• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.127-136
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• 2006

Metallic sandwich plates with inner dimpled shell subject to 3-point bending have been analyzed and then optimized for minimum weight. Inner dimpled shells can be easily fabricated by press or roll with high precision and bonded with same material skin sheets by resistance welding or adhesive bonding. Metallic sandwich plates with inner dimpled shell structure can be optimally designed for minimum weight subject to prescribed combination of bending and transverse shear loads. Fundamental findings for lightweight design are presented through constrained optimization. Failure responses of sandwich plates are predicted and formulated with an assumption of narrow sandwich beam theory. Failure is attributed to four kinds of mechanisms: face yielding, face buckling, dimple buckling and dimple collapse. Optimized shape of inner dimpled shell structure is a hemispherical shell to minimize weight without failure. It is demonstrated that bending stiffness of sandwich plate is 2 or 3 times larger than solid plates with the same strength. Failure mode boundaries and iso-strength lines dependent upon the geometry and yield strain of the material are plotted with respect to geometric parameters on the failure map. Because optimal parameters of maximum strength for given material weight can be selected from the map, analytic solutions for maximum strength are expressed as a function of only material property and proposed strength. These optimal parameters match well with numerical optimal parameters.

• Macromolecular Research
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• v.13 no.5
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• pp.385-390
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• 2005

The electrospinning process is a fascinating method to fabricate small nanosized fibers of diameter several hundred nanometers. Surfactant-polymer solutions were prepared by adding poly(vinyl alcohol) (PVOH) to distilled water with cationic, anionic, amphoteric, and non-ionic surfactants. Average diameter of the electrospun PVOH fibers prepared from PVOH solution was over 300 nm, and was decreased to 150 nm for the mixture of PVOH/amphoteric surfactant. To explain the formation of ultra fine fiber, the characteristic properties in a mixture of PVOH/surfactant such as surface tension, viscosity, and conductivity were determined. In this paper, the effect of interactions between polymers with different classes of surfactants on the morphological and mechanical properties of electrospun PVOH nonwoven mats was broadly investigated.

• Composites Research
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• v.25 no.6
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• pp.172-177
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• 2012

For the manufacture of low resistance Si-SiC composite, the properties of reaction sintering in the green body of various mixed ${\alpha}$-SiC powder size with the various carbon contents from 0wt% to 20wt% were investigated. The samples preparation was green body by CIP method under this condition, molten silicon infiltration process was conducted to reaction bonded silicon carbide. the results of sintered density, 3-point bending strength and resistance of analysis showed that varied carbon and silicon melt reacted to convert to fine ${\beta}$-SiC particle and the structure was changed to dense material. The amount of fine ${\beta}$-SiC particle was gradually increased as carbon content increase. According to mixed composite, it's mechanical and specific resistivity properties was strongly influenced by carbon content within 10wt% more then carbon content 10wt% was strongly influenced by phase transition.

• Korean Chemical Engineering Research
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• v.45 no.5
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• pp.466-472
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• 2007

A technology platform for wafer-level three-dimensional integration circuits (3D-ICs) is presented, and that uses wafer bonding with low-k polymeric adhesives and Cu damascene inter-wafer interconnects. In this work, one of such technical platforms is explained and characterized using a test vehicle of inter-wafer 3D via-chain structures. Electrical and mechanical characterizations of the structure are performed using continuously connected 3D via-chains. Evaluation results of the wafer bonding, which is a necessary process for stacking the wafers and uses low-k dielectrics as polymeric adhesive, are also presented through the wafer bonding between a glass wafer and a silicon wafer. After wafer bonding, three evaluations are conducted; (1) the fraction of bonded area is measured through the optical inspection, (2) the qualitative bond strength test to inspect the separation of the bonded wafers is taken by a razor blade, and (3) the quantitative bond strength is measured by a four point bending. To date, benzocyclobutene (BCB), $Flare^{TM}$, methylsilsesquioxane (MSSQ) and parylene-N were considered as bonding adhesives. Of the candidates, BCB and $Flare^{TM}$ were determined as adhesives after screening tests. By comparing BCB and $Flare^{TM}$, it was deduced that BCB is better as a baseline adhesive. It was because although wafer pairs bonded using $Flare^{TM}$ has a higher bond strength than those using BCB, wafer pairs bonded using BCB is still higher than that at the interface between Cu and porous low-k interlevel dielectrics (ILD), indicating almost 100% of bonded area routinely.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.102-102
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• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• KSCE Journal of Civil and Environmental Engineering Research
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• v.32 no.4A
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• pp.245-253
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• 2012

