• Journal of Surface Science and Engineering
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• v.37 no.2
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• pp.92-98
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• 2004

The current efficiency and the microstructure of the trivalent Cr deposits plated in flow cell system were investigated according to additives in sulfate bath and current density. The current efficiency of the deposits plated in the formic acid complexed bath was noticeably higher than that of the deposits from glycine complexed bath. The current efficiency of the deposits from the complexed baths with boric acid buffer increased linearly with current density in the range of 60-100 A/dm$^2$, while that of the deposits from the baths with both Al sulfate and mixed buffers increased parabolically with current density. The nodular crystallite size of the deposits increased with current density, and the deposits plated in low current density region had relatively smooth surface appearance with fine grains. The structure of the deposits from the complexed baths with boric acid buffer changed from amorphous structure to crystalline one with strong (110)peak with increasing current density. The deposits from the baths with both Al sulfate and mixed buffers had generally amorphous structure.

• Journal of Surface Science and Engineering
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• v.48 no.4
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• pp.149-157
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• 2015

We investigated the effects of the fabric structure or the kinds of plated metals on the electromagnetic interference shielding effectiveness (EMI SE) by means of electroless plating on polyester fabric. We found that the weight of deposited metal, EMI SE, and flexibility of the conductive fabric for EMI shield is affected by morphology of fabric and structure of fiber. The EMI SE of conductive fabric plated Ni/Cu/Ni by electroless plating method on draw textured yarn (DTY) polyester was in the practically useful range of above 70 dB over a wide frequency range of 10 MHz to 1.0 GHz at the surface resistivity of $0.05{\Omega}/{\square}$. Au or Ag plated conductive fabric by immersion plating method is not able to provide for a good EMI SE.

• Computational Structural Engineering
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• v.2 no.2
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• pp.101-112
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• 1989

Development of a procedure for improved modeling of orthogonally stiffened plated grillages is the primary subject of this paper. In the method developed here a modified static condensation procedure is used to get a complete 2-dimensional grillage which represents the stiffness of the original orthogonally stiffened plated structure. The theory and numerical model are applied to a typical structure and the method has been demonstrated to work well for the analysis of orthogonally stiffened plate structures.

• Journal of Powder Materials
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• v.22 no.3
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• pp.169-174
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• 2015

The optical film for light luminance improvement of BLU that is used in LCD/LED and retro-reflective film is used as luminous sign consist of square and triangular pyramid structure pattern based on V-shape micro prism pattern. In this study, we analyzed machining characteristics of Cu-plated flat mold by shaping with diamond tool. First, cutting conditions were optimizing as V-groove machining for the experiment of micro prism structure mold machining with prism pattern shape, cutting force and roughness. Second, the micro prism structure such as square and triangular pyramid pattern were machined by cross machining method with optimizing cutting conditions. Burr and chip shape were discussed with material properties and machining method.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1999.05a
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• pp.92-93
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• 1999

• Journal of Conservation Science
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• v.27 no.1
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• pp.41-47
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• 2011

If the nondestructive analysis is carried out by using an X-ray Fluorescence Analyzer(XRF) for ingredient analysis with the target of gold plated silverware that plates gold on a silver basis, a singular point showing big difference at the value of weight percent(wt.%) according to the electron orbit of the principal ingredient can be confirmed. The present research made reproduced samples and carried out comparative analysis in order to suggest a basis that can judge whether the technique of gold plated silverware was used in case of remains uneasy to understand with eyes by using this singular point. As a result, the same result as analysis results of actual remains could be seen in specimens manufactured by a mercury amalgam plating method. However, in case of gold and silver alloy specimens, it could be confirmed that the difference according to the electron orbit of the principal ingredients is slight unlike plated specimens. The reason appearing at plated specimens seems to be generated while absorbing XRF beam at plated layers by double structure due to plating instead of single material. Accordingly, if this result appearing at nondestructive analysis is used, it was confirmed that the application of the technique of gold plated silverware can be judged without observing its section.

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.91.2-91.2
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• 2010

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. The better performance of Ni/Cu contacts is attributed to the reduced series resistance due to better contact conductivity of Ni with Si and subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading combined with the lower resistance of a metal silicide contact and improved conductivity of plated deposit. This improves the FF as the series resistance is deduced. This is very much required in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. This paper using selective emitter structure technique, fabricated Ni/Cu plating metallization cell with a cell efficiency of 17.19%.

• The korean journal of orthodontics
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• v.25 no.1 s.48
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• pp.43-54
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• 1995

This study was conducted to examine the metal release of TiN-plated stainless steel orthodontic appliances by constructing the simulated orthodontic appliances equivalent to maxillary half arch, by dividing into TiN-plated and TiN-nonplated Bloops and by dividing again these groups into welded and nonwelded groups. And then, the total quantity of metal release was obtained by measuring the amounts of both soluble and precipitated nickel and chromium after immersing in artificial saliva for 15 days. And then, the corrosion appearance of surface structure was observed by using SEM. The results of this study were summarized as follows. 1. The total amounts of released nickel and chromium showed that the TiN-plated group after welding(Group 1) was 25.46 ${\mu}g$, respectively, and 17.4 ${\mu}g$, while the TiN-nonplated group after welding(Group III) was 54.69 ${\mu}g$, respectively, and 85.27 ${\mu}g$. Then, the TiN-Plated group indicated less amounts of metal release(p<0.05). 2. The total amounts of the TiN-plated group without welding(Group II) was 0.05${\mu}g$ and 0.34${\mu}g$, respectively. Then, it was shown that the TiN-plated group without welding(Group II) indicated less metal release than that of the TiN-Plated group after welding(Group I)(p<0.01, p<0.05). 3. When observing their surface structure, there were a lot of precipitate and pitting corrosion in the groups with welding(Group I & III), when the TiN-plated group(Group I) showed lower level than the TiN-nonplated group(Group IIII). On the other hand, the groups without welding(Group II & IV) indicated a little of pitting corrosion. 4. In case of observation with the naked eyes, it was shown that there were significant disco1oration and corrosion in the groups with welding(Group I & III), while there was no any remarkable change in the groups without welding(Group II & IV).

• Korean Journal of Materials Research
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• v.19 no.11
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• pp.625-630
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• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.12
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• pp.55-67
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• 2010

The electrical properties of a back drilled via-hole (BDH) without the open-stub and the plated through via-hole (PTH) with the open-stub, which is called the conventional structure, in a high-count multi~layered (HCML) printed circuit board (PCB) were investigated for a high-speed digital system, and a selected inner layer to transmit a high-speed signal was farthest away from the side to mount the component. Within 10 GHz of the broadband frequency, a design of experiment (DOE) methodology was carried out with three cause factors of each via-hole structure, which were the distance between the via-holes, the dimensions of drilling pad and the anti-pad in the ground plane, and then the relation between cause and result factors which were the maximum return loss, the half-power frequency, and the minimum insertion loss was analyzed. Subsequently, the empirical formulae resulting in a macro model were extracted and compared with the experiment results. Even, out of the cause range, the calculated results obtained from the macro model can be also matched with the measured results within 5 % of the error.