Journal of electromagnetic engineering and science

The Korean Institute of Electromagnetic Engineering and Science (한국전자파학회)
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Micromachined Low-Loss Low-Dispersion Elevated CPW for High-Speed Interconnects

  • S. H. Jeong (Samsung Electronics Co. Ltd.) ;
  • Lee, S. N. (Department of Electrical and Electronics Eng., Yonsei University) ;
  • Lee, S. G. (Samsung Advanced Institute of Technology) ;
  • J. G. Yook (Department of Electrical and Electronics Eng., Yonsei University) ;
  • Kim, Y. J. (Department of Mechatronics eng., Yonsei University) ;
  • Park, H. K. (Department of Electrical and Electronics Eng., Yonsei University)
  • Published : 2002.11.01
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Abstract

In this paper, 10$\mu$ m-elevated MEMS CPWs on various substrates are presented. Effective dielectric constants of elevated CPW(ECPW) on polyimide-loaded silicon or alumina substrate are examined and characteristic impedances are also computed versus elevation height. Dispersive property of ECPW and its electromagnetic field distributions are studied through 3-D FDTD algorithm for optimum design. Attenuation of ECPW is measured with TRL calibration procedure and revealed about 3.2 43 lower than that of conventional CPW on the same low-resistivity silicon at 40 CHz. ECPW on polyimide-loaded silicon with overlapped configuration reveals 0.2 dB/mm. Especially, alumina substrate imposes better attenuation than silicon.

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References

  1. IEEE Trans. Microwave Theory and Tech. v.45 no.5 Micromachined Microwave Transmission Lines in CMOS Technology V. Milanovic;M. Gaitan;E. D. Bowen;M. Zaghloul
  2. IEEE Trans. Microwave Theory and Tech. v.48 no.5 Quasi-TEM Characteristic Impedance of Micromachined CMOS Coplanar Waveguides M. Ozgur(et al.)
  3. IEEE Trans. Components, Packaging, and Manufacturing Tech. v.21 no.2 Characterization of Thin Film Microstrip Lines on Polymide George E. Ponchak;Alan N. Downey
  4. IEEE Trans. Microwave Theory and Tech. v.49 no.5 Low-Loss CPW on Low-Resistivity Si Substrates with a Micromachined Polymide Interface Layer for RFIC Interconnects George E. Ponchak;A. Margomenos;Linda P. B. Katehi
  5. IEEE Trans. Microwave Theory and Tech. v.49 no.9 A New Micromachined Overlay CPW Structure With Low Attenuation Over Wide Impedance Ranges and Its Application to Low-Pass Filters H. -T. Kim;S. H. Jung;J. -H. Park;C. -W. Baek;Y. -K. Kim;Y. -W. Kwon
  6. IEEE MTT-S Digest. v.3 MMIC Transmission Lines for Multi-Layered MMICs H. Ogawa;T. Hasegawa
  7. IEEE Trans. Microwave Theory and Tech. v.46 X-and Ku-band amplifiers based on Si/SiGe HBT's and micromachined lumped components J.-S. Rieh;L.-H. Lu;L. P. B. Katehi;P. Bhattacharya;E. T. Croke;G. E. Ponchak;S. A. Alterovitz https://doi.org/10.1109/22.668683
  8. IEEE MTT-S Digest. v.1 New Coplanar-Like Transmission Lines for Application in Monolithic Integrated Millimeter-Wave and Submillimeter-Wave Circuits A. Reichelt;I. Wolff
  9. Transmission lines for digital and communication Networks Richard E. Matick