대한전기학회논문지 (The Transactions of the Korean Institute of Electrical Engineers)
- 제45권3호
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- Pages.380-385
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- 1996
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- 0254-4172(pISSN)
진공증착중합에 의한 Polyimide 박막의 제조와 유전특성
Preparation and dielectric properties of polyimide thin films by vapor deposition polymerization method
초록
Thin films of polyamic acid(PAA) were fabricated by vapor deposition polymerization(VDP) from pyromellitic dianhydride(PMDA) and 4,4'-diamino diphenyl ether(DDE). Thin films of polyimide(PI) were obtained by curing PAA, and their dielectric properties have been measured. The uniform thin films of PI formed by curing PAA at 300 .deg. C for 1 hr. which was confirmed by Fourier transform Infrared spectroscopy(FT-IR) absorption at 720, 1380, 1780c
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