• 대한방사선기술학회지:방사선기술과학
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• 제16권1호
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• pp.101-106
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• 1993

In order to assure safety of both patient and operator, and to provide uniform quality radiographs, it is necessary to perform periodic calibration of diagnostic X-ray equipment. A basic parameter of diagnostic equipment's and its image sharpness is the size(and shape the energy distribution) of the focal spot as viewed along the central X-ray beam. This size determines the resolution possible with the equipment and also determines the heat characteristics of an anode. A fine focus tube gives high resolution but causes high local heating of target. In past, the pin-hole and star pattern image measurement for evaluation of resolution have been widely used, but it produced blurring and inaccuracy of image. So newly inverted Ug-meter has advantage in more convenient measurement method and less out-put bias than other image measurement. The authors intended to compare measured focal size between Ug-meter and focal spot test tool, changed state from setting to now of units.

• 한국정밀공학회지
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• 제21권12호
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• pp.92-99
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• 2004

The formation degree of sustain (ITO pattern) decides quality of PDP (Plasma Display Panel). For this reason, it makes efforts in searching defects more than 30 un as 100%. Now, the existing inspection is dependent upon naked eye or microscope in off-line PDP manufacturing process. In this study developed prototype inspection system of PDP 170 glass is based on line-scan mechanism. Developed system creates information that detects and sorts kinds of defect automatically. Designed inspection technology adopts multi-vision method by slip-beam formation for the minimum of inspection time and detection algorithm is embodied in detection ability of developed system. Designed algorithm had to make good use of kernel matrix that draws up an approach to geometry. A characteristic of defects, as pin hole, substance, protrusion, are extracted from blob analysis method. Defects, as open, short, spots and et al, are distinguished by line type inspection algorithm. In experiment, we could have ensured ability of inspection that can be detected with reliability of up to 95% in about 60 seconds.

• 전기학회논문지
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• 제66권10호
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• pp.1508-1515
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• 2017

This paper proposes the defect detection method for automatic inspection machines in printed circuit boards (PCBs) manufacturing system. The defects of PCB such as open, short, pin hole and scratch can be detected by comparing the standard image and the target image. The standard image is obtained from CAD file such as ODB++ format, and the target image is obtained by arranging, filtering and binarization of captured PCB image. Since the PCB size is too large and image resolution is too high, the image processing requires a lot of memory and computational time. The wavelet transform is applied to compress the standard and target images, which results in reducing the memory and computational time. To increase the inspection accuracy, we utilize the he HH-domain as well as LL-domain of the transformed images. Experimental results are finally presented to show the performance improvement of the proposed method.

• 대한기계학회논문집B
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• 제30권12호
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• pp.1147-1154
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• 2006

An experimental investigation was conducted to enhance the heat/mass transfer for impingement/effusion cooling system when the initial crossflow was formed. For the improvement of heat transfer, the circular guide is installed on the injection hole. At the fixed jet Reynolds number of 10,000, the measurements were carried out for blowing ratios ranging from 0.5 to 1.5. The local heat/mass transfer coefficients on the effusion plate are measured using a naphthalene sublimation method. The result presents that the circular guide protects the injected jet from the initial crossflow, increasing the heat/mass transfer. The heat transfer of stagnation region is hardly changed regardless of the blowing ratio. The secondary peak is obviously formed by flow transition to turbulent flow. At high blowing ratio of 1.5, the circular guide produces $26{\sim}30%$ augmentation on the averaged heat/mass transfer while the case without circular guide leads to the low and non-uniform heat/mass transfer. With the increased heat/mass transfer, the installation of circular guide is accompanied by the increase of pressure loss in the channel. However, the pressure drop caused by the circular guide is lower than that for other cooling technique with the circular pin fin.

• 대한전기학회논문지:시스템및제어부문D
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• 제51권5호
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• pp.212-219
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• 2002

In this paper, the epipolar geometry, genera17y used as a pin-hole camera model, is newly adapted to our proposed method that enables the affine reconstruction of the 3D object from two projected views. The proposed method models the