctions showed rectification behaviors reproducibly with a rectification ratio of ${\sim}3{\times}103$ at 1 V and ideality factors about 12. The pn-junctions also showed a good gate modulation behavior.

• Journal of electromagnetic engineering and science
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• v.2 no.2
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• pp.59-64
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• 2002

In this paper, 10$\mu$ m-elevated MEMS CPWs on various substrates are presented. Effective dielectric constants of elevated CPW(ECPW) on polyimide-loaded silicon or alumina substrate are examined and characteristic impedances are also computed versus elevation height. Dispersive property of ECPW and its electromagnetic field distributions are studied through 3-D FDTD algorithm for optimum design. Attenuation of ECPW is measured with TRL calibration procedure and revealed about 3.2 43 lower than that of conventional CPW on the same low-resistivity silicon at 40 CHz. ECPW on polyimide-loaded silicon with overlapped configuration reveals 0.2 dB/mm. Especially, alumina substrate imposes better attenuation than silicon.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1430-1432
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• 2009

The effect of different annealing methods on the sheet resistance of indium tin oxide (ITO) on polyimide (PI) substrate has been investigated. As electro-annealing induced the predominant growth of crystallites of ITO thin films along (400) plane, the sheet resistance of ITO films that were electro-annealed for 2 mA at $180^{\circ}C$ considerably decreased from 50 to 28 ${\Omega}/cm^2$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.80-83
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• 2003

We have investigated the generation of pretilt angle for a nematic liquid crystal (NLC) alignment with in-situ photoalignment method on polyimide (PI) surfaces using thin plastic substrates. The LC aligning capabilities and pretilt angle of the thin plastic substrates by in-situ photoalignment method were better than that of the glass substrate by general photoalignment. Also, the LC pretilt angle increased with increasing healing temperature and exposure time.

• Fire Science and Engineering
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• v.10 no.3
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• pp.3-9
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• 1996

The Polyimide thin films based on PMDA and 4,$4^{\circ}$'-DDE were fabricated by VDPM, and their heat resistance characteristics were invastigated by TGA(Thermogravimetry Analyzer). It was found that deposition rate decreased with increasing substrate temperature and the thin films were not fabricated over the substrate temperature of $70^{\circ}$. $T_{TG}$ of weight loss temperature is $565^{\circ}$, $397^{\circ}$ and $210^{\circ}$ at the substrate temperature of $20^{\circ}$, $40^{\circ}$ and $70^{\circ}$, respectively. It is realized that the endurace temperature for 20,000 hour of thin films fabricated at $20^{\circ}$ and $40^{\circ}$ is $230^{\circ}$ and $200^{\circ}$, respectively.

• Current Optics and Photonics
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• v.3 no.1
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• pp.66-71
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• 2019

Application of liquid crystal (LC) materials to a flexible device is challenging because the bending of LC displays easily causes change in thickness of the LC layer and orientation of LCs, resulting in deterioration in a displayed image quality. In this work, we demonstrate a prototype device combining a flexible polymer substrate and an optically isotropic LC-polymer composite in which the device consists of interdigitated in-plane switching electrodes deposited on a flexible colorless polyimide substrate and the composite consisting of nano-sized LC droplets in a polymer matrix. The device can keep good electro-optic characteristics even when it is in a bending state because the LC orientation is not disturbed in both voltage-off and -on states. The proposed device shows a high potential to be applicable for future flexible LC devices.

• Journal of Sensor Science and Technology
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• v.28 no.6
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• pp.390-394
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• 2019

This paper presents an inkjet-printed plastic force sensor using PEDOT:PSS. Using a piezoelectric-type inkjet printer, the force sensor was manufactured by printing PEDOT:PSS ink onto a polyimide (PI) substrate film. Applying a vertical force of 0 to 100 N to the force sensor on the PI substrate with a thickness of 64 mm, the resistance of the force sensor increased in proportion to the input force by the length deformation of the PI substrates and the sensor pattern. As a result, the fabricated sensor has a characteristic of 0.001% /N with a linearity of 99.38%. In addition, as the thickness of the PI substrate film increased, the sensitivity of the sensor increased linearly. The fabricated force sensor is expected to be applied to industrial sites and healthcare fields.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.162-163
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• 2008

이 논문에서는 Polyimide 기판의 $O_2$ 플라즈마 처리효과에 따른 GZO 박막의 구조적, 전기적, 광학적인 특성을 고찰하였다. ICP-RIE 방법을 이용하여 Polyimide 기판의 $O_2$ 플라즈마 처리의 변수로 RF power와 처리시간을 각 100 ~ 400 W, 120 ~ 600 초까지 조절하였다. RF 스퍼터링 방법으로 $O_2$ 플라즈마 처리효과에 따른 Polyimide 기판을 4인치의 GZO(ZnO : 95 wt%, $Ga_2O_3$ 5 wt%) 타겟을 사용하여 RF power 90 W, 공정압력 5 mTorr, Ar gas 20 sccm, 기판거리 5 cm, 박막두께 500nm, 상온의 조건으로 GZO 박막을 증착 하였다. Polyimide 기판에 $O_2$ 플라즈마 처리를 하지 않고 증착한 GZO 박막의 비저황은 $1.02\times10^{-2}\Omega$-cm 이었고 RF power 100W, 처리시간 120 초로 $O_2$ 플라즈마 처리 후에 증착한 GZO 박막의 비저항이 $1.89\times10^{-3}\Omega$-cm인 최적의 값이 측정되었으며 RF power가 증가할수록 투과도는 감소하였지만 처리시간의 변화에 따라서는 투과도 변화가 거의 없었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.11
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• pp.698-703
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• 2015

In this study, we fabricated the dual gate (DG) ion-sensitive field-effect-transistor (ISFET) with flexible polyimide (PI) extended gate (EG). The DG ISFETs significantly enhanced the sensitivity of pH in electrolytes from 60 mV/pH to 1152.17 mV/pH and effectively improved the drift and hysteresis phenomenon. This is attributed to the capacitive coupling effect between top gate and bottom gate insulators of the channel in silicon-on-transistor (SOI) metal-oxide-semiconductor (MOS) FETs. Accordingly, it is expected that the PI-EG based DG-ISFETs is promising technology for high-performance flexible biosensor applications.