• Journal of the Korean Vacuum Society
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• v.13 no.4
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• pp.175-181
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• 2004

We investigated the stability of the DLC film coated on 304 stainless steel substrate by Radio frequency assisted chemical vapor deposition method. Fracture and spallation behaviour of the coating was observed during micro-tensile test of the fil $m_strate composite. As the tensile deformation progressed, the cracks of the film were observed in the perpendicular direction to the tensile axis. Further deformation resulted in the plastic deformation with $45^{\circ}$ slip bands on the substrate surface. Spallation of the film occurred with the plastic deformation, which was initiated at the cracks of the film and was aligned along the slip directions. We found that both the cracking and the spallation behaviors are strongly dependent on the pre-treatment condition, such as Ar plasma pre-treatment. The spallation of the film was considerably suppressed in an optimized condition of the substrate cleaning by Ar glow discharge. We observed the improved stability with increasing duration of Ar plasma pre-treatment.nt.

• The Journal of Engineering Geology
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• v.23 no.1
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• pp.29-36
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• 2013

The application of appropriate rehabilitation methods can improve the efficiency of clogged wells and extend their life. In this paper, we study the feasibility of well cleaning using high-voltage pulsed discharge, in which electrical energy is used to produce impulsive pressure in water, in contrast to conventional methods that employ chemical or pneumatic energy sources. This technique utilizes the compressive shock wave generated by the expansive force of hot, dense plasma that is produced during a pulsed discharge in the gap between electrodes immersed in water. Compared with conventional techniques, this method is simple, and easy to handle and control. Using a capacitive pulsed power system with an electrical energy of 200 J, an impulsive pressure of 10.7 MPa is achieved at the position 6 cm away from the discharge gap. The amplitude of the impulsive pressure was easily controlled by adjusting the charging voltage of the capacitor and was almost linearly proportional to peak discharge current. The technique achieved good results in cleaning feasibility tests with mock-up specimens similar to clogged well screens.

• Korean Chemical Engineering Research
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• v.43 no.1
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• pp.27-32
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• 2005

We propose an effective and environmentally friendly dry stripping method using a supercritical carbon dioxide ($SCCO_2$) system modified by a single and multiple cosolvents to remove ion-implanted photoresist and residue from a wafer surface at three different temperatures (97, 148, $200^{\circ}C$) and pressures (200, 300, 400 bar). After high dose of ion implantation the photoresist was not easily removed by using pure $SCCO_2$, but swollen. The $SCCO_2$ system modified by single cosolvents and multiple cosolvents mixed with aprotic solvents could not effectively remove the heavy organics, but swell them. However, the $SCCO_2$ system modified with multiple cosolvent (5%, v/v) composed of DMSO and DIW showed high removal efficiency for ion-implanted photoresists at $97^{\circ}C$ and 200 bar for 30 min (about 80%). In this study it has been shown that the dry stripping method using $SCCO_2$ system modified with multiple cosolvents could replace either plasma ashing or acid and solvent wet bench method and dramatically reduce accompanied chemical usage and disposal.

• Journal of Korean Society of Environmental Engineers
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• v.38 no.6
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• pp.291-298
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• 2016

Electrochemical water treatment process as a useful treatment method for the removal of non-degradable matter has been consistently studied for several decades. Key process of electrochemical water treatment are oxidation reaction from an anode and reduction from a cathode. In this study, the effect of pre-treatment methods in the insoluble electrode manufacturing process for the water treatment has been evaluated for the life time of electrode The results of this study showed that pre-treatment methods of a base metal such as surface roughness, clean method and interlayer formation influenced to life time of electrode when the same condition (catalyst electrode layer coating method and material system) was applied for pre-treatment methods. This study was conducted by using $IrO_2/Ti$ electrode In the test of sand-blasting process, an electrode manufactured by using sanding media of different sizes resulted in the most effective electrode life time when the size of alumina was used for $212{\sim}180{\mu}m$ praticle size (#80). The most effective method was considered using arc plasma in the additional roughness control and cleaning process, sputtering method to form Ta type interlayer formation process.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.74-74
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• 2018

Ti-6Al-4V alloys have been widely used as orthopedic materials because of their excellent corrosion resistance and mechanical properties. However, it does not bind directly to the bone, so it requires a surface modification. This problem can be solved by nanotube and micropore formation. Plasma electrolytic oxidation (PEO) treatment for micropore, which combines high-voltage spark and electrochemical oxidation, is a new way of forming a ceramic coating on light metals such as titanium and its alloys. This method has excellent reproducibility and can easily control the shape and size of the Ti alloy. In this study, formation of bioactive surface by PEO-treatment after $2^{nd}$ ATO technique of Ti-6Al-4V alloy was invesgated by various instrument. Nanotube oxide surface structure was formed on the surface by anodic oxidation treatment in 0.8 wt.% NaF and 1M $H_3PO_4$ electrolytes. After nanotube formation, nanotube layer was removed by ultrasonic cleaning. PEO-treatment was carried out at 280V for 3 minutes in the electrolytic solution containing the bioactive substance (Mg, Zn, Mn, Sr, and Si). The surface of Ti-6Al-4V alloy was observed by field emission scanning electron microscopy (FE-SEM, S-4800 Hitachi, Japan). An energy dispersive X-ray spectrometer (EDS, Inca program, Oxford, UK) was used to analyze the spectra of physiologically active Si, Mn, Mg, Zn, and Sr ions. The PEO film formed on the Ti-6Al-4V alloy surface was characterized using an X-ray diffractometer (TF-XRD, X'pert Philips, Netherlands). It is confirmed that bioactive ions play an essential role in the normal bone growth and metabolism of the human skeletal tissues.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.1-7
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• 1999

We developed Fabrication process of embedded passive components in MCM-D substrate. The proposed MCM-D substrate is based on Cu/photosensitive BCB multilayer. The substrate used is Si wafer and Ti/cu metallization is used to form the interconnect layer. Interconnect layers are formed with 1000$\AA$ Ti/3000$\AA$ Cu by sputtering method and 3$\mu\textrm{m}$ Cu by electrical plating method. In order to form the vias in photosensitive BCB layer, the process of BCB and plasma etch using $C_2F_6$ gas were evaluated. The MCM-D substrate is composed of 5 dielectric layers and 4 interconnect layers. Embedded resistors are made with NiCr and implemented on the $2^{nd}$ dielectric layer. The sheet resistance of NiCr is controlled to be about 21 $\Omega$/sq at the thickness of 600$\AA$. The multi-turn sprial inductors are designed in coplanar fashion on the $4^{th}$ interconnect layer with an underpass from the center to outside using the lower $3^{rd}$ interconnect layer. Capacitors are designed and realized between $1^{st}$ interconnect layer and $2^{nd}$ interconnect layer. An important issue in capacitor is the accurate determination of the dielectric thickness. We use the 900$\AA$ thickness of PECVD silicon nitride film as dielectric. Capacitance per unit area is about 88nF/$\textrm {cm}^2$at the thickness of 900$\AA$. The advantage of this integration process is the compatibility with the conventional semiconductor process due to low temperature PECVD silicon nitride process and thermal evaporation NiCr process.

• Resources Recycling
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• v.30 no.5
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• pp.38-48
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• 2021

In this study, we determine the optimal process conditions for selectively recovering Si from a solar cell surface by removal of impurities (Al, Zn, Ag, etc.). To selectively recover Si from solar cells, leaching is performed using HCl solution and an ultrasonic cleaner. After leaching, the solar cells are washed using distilled water and dried in an oven. Decompression filtration is performed on the HCl solution, and ICP-OES (Inductively Coupled Plasma Optical Emission spectroscopy) full scan analysis is performed on the filtered solution. Furthermore, XRD (X-ray powder diffraction), XRF (X-ray fluorescence), and ICP-OES are performed on the dried solar cells after crushing, and the purity and recovery rate of Si are obtained. In this experiment, the concentration of acid solution, reaction temperature, reaction time, and ultrasonic intensity are considered as variables. The results show that the optimal process conditions for the selective recovery of Si from the solar cells are as follows: the concentration of acid solution = 3 M HCl, reaction temperature = 60℃, reaction time = 120 min, and ultrasonic intensity = 150 W. Further, the Si purity and recovery rate are 99.85 and 99.24%, respectively.