• Journal of the Korean Applied Science and Technology
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• v.30 no.4
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• pp.754-760
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• 2013

We investigated an electrochemical properties for Langmuir-Blodgett (LB) monolayer films of sphingomyelin(SP) and polyamic acid(PAA) mixture(1:1, 2:1 and 3:1 molar ratio). LB monolayer films of mixture was deposited by the LB method on the indium tin oxide(ITO) glass. The electrochemical properties measured by cyclic voltammetry with three-electrode system in 0.1N $KClO_4$ solution. As a result, LB monolayer films of SP and PAA mixture was appeared on irreversible process caused by the reduction current from the cyclic voltammogram. Diffusion coefficient(D) in the SP and PAA mixture was calculated $2.670{\times}10^{-5}$, $3.562{\times}10^{-5}$ and $1.005{\times}10^{-5}cm^2s^{-1}$ at 1:1, 2:1 and 3:1 molar ratio, respectively.

• Polymer(Korea)
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• v.24 no.2
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• pp.228-236
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• 2000

The preparation of organophilic clay from Na$^{+}$-MMT was achieved by intercalation of alkylammonium bromide. The dispersed organophilic clay in NMP was then added to the solution of polyamic acids (BPDA-PPD, BTDA-ODA/ MPD) in NMP. After curing at 30$0^{\circ}C$, thin films of the polyimide/clay nanocomposite were prepared. The results of X-ray diffraction (XRD) shelved that the d-spacings of dried polyamic acid (PAA)-clay complexes increased in proportion to the chain length of the onium ion and patterns of two kinds of PAA-clay complexes were similar. The d-spacings of approximately 13.2 $\AA$ for the polyimide/clay nanocomposites were independent of the initial onium ion chain length and the species of PAA. From the study of XRD and transmission electron microscopy (TEM), we found layered silicates were dispersed in polyimide matrix and the resultants were intercalated nanocomposites. TGA result showed thermal stability of polyimide nanocomposite improved a little more than the pure polyimide. From the result of dynamic mechanical property, we found that the storage modulus of the nanocomposites had increased by 1.2-1.8 times of the pure polyimides.s.

• Journal of the Korean Ceramic Society
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• v.39 no.11
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• pp.1063-1068
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• 2002

Polyimide/silica(PI/silica) hybrid materials having physical or chemical bonds between the PI and silica network were prepared using sol-gel process through hydrolysis and polycondensation of tetraethoxysilane with the polyamic Acid(PAA) or end-capped PAA solution. PAA solution was synthesized by ring opening reaction of pyromellitic dianhydride and oxydianiline monomers in dimethyl acetamide solution. End-capped PAA solution was synthesized by the addition of 3-aminopropyltriethoxysilane in PAA solution. PI/silica hybrid samples were characterized by infrared spectroscopy, differential thermogravimetry, X-ray diffractometry, scanning electron microscopy, and tensile tester. It has been demonstrated that the properties of hybrid samples were affected by the silica content and the bond type between PI and silica.

• Textile Coloration and Finishing
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• v.35 no.4
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• pp.221-230
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• 2023

Meta-aramid and polyamic acid were separated and the manufactured films were analyzed for their integration and logarithmic properties. The miscibility of meta-aramid and polyamic acid was analyzed by Fourier transform infrared spectroscopy and scanning electron microscopy. Using calorimetric analysis and differential scanning calorimetry, the storage of meta-aramid and polyamic acid, indicated on the right side of the column, was analyzed. It was confirmed that the initial thermal resistance occurs because the polyamic acid is accounted for in the meta-aramid, and the glass transition temperature and persistence phenomenon are explained.

• Journal of Environmental Science International
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• v.12 no.4
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• pp.481-485
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• 2003

Two types of polyimide/silica composite films were prepared using sol-gel method through hydrolysis and polycondensation of tetraethoxysilane (TEOS) with the polyamic acid (PAA) and end-capped PAA solution. Samples were characterized by the means of differential thermogravimetry, X-ray diffractometry, scanning electron microscopy, universal test, impedance analyzer, chemical resistance test, etc. All of the PAA/silanol solutions heat-treated at 300$^{\circ}C$ for 6h were transformed to polyimide/silica composites. It has been demonstrated that the properties of polyimide/silica composites were affected by the amount of silica addition and the bend type existed between polyimide and silica.

