• Journal of the Korean Chemical Society
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• v.41 no.6
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• pp.292-298
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• 1997

An ICP(Inductively Coupled Plasma) emission spectrometer was developed with an axially viewed ICP source incorporated by a 5-turned induction coil and a torch, outer quartz tube of which was 50 mm longer than that used in conventional ICP/AES(Inductively Coupled Plasma Atomic Emission Spectrometry). The Optimization of the system has been performed in terms of the determination of signal-to-noise ratio and background intensity at various rf powers, sample flow rates, argon gas flow rates and cut-off gas flow rates. The spectro-analytical characteristics of the spectrum obtained between 200 and 500 nm was revealed to be similar compared with a vertically viewed ICP source. The detection limit of Pb(Ⅱ) at 220.35 nm was 11 ppb which was 5 times lower than that obtained with a vertically viewed ICP source.

• Journal of the Korean Vacuum Society
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• v.6 no.3
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• pp.213-219
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• 1997

The plasma polymerized styrene films were prepared by using an inter-electrode capacitively coupled gas-flow-type reactor, and the effects of plasma polymerization condition on the molecular weight distribution were investigated by Fourier Transform Infrared (FT-IR), Pyrolysis Gas Chromatography(PyGC), Differential Scanning Calorimetry(DSC) and Gel Permeation Chromatography(GPC). From the above results, the very cross-linked films different from chemical characteristics of the starting monomer were taken out, and it is realized that the molecular structure, cross linking density, and molecular weight distribution could be controlled by changing the parameters such as deposition pressure, deposition power and gas flow rate. Accordingly, it is suggested that plasma polymerization method performed by inter-electrode capacitively coupled gas-flow-type reactor has good characteristics for manufacturing the functional organic thin films which can be applied in sensors, opto-electric device, photo-resist by changing the polymerization parameters.

• Applied Chemistry for Engineering
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• v.30 no.1
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• pp.108-113
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• 2019

In this study, the decomposition characteristics of perfluorinated compounds generated in semiconductor manufacturing process were investigated by using a high temperature plasma. The analysis results revealed that $CF_4$ and $SF_6$ showed the highest efficiency at 12.8 kW power, but no significant difference was observed at the power above. Experimental results showed that the maximum efficiency was obtained at the flow rate of about 14 mL/min and the treatment efficiency decreased as the flow rate increased or decreased with respect to the flow rate of 14 mL/min. As a result, the decomposition characteristics of perflurocompounds (PFCs) using a high temperature plasma could be grasped, and also the basis for the treatment of PFCs and greenhouse gases generated in the semiconductor manufacturing process could be obtained.

• The Bulletin of The Korean Astronomical Society
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• v.46 no.2
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• pp.47.2-47.2
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• 2021

The present study is focused on origins of the flow and magnetic structure involved in the formation and eruption of a solar prominence. To clarify them, we performed an MHD simulation based on the 3-dimensional emerging flux tube (3DEFT) model, in which self-consistent evolution of a flow and magnetic field passing freely through the solar surface was obtained by seamlessly connecting subsurface dynamics with surface dynamics. By analyzing Lagrangian displacements of magnetized plasma elements, we demonstrate the flow structure which is naturally incorporated to the magnetic structure of the prominence formed via dynamic interaction between the flow and magnetic field.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.218.1-218.1
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• 2014

In order to measure the absolute plasma density, various probes are proposed and investigated and microwave probes are widely used for its advantages (Insensitivity to thin non-conducting material deposited by processing plasmas, High reliability, Simple process for determination of plasma density, no complicate assumptions and so forth). There are representative microwave probes such as the cutoff probe, the hairpin probe, the impedance probe, the absorption probe and the plasma transmission probe. These probes utilize the microwave interactions with the plasma-sheath and inserted structure (probe), but frequency range used by each probe and specific mechanisms for determining the plasma density for each probe are different. In the recent studies, behaviors of each microwave probe with respect to the plasma parameters of the plasma density, the pressure (the collision frequency), and the sheath width is abundant and reasonably investigated, whereas relative diagnostic characteristics of the probes by a comparative study is insufficient in spite of importance for comprehensive applications of the probes. However, experimental comparative study suffers from spatially different plasma characteristics in the same discharge chamber, a low-reproducibility of ignited plasma for an uncertainty in external discharge parameters (the power, the pressure, the flow rate and so forth), impossibility of independently control of the density, the pressure, and the sheath width as well as expensive and complicate experimental setup. In this paper, various microwave probes are simulated by finite-different time-domain simulation and the error between the input plasma density in FDTD simulations and the measured that by the unique microwave spectrums of each probe is obtained under possible conditions of plasma density, pressure, and sheath width for general low-temperature plasmas. This result shows that the each probe has an optimum applicable plasma condition and reliability of plasma density measurement using the microwave probes can be improved by the complementary use of each probe.

• Applied Chemistry for Engineering
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• v.30 no.6
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• pp.719-725
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• 2019

In this study, activated carbon fibers were treated with oxygen plasma to investigate gas sensing properties of the dimethyl methylphosphonate (DMMP), which is a simulant gas of the chemical warfare agent, according to oxygen functional group contents. As the flow rate of oxygen plasma treatment increased, oxygen groups were introduced to the surface of activated carbon fibers from 6.90 up to 36.6%, increasing the -OH group which influences the DMMP gas sensing properties. However, as the flow rate of oxygen plasma increases, the specific surface area tends to decrease because etching on the surface of activated carbon fibers occurs due to active species generated during the oxygen plasma treatment. The resistance change rate of the DMMP gas sensor increased from 4.2 up to 25.1% as the oxygen plasma treatment flow rate increased. This is attributed to the hydrogen bonding between DMMP gas and introduced hydroxyl functional group on activated carbon fibers by the oxygen plasma treatment. Therefore, the oxygen plasma is considered to be one of the important surface treatment methods for detecting chemical warfare agents at room temperature.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.3
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• pp.31-38
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• 2015

In order to achieve a high speed and high quality silicon wafer bonding, the room-temperature direct bonding using atmospheric pressure plasma and sprayed water vapor was developed. Effects of different plasma fabrication parameters, such as flow rate of $N_2$ gas, flow rate of CDA (clear dry air), gap between the plasma head and wafer surface, and plasma applied voltage, on plasma activation were investigated using the measurements of the contact angle. Influences of the annealing temperature and the annealing time on bonding strength were also investigated. The bonding strength of the bonded wafers was measured using a crack opening method. The optimized condition for the highest bonding strength was an annealing temperature of $400^{\circ}C$ and an annealing time of 2 hours. For the plasma activation conditions, the highest bonding strength was achieved at the plasma scan speed of 30 mm/sec and the number of plasma treatment of 4 times. After optimization of the plasma activation conditions and annealing conditions, the direct bonding of the silicon wafers was performed. The infrared transmission image and the cross sectional image of bonded interface indicated that there is no void and defects on the bonded wafers. The bonded wafer exhibited a bonding strength of average $2.3J/m^2$.

• 한국초전도학회:학술대회논문집
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• v.16
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• pp.47-47
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• 2006

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.523-523
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• 2012

As the wafer geometric requirements continuously complicated and minutes in tens of nanometers, the expectation of real-time add-on sensors for in-situ plasma process monitoring is rapidly increasing. Various industry applications, utilizing plasma impedance monitor (PIM) and optical emission spectroscopy (OES), on etch end point detection, etch chemistry investigation, health monitoring, fault detection and classification, and advanced process control are good examples. However, process monitoring in semiconductor manufacturing industry requires non-invasiveness. The hypothesis behind the optical monitoring of plasma induced ion current is for the monitoring of plasma induced charging damage in non-invasive optical way. In plasma dielectric via etching, the bombardment of reactive ions on exposed conductor patterns may induce electrical current. Induced electrical charge can further flow down to device level, and accumulated charges in the consecutive plasma processes during back-end metallization can create plasma induced charging damage to shift the threshold voltage of device. As a preliminary research for the hypothesis, we performed two phases experiment to measure the plasma induced current in etch environmental condition. We fabricated electrical test circuits to convert induced current to flickering frequency of LED output, and the flickering frequency was measured by high speed optical plasma monitoring system (OPMS) in 10 kHz. Current-frequency calibration was done in offline by applying stepwise current increase while LED flickering was measured. Once the performance of the test circuits was evaluated, a metal pad for collecting ion bombardment during plasma etch condition was placed inside etch chamber, and the LED output frequency was measured in real-time. It was successful to acquire high speed optical emission data acquisition in 10 kHz. Offline measurement with the test circuitry was satisfactory, and we are continuously investigating the potential of real-time in-situ plasma induce current measurement via OPMS.

• Nuclear Engineering and Technology
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• v.54 no.1
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• pp.207-219
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• 2022

The suppression of high-intensity blob structures in the scrape-off layer (SOL) by ion-cyclotron range of frequencies (ICRF) power, leading to a decrease in the turbulent fluctuation level, is observed first in the Experimental Advanced Superconducting Tokamak (EAST) experiment. This suppression effect from ICRF power injection is global in the whole SOL at EAST, i.e. blob structures both in the regions that are magnetically connected to the active ICRF launcher and in the regions that are not connected to the active ICRF launcher could be suppressed by ICRF power. However, more ICRF power is required to reach the full blob structure suppression effect in the regions that are magnetically unconnected to the active launcher than in the regions that are magnetically connected to the active launcher. Studies show that a possible reason for the blob suppression could be the enhanced E_r × B shear flow in the SOL, which is supported by the shaper radial gradient in the floating potential profiles sensed by the divertor probe arrays with increasing ICRF power. The local RF wave power unabsorbed by the core plasma is responsible for the modification of potential profiles in the SOL regions.