• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.65-70
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• 2006

Carbon nanotubes (CNT) grown by chemical vapor deposition (CVD) and plasma enhanced chemical vapor deposition (PECVD), and followed by annealing at $400{\sim}500^{\circ}C$ were investigated for gas sensing under 1.5ppm $NO_{2}$ concentration at an operating temperature of $200^{\circ}C$. The electrical resistance of CNT sensor decreased with temperature, indicating a semiconductor type. The resistance of CNT sensor decreased with $NO_{2}$ adsorption. It was found that the sensitivity of sensor was affected by humidity and decreased under microwave irradiation for 3 minutes. The CNT sensor grown by PECVD had a higher sensitivity than that of CVD.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.461-461
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• 2010

For a low dielectric constant inter-metal dielectric application, the low-k SiCOH film with a dielectric constant of 2.8-3.2 has been deposited by plasma-enhanced chemical vapor deposition with decamethylcyclopentasiloxane, cyclohexane, and helium which is carrier gas. In this work, we investigated chemical deposition rate, dielectric constant, characterization of plasma polymer films according to temperature(25C-200C) of substrate and change of component concentration. We measured impedance by using V-I prove during process. From experimental result, deposition rate decrease with increasing temperature. Through real time impedance analysis of chamber, we find corelation between film thickness and impedance by assuming equivalent circuit.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.90.2-90.2
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• 2012

Graphene has recently attracted significant attention because of its unique optical and electrical properties. For practical device applications, special attention has to be paid to the synthesis of high-quality graphene on large-area substrates. Graphene has been synthesized by eloborated mechanical exfoliation of highly oriented pyrolytic graphite, chemical reduction of exfoliated grahene oxide, thermal decomposition of silicon carbide, and chemical vapor deposition (CVD) on Ni or Cu substrates. Among these techniques, CVD is superior to the others from the perspective of technological applications because of its possibility to produce a large size graphene. PECVD has been demonstrated to be successful in synthesizing various carbon nanostructures, such as carbon nanotubes and nanosheets. Compared with thermal CVD, PECVD possesses a unique advantage of additional high-density reactive gas atoms and radicals, facilitating low-temperature, rapid, and controllable synthesis. In the current study, we report results in synthesizing of high-quality graphene films on a Ni films at low temperature. Controllable synthesis of quality graphene on Cu foil through inductively-coupled plasma CVD (ICPCVD), in which the surface chemistry is significantly different from that of conventional thermal CVD, was also discussed.

• Journal of the Korean Society for Heat Treatment
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• v.4 no.4
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• pp.1-14
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• 1991

In PECVD(Plasma-Enhanced Chemical Vapor Deposition) process, titanium nitride is thin and its adhesion is poor for the protective coatings. Therefore it has been studied that intermediate layer forms between substrate and TiN thin film. Using R.F. plasma nitriding, nitride layer was first formed, then TiN thin film coated by PECVD. The chemical composition of the coatings has been characterized using AES, EDS and their crystallographic structure by means of XRD. Mechanical properties such as microhardness and film adhesion have also been determined by vickers hardness test, scratch test and indentation test. As a result, there was no difference in chemical composition and structure between the TiN deposition only and the composite of TiN deposition on nitrided steel. It was found that nitrided substrate increased the hardness of TiN coatings and was beneficial in preventing the plastic deformation in the substrate. Therefore the effective load bearing capacity of the TiN coatings on nitrided steel was increased and their adhesion was improved as well. According to the results of this study, the processes that lead to the formation of composite layers characterized by good working properties, i.e., high microhardness, adhesion and resistance to deformation.

• Journal of Korean Vacuum Science & Technology
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• v.7 no.2
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• pp.33-38
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• 2003

Fluorinated amorphous carbon thin films (a-C:F) for the use of low dielectric constant intermetallic layer dielectrics are deposited by plasma enhanced chemical vapor deposition with $C_4$F$_{8}$ and Si$_2$H$_{6}$/He gas mixture as precursors. To characterize and improve film properties, we changed various conditions such as deposition temperature, and RF power, and we measured the thickness and refractive indexes and FT-IR spectrum before and after annealing. At low temperatures the film properties were very poor although the growth rate was very high. On the other hand, the growth rate was low at high temperature. The growth rate increased in accordance with the deposition pressure. The dielectric constants of samples were in the range of 1.5∼5.5∼5.