• The Transactions of the Korean Institute of Electrical Engineers
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• v.45 no.3
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• pp.380-385
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• 1996

Thin films of polyamic acid(PAA) were fabricated by vapor deposition polymerization(VDP) from pyromellitic dianhydride(PMDA) and 4,4'-diamino diphenyl ether(DDE). Thin films of polyimide(PI) were obtained by curing PAA, and their dielectric properties have been measured. The uniform thin films of PI formed by curing PAA at 300 .deg. C for 1 hr. which was confirmed by Fourier transform Infrared spectroscopy(FT-IR) absorption at 720, 1380, 1780c $m_{-1}$. Relative permittivity and tan .delta. were 3.9 and 0.008 at 10kHz, respectively. (author). 8 refs., 11 figs., 1 tab.1 tab.

• Elastomers and Composites
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• v.42 no.3
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• pp.177-185
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• 2007

Polyamic acid(PAA)/organoclay nanocomposites containing phosphorous were prepared by solution blending of phosphorylated PAA(PPAA) and organically modified montmorillonite(O-MMT) as a type of layered clays. The nanocomposites were characterized by FT-IR, DSC, TGA, PCFC, SEM, and XRD. The preparation of nanocomposites was confirmed by FT-IR and XRD. SEM pictures showed that the organoclay was dispersed well in the PAA matrix relatively. XRD results indicated that the O-MMT layers were intercalated. The thermal stability and flame retardancy of O-MMT/PPAA nanocomposites were higher than those of pure PAA. PCFC results also showed that the heat release capacity and total heat release values of O-MMT 4 wt%/PPAA-0.2, 0.4, 0.6 composites were decreased with increasing the mole ratio of phosphorous. It was found that the nanocomposite films had the potential to be used as a fire safe material.

• Journal of the Korean Applied Science and Technology
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• v.17 no.4
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• pp.226-232
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• 2000

Polyimide is a well-known organic dielectric material, which has not only high chemical and thermal stability but also good electrical insulating and mechanical properties. In this research, we have synthesized a polyamic acid(PAA), which is a precursor of the polyimide. To obtain the optimum conditions of polyamic acid alkylamine salt(PAAS) Langmuir-Blodgett(LB) film deposition, the ${\pi}-A$ isotherms were examined by varying subphase temperature, barrier moving speed and spreading amount of solution. Film formation was verified by measuring transfer ratio, absorption of UV/vis spectra and scanning electron microscope(SEM) images.

• Membrane Journal
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• v.3 no.2
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• pp.60-69
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• 1993

The polyamic acid (PAA) based on 3,3', 4,4'-benzophenonetetracarboxylic dianhydride(BTDA)-3,3', 4,4'-dipheylsulfonetetracarboxylic dianhydride(BAPP), 2,2-bis(4-[4-aminophenoxyl]phenyl) propane(DSDA)-3,3', 4,4'-dipheylsulfonetetracarboxylic dianhydride(BAPP), and 3,3',4,4'-benzophenonetetracarboxylic dianhydride(BTDA)-4,4'-oxydianiline(4,4'-ODA) was synthesised. The casted PAA films were partially imidised and the permeation properties of these PAA films for $O_2$ and $N_2$ were investigated according to the degree of imidisation. When the degree of imidisation was increased by curing, the permeabilities of the PAA films were increased for a while and then decreased. These results show that the increase of gas permeation by the disappearence of strong hydrogen bond is larger than the decrease of gas permeation by the dense effect. The decrease of hydrogen bond between molecular chains of PAA suddenly increases the vibration of the chain to make holes but the compaction in polymer chain gradually decreases the gas permeation. The largest values of permeability of BTDA-BAPP, DSDA-BAPP and BTDA-4,4'-ODA film was 8.3, 0.3 and 0.8 barrer respectively, and the imidisation content corresponding to the values of the largest permeability was 37, 47 and 55% each. But the permselctivities of the PAA films were not changed by the variation of the degree of imidisation.

• Polymer(Korea)
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• v.25 no.2
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• pp.254-262
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• 2001

Epoxy resin based upon the N,N'-diglycidylaniline which is widely used in optic, electronic and composite material. We modified this epoxy resin with poly(amic acid) (PAA) that is a precursor of polyimide. To improve the mechanical property we controlled PAA content and imidization ratio. PI-modified epoxy blends were prepared for the formation of IPN structure. The possible reaction in the epoxy resin/PAA blends were investigated by FT-IR and inherent viscosity techniques. Thermal properties are measured by TGA, DSC, and TMA. Mechanical properties are measured by UTM and impact test machine. Morphology is investigated by SEM. Thermal stability improved with increasing the content of PAA in blends. As the content of PAA increases in blend, the glass transition temperature and thermal expansion coefficient decreases. Increasing impact strengths in J/m in the range of 920∼2412 were observed in blends. The PAA segment may act as a toughening agent in the epoxy networks, thus contributing the impact strength improvement of the blends.