• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.1277-1278
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• 2008

Pentacene 박막 트랜지스터의 소스/드레인 전극을 폴리머인 Poly(3,4-ethylene dioxythiophene) poly(styrenesulfonate) (PEDOT:PSS)를 사용하여 잉크젯 프린팅 방법으로 제작하였다. 펜타신 박막 트랜지스터는 열 증착법을 사용하여 폴리며 기판위에 100nm의 두께로 증착하였다. 게이트 절연막은 $SiO_2$ 위에 Polymethly Methacrylate (PMMA)를 증착시킨 double layer를 사용하였다. PMMA 위에 증착시킨 pentacene 결정립이 $SiO_2$ 위에 증착한 pentacene 결정립 보다 크게 성장하였고, double layer의 절연막을 씀으로 인해 게이트 누설 전류가 감소함을 보였다. Pentacene 증착 온도에 따른 결정립 크기를 비교하여 가장 적절한 온도를 찾았다. 프린팅 방법을 사용하여 만든 박막 트랜지스터는 전계효과 이동도가 ${\mu}_{FET}=0.023cm^2/Vs$ 이고, 문턱이전 기울기 S.S=0.49V/dec, 문턱전압 $V_{th}=-18V$, $I_{on}/I_{off}$ 전류비 >$10^3$의 전기적 특성을 보였다.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.05a
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• pp.76-79
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• 2005

$Nd:YVO_4$ 연속발진 레이저(CW laser:Continuous wave laser)로 제작한 다결정 실리콘 박막의 이온도핑 효과를 조사하였다. PECVD로 증착한 비정질 실리콘 박막을 CW 레이저를 조사하여 결정화한 후 $B_2H_6$ 플라즈마 이온 도즈량을 변화시켜 이온 도핑을 하고 급속열처리 방법과 퍼니스 어닐링 방법으로 도펀트 활성화를 하였다. 이온 도핑된 CW 다결정 실리콘 박막의 이온 도즈량에 따른 판저항 변화를 비교하고, 급속열처리(RTA: Rapid Thermal Annealing)와 퍼니스 어닐링(FA: Furnace Annealing) 전후의 결정성 변화를 라만 스펙트럼(Raman spectrum) 을 통하여 분석하였다. 이온 도즈량이 증가함에 따라 판저항은 감소하고, 어닐링 후 이온 도핑에 의해 손상된 박막이 복원됨을 확인 할 수 있다.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1279-1282
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• 2006

An ultra low-power down-conversion level shifter using low temperature poly-crystalline silicon thin film transistors is proposed for mobile applications. The simulation result shows that the power consumption of the proposed circuits is only 17% and the propagation delay is 48% of those of the conventional cross-coupled level shifter without additional area. And the measured power consumption is only 21% of that of the crosscoupled level shifter.

• 한국정보디스플레이학회:학술대회논문집
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• 2003.07a
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• pp.683-685
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• 2003

We report on a surface planarization process that produces more planar surface than previous sequential lateral solidification crystallized poly silicon films. By applying the single shot laser irradiation with optimum energy density ($(817mJ/cm^{2})$ on the ridge area after SLS crystallization, the ridge height can be decreased.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.2
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• pp.13-20
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• 2008

This paper describes the methods of spacer-fabrication for wafer-level CIS(CMOS Image Sensor) assembly. We propose three methods using SU-8, PDMS and Si-interposer for the spacer-fabrication. For SU-8 spacer, novel wafer rotating system is developed and for PDMS(poly-dimethyl siloxane) spacer, new fabrication-method is used to bond with alignment of glass/PDMS/glass structure. And for Si-interposer, DFR(Dry Film Resist) is used as adhesive layer. The spacer using Si-interposer has the strongest bonding strength and the strength is 32.3MPa with shear.

• 정보저장시스템학회:학술대회논문집
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• 2005.10a
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• pp.22-25
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• 2005

In this research, a wafar-level transfer method of cantilever array on a conventional CMOS circuit has been developed for high density probe-based data storage. The transferred cantilevers were silicon nitride ($Si_3N_4$) cantilevers integrated with poly silicon heaters and piezoelectric sensors, called thermo-piezoelectric $Si_3N_4$ cantilevers. In this process, we did not use a SOI wafer but a conventional p-type wafer for the fabrication of the thermo-piezoelectric $Si_3N_4$ cantilever arrays. Furthermore, we have developed a very simple transfer process, requiring only one step of cantilever transfer process for the integration of the CMOS wafer and cantilevers. Using this process, we have fabricated a single thermo-piezoelectric $Si_3N_4$ cantilever, and recorded 65nm data bits on a PMMA film and confirmed a charge signal at 5nm of cantilever deflection. And we have successfully applied this method to transfer 34 by 34 thermo-piezoelectric $Si_3N_4$ cantilever arrays on a CMOS wafer. We obtained reading signals from one of the cantilevers.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.11a
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• pp.252-252
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• 2009

In this work, the nanocrystalline ZnO/polycrystalline (poly) aluminum nitride (AlN)/Si structure was fabricated for humidity sensor applications based on surface acoustic wave (SAW). In this structure, the ZnO film was used as sensing material layer. These ZnO and AlN(0002) were deposited by so-gel process and a pulse reactive magnetron sputtering, respectively. These experimental results showed that the obtained SAW velocity on AlN film was about 5128 m/s at $h/\lambda$=0.0125 (h and $\lambda$ is thickness and wavelength, respectively). For ZnO sensing layers coated on AlN, films have hexagonal wurtzite structure and nanometer particle size. The crystalline size of ZnO films annealed at 400, 500, and 600 $^{\circ}C$ is 10.2, 29.1, and 38 nm, respectively. Surface of the film exhibits spongy which can adsorb steam in the air. The best quality of the ZnO film was obtained with annealing temperature at 500 $^{\circ}Cis$. The change in frequency response (127.9~127.85 MHz) of the SAW humidity sensor based on ZnO/AlN structure was measured along the change in humidity (41~69%). The structural properties of thin films wereinvestigated by XRD and SEM.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.339.1-339.1
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• 2014

In this paper we studied the application of inter-poly dielectric as silicon dioxide-like film was deposited by the higher energy assisting deposition (HEAD) process the modified CCP process, which enables low temperature (LT) process and improving film density. In these experiments the relative hydrogen concentration of $SiO_2$-like films deposited on silicon substrate were analyzed by the secondary ion mass spectroscopy (SIMS) and it was shown that our lower hydrogenated oxide (LHO) film prepared by HEAD process with the precursor contained the siloxane species had lower hydrogen concentration, $8{\times}10{\cdot}^{22}cm{\cdot}^3$ than that of the commercial undoped silicon glass (USG) film ($1{\times}10{\cdot}^{21}cm{\cdot}^3$) prepared by the high density plasma-chemical vapor deposition (HDP-CVD). We consider that the LHO film deposited by HEAD process used as high performance material into Flash memory devices.

• Polymer(Korea)
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• v.36 no.5
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• pp.662-667
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• 2012

Poly(ethylene terephthalate) (PET) base films with high light transmittance have been used for the substrate of various functional films in the flat panel display. The effects of the reflective index of coated films, the roughness of the film surface and the content of inorganic silica particles on the light transmittance were studied in this article. Light transmittance was increased by coating a water soluble resin with a low reflective index at an optimum thickness. The roughness of the film did not affect light transmittance when the Ra of the film surface was less than a quarter of the wavelength of incident light. Inorganic silica particles decreased light transmittance due to their absorbance and scattering of the incident light.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.470-470
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• 2013

Recently, active materials such as amorphous silicon (a-Si), poly crystalline silicon (poly-Si), transition metal oxide semiconductors (TMO), and organic semiconductors have been demonstrated for flexible electronics. In order to apply flexible devices on the polymer substrates, all layers should require the characteristic of flexibility as well as the low temperature process. Especially, pentacene thin film transistors (TFTs) have been investigated for probable use in low-cost, large-area, flexible electronic applications such as radio frequency identification (RFID) tags, smart cards, display backplane driver circuits, and sensors. Since pentacene TFTs were studied, their electrical characteristics with varying single variable such as strain, humidity, and temperature have been reported by various groups, which must preferentially be performed in the flexible electronics. For example, the channel mobility of pentacene organic TFTs mainly led to change in device performance under mechanical deformation. While some electrical characteristics like carrier mobility and concentration of organic TFTs were significantly changed at the different temperature. However, there is no study concerning multivariable. Devices actually worked in many different kinds of the environment such as thermal, light, mechanical bending, humidity and various gases. For commercialization, not fewer than two variables of mechanism analysis have to be investigated. Analyzing the phenomenon of shifted characteristics under the change of multivariable may be able to be the importance with developing improved dielectric and encapsulation layer materials. In this study, we have fabricated flexible pentacene TFTs on polymer substrates and observed electrical characteristics of pentacene TFTs exposed to tensile and compressive strains at the different values of temperature like room temperature (RT), 40, 50, $60^{\circ}C$. Effects of bending and heating on the device performance of pentacene TFT will be discussed in detail.