In the longway tunnel and underground traffic road, the structure of transverse ventilation system is constructed by the airpit slab. In this study, the full scale specimens of the PSC airpit slab that attached fire resistance panel are performed the static and dynamic loading tests for evaluation of bending capacity. The first of all, it confirmed the evaluations about the fundamental efficiency of the fire resistance panel and PSC slab by the 3-point bending test and pull-off test. The tests are performed for evaluation of the bending resistance under ultimate static load and the bonded capacity under dynamic fatigue load. A fatigue test is performed for an investigation of the effect on wind pressure that is developed by transit of traffic. The damage or debonding on surface between fire resistance panel and PSC slab was not developed in dynamic fatigue load test, also the behavior of the specimens is very stable and the debonding of the fire resistance panel attached at the bottom surface of PSC slab was not developed in static load test, too. Therefore, the crack or debonding of the fire resistance panel will be not developed by external loads during the construction or completion of the precast fire resistance system.

• Bulletin of the Korean Chemical Society
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• v.32 no.12
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• pp.4185-4190
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• 2011

The nucleophilic substitution reactions of ethylene phosphorochloridate (1c) with substituted anilines ($XC_6H_4NH_2$) and deuterated anilines ($XC_6H_4ND_2$) are investigated kinetically in acetonitrile at $5.0^{\circ}C$. The anilinolysis rate of 1c involving a cyclic five-membered ring is four thousand times faster than its acyclic counterpart (1a: diethyl chlorophosphate) because of great positive value of the entropy of activation of 1c (${\Delta}S^{\neq}=+30\;cal\;mol^{-1}K^{-1}$ compared to negative value of 1a (${\Delta}S^{\neq}=-45\;cal\;mol^{-1}K^{-1}$) over considerably unfavorable enthalpy of activation of 1c (${\Delta}H^{\neq}=27.7\;kcal\;mol^{-1}$) compared to 1a (${\Delta}H^{\neq}=8.3\;kcal\;mol^{-1}$). Great enthalpy and positive entropy of activation are ascribed to sterically congested transition state (TS) and solvent structure breaking in the TS. The free energy correlations exhibit biphasic concave upwards for substituent X variations in the X-anilines with a break point at X = 3-Me. The deuterium kinetic isotope effects are secondary inverse ($k_H/k_D$ < 1) with the strongly basic anilines and primary normal ($k_H/k_D$ > 1) with the weakly basic anilines and rationalized by the TS variation from a dominant backside attack to a dominant frontside attack, respectively. A concerted $S_N2$ mechanism is proposed and the primary normal deuterium kinetic isotope effects are substantiated by a hydrogen bonded, four-center-type TS.

• Journal of the Korea institute for structural maintenance and inspection
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• v.22 no.6
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• pp.30-36
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• 2018

Researches on strengthening and rehabilitation are important since structural capacity is degraded by deterioration or damage of structural members. An effective strengthening scheme such as an externally bonded Carbon Fiber Reinforced Polymers (CFRP) can improve the structural performance of a concrete structure in a cost-effective way. Therefore, many experimental studies on strengthening methods have been widely carried out. In regards to the shear strengthening of a concrete beam, variables of the experimental studies were the amount of CFRP, the angle of the strip, the width of the strip, and the interaction between the materials. However, there are insufficient researches on bi-directional CFRP layout compared to the previous researches. In this study, a total of ten concrete beams were designed and tested to evaluate the shear strengthening effect using CFRP strips. The effectiveness of strengthening was investigated based on the shear contribution of materials, strain distribution of stirrup, and the maximum shear capacity of specimens.

• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.619-625
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• 2008

The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.