• Proceedings of the KSME Conference
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• 2001.06d
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• pp.939-944
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• 2001

For the application of simultaneous $DeSO_{2}\;&\;DeNO_{x}$ equipment using non-thermal plasma process to the industrial and power plants, the many types of plasma device and process were studied. The e-beam and pulsed plasma corona discharge process are outstanding for the study to apply commercial large-scale plant from among these. In this paper, non-thermal plasma of technical trends and the characteristics of system developed by Doosan heavy industries & construction Co., Ltd. are explained. We have researched pulsed plasma corona discharge process since 1994. At the basis of reasonable results for the pilot plant, we constructed the demonstration plant at a domestic coal-fired power plant in 1999, as the previous step for commercial use. In near future, enough information about designs and costs of commercial-size system will be obtained.

• Journal of Welding and Joining
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• v.8 no.3
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• pp.60-69
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• 1990

Plasma arc cutting is a fusion cutting process in which a gas-constricted arc is employed to produce a high-temperature, high-velocity plasma jet on the workpiece. This process provides some advantages such as increased cutting velocity, excellent working accuracy and the ability to cut special materials (widely used stainless steels and Al-alloys, for example), when compared with iconventional oxyfuel gas cutting. From the view point of price and reliability of the power source, plasma arc cutting has also some distinct advantages over laser beam cutting. High-speed machines with NC or CNC systems are needed for the plasma arc or laser beam cutting process, while for oxyfuel gas cutting, low-speed machines with copying templates or optical-shape tracking sensors can be applied. The low price and high flexibility of the microprocessor arc contributing more and more the application of CNC system in the plasma arc cutting process, as in other manufacturing fields. From these points of view, a microprocessor-based plasma arc cutting system was developed by using a reference-pulse system, and its performance was tested. The interpolating routines were programmed in the assembly language for saving the memory volume and improving the compouting speed, which has an intimate relationship with the available cutting velocity.

• Journal of Information Display
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• v.2 no.4
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• pp.1-7
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• 2001

This paper investigates the characteristics of a newly developed high density hollow cathode plasma(HCP) system and its application for the etching of silicon wafers. We used $SF_6$ and $O_2$ gases in the HCP dry etch process. This paper demonstrates very high plasma density of $2{\times}10^{12}cm^{-3}$ at a discharge current of 20 rna, Silicon etch rate of 1.3 ${\mu}m$/min was achieved with $SF_6/O_2$ plasma conditions of total gas pressure of 50 mTorr, gas flow rate of 40 seem, and RF power of200W. This paper presents surface etching characteristics on a crystalline silicon wafer and large area cast type multicrystlline silicon wafer. We obtained field emitter tips size of less than 0.1 ${\mu}m$ without any photomask step as well as with a conventional photolithography. Our experimental results can be applied to various display systems such as thin film growth and etching for TFT-LCDs, emitter tip formations for FEDs, and bright plasma discharge for PDP applications. In this research, we studied silicon etching properties by using the hollow cathode plasma system.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.1817-1819
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• 2004

From the plasma application point of view, electron temperature and density are one of the most important parameters for plasma process. But it is only available to control plasma by adjusting external factors like gas pressure and input power. In this paper, pulse-modulated plasma is generated by modulating 13.56GHz RF power with 1, 5, 10kHz pulse. And Langmuir probe technique is used to study the distribution of electron temperature and density. When modulated pulse is off, electron temperature decreases gradually in form of exponential decay. The value t of exponential decay slope is 33.619, 13.834, 10.803 in 1kHz. 5kHz. 10kHz. This implies that this method can be used to control electron temperature and density.

• Journal of Electrical Engineering and Technology
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• v.6 no.6
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• pp.836-841
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• 2011

Plasma polymerized methyl methacrylate (ppMMA) thin films were deposited by plasma polymerization technique with different plasma powers and subsequently thermally treated at temperatures of 60 to $150^{\circ}C$. To find a better ppMMA preparation technique for application to organic thin film transistor (OTFT) as dielectric layer, the chemical composition, surface morphology, and electrical properties of ppMMA were investigated. The effect of ppMMA thin-film preparation conditions on the resulting thin film properties were discussed, specifically O-H site content in the pMMA, dielectric constant, leakage current density, and hysteresis.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.12
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• pp.48-53
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• 2011

Polymer thin films were prepared by capacitively coupled plasma polymerization process for application of gate insulator. The polymer thin films revealed to form polymer layers with original properties of the monomer. Among the plasma polymer thin films, the styrene polymer having large number of phenyl sites revealed higher dielectric constant of k=3.7 than that of conventional polymer. The plasma polymerized styrene thin film revealed no hysteresis characteristics and low leakage current density of $1{\times}10^{-8}[Acm^{-2}]$ at field strength of $1[MVcm^{-1}]$, which measured by I-V and C-V measurements using MIM and MIS devices.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1729-1732
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• 2006

We proposed a new Mercury-free Flat Fluorescent Lamp (MFFL) for LCD backlight which shows a wide, stable operating voltage margin, high luminance and efficiency. In this paper, we expanded the single cell with 4 inch diagonal size into the multi-cell for the large size LCD-TV backlight application, examined its operating characteristics and proposed a driving scheme for 2-bit areal selective dimming control.

• Journal of The Korean Society of Clinical Toxicology
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• v.4 no.1
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• pp.1-6
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• 2006

Purpose: Hemoperfusion is an effective modality of extracorporeal elimination of toxins in acutely poisoned patients. We evaluated the effect of hemoperfusion on plasma concentration of toxins in patients exposed to certain pesticides. Methods: Eleven patients who were acutely exposed to pesticides participated in our study. We measured plasma pesticide concentration from the whole blood obtained by arterial and venous sources by gas chromatography. Results: The plasma concentrations of only 3 patients was measured. Methidation clearance by hemoperfusion was 82.2%, fenitrothion was 23%, and endosulfan was 0% Conclusion: Measurement of plasma organophosphate concentration is not a practical application. Our results suggest that hemoperfusion is applicable in patients with pesticide intoxication according to clinical status.

• Applied Science and Convergence Technology
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• v.23 no.6
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• pp.328-339
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• 2014

In this article, plasma monitoring tools and mulivariate analysis techniques were reviewed. Optical emission spectroscopy was reviewed for a chemical composition analysis tool and RF V-I probe for a physical analysis tool for plasma monitoring. Multivariate analysis techniques are discussed to the sensitivity improvement. Principal component analysis (PCA) is one of the widely adopted multivariate analysis techniques and its application to end-point detection of plasma etching process is discussed.

• 한국연소학회:학술대회논문집
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• 2003.12a
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• pp.27-32
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• 2003

The effect of non-thermal plasma on diffusion flames in co-flow jets has been studied experimentally by adopting a dielectric barrier discharge technique. The generation of streamers was enhanced with a flame due to increased reduced electric fields by high temperature burnt gas and the abundance of ions in the flame region. The effect of streamers on flame behavior reveals that the flame length was significantly decreased as the applied voltage increased and the yellow luminosity by the radiation of soot particles was also significantly reduced. The formation of PAH and soot was influenced appreciably by the non-thermal plasma, while the flame temperature and the concentration of major species were not influence much with the plasma generation. The results demonstrated that the application of non-thermal plasma can be a viable technique in controlling soot generation in flames with low power consumption in the order of 1 W.