• Journal of the Korean Ceramic Society
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• v.31 no.2
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• pp.206-212
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• 1994

Effects of the film deposition process parameters on the properties such as deposition rate, etch rate, refractive index, stress and step coverage of plasma enhanced chemical vapor deposited (PECVD) tetraethylorthosilicate glass (TEOS) SiO2 film were investigated and analysed using SEM, FTIR and SIMS techniques. Increasing TEOS flow or decreasing O2 flow increased the deposition rate and the compressive stress of the oxide film but produced a less denser film. The deposition rate decreased owing to the decrease in the sticking coefficient of the TEOS and the O2 molecules onto the substrate Si with increasing the substrate temperature. Increasing the substrate temperature produced a denser film with a lower etch rate and the higher refractive index by lowering SiOH and moisture contents. Increasing the rf power increases the ion bombardment energy. This increase in energy, in turn, increases the deposition rate and tends to make the film denser. No appreciable changes were found in the deposition rate but the refractive index and the stress of the film decreased with increasing the deposition pressure. The carbon content in the plasma TEOS CVD oxide film prepared under our standard deposition conditions were very low according to the SIMS analysis results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.11a
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• pp.250-251
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• 2005

Tin dioxide (SnO$_2$) thin films have been prepared on Si wafer (100) by Plasma Enhanced Chemical Vapor Deposition (PECVD). SnO$_2$ thin films were prepared from mixtures of dibutyltin diacetate as a precursor, oxygen as an oxidant at 275, 325, 375, 425$^{\circ}C$, respectively. The microstructure of deposited films was characterized by X-ray diffraction and field emission scanning electron microscopy. Structural characteristics of prepared SnO$_2$ thin films were investigated with different substrate temperature. The deposition rate was linearly increased with substrate temperature. Surface morphology and uniformity of prepared thin film was excellent at 375$^{\circ}C$ and grain size was averagely 25nm.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.59-61
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• 2002

In this study we attempted to diagnose the distribution of nitrogen plasma density generated using PECVD(plasma enhanced chemical vapor deposition). The distribution of plasma density formed in a PECVD chamber were measured by DLP2000. The experiment results showed that the plasma density is related to RF power and gas flow rate. As RF power gets higher, the plasma density linearly increased. And the experimental results revealed that a pressure in chamber affects plasma density.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.7
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• pp.618-623
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• 2006

Hydrogenated Diamond-like carbon (DLC) films were prepared by the radio frequency plasma enhanced chemical vapor deposition (RF PECVD) method on silicon substrates using methane $(CH_4)$ and hydrogen $(H_2)$ gas. The wear track on the DLC films was examined after the ball-on disk (BOD) measurement with a Raman mapping method. The BOD measurement of the DLC films was performed for 1 to 3 hours with a 1-hour step time. The sliding traces on the hydrogenated DLC film after the BOD measurement were also observed using an optical microscope. The surface roughness and cross-sectional images of the wear track were obtained using an atomic force microscope (AFM). The novel Raman mapping method effectively shows the graphitization of DLC films of $300{\mu}m\times300{\mu}m$ area according to the sliding time by G-peak positions (intensities) and $I_D/I_G$ ratios.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.8
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• pp.701-706
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• 2006

In addition to its similarity to genuine diamond film, diamond-like carbon (DLC) film has many advantages, including its wide band gap and variable refractive index. In this study, DLC films were prepared by the RF PECVD (Plasma Enhanced Chemical Vapor Deposition) method on silicon substrates using methane $(CH_4)$ and hydrogen $(H_2)$ gas. We examined the effects of the post annealing temperature on the structural variation of the DLC films. The films were annealed at temperatures ranging from 300 to $900^{\circ}C$ in steps of $200^{\circ}C$ using RTA equipment in nitrogen ambient. The thickness of the film and interface between film and substrate were observed by surface profiler, field emission scanning electron microscopy (FESEM), high resolution transmission electron microscopy (HRTEM), respectively. Raman and X-ray photoelectron spectroscopy (XPS) analysis showed that DLC films were graphitized ($I_D/I_G$, G-peak position and $sp^2/sp^3$ increased) ratio at higher annealing temperature. The variation of surface as a function of annealing treatment was verified by a AFM and contact angle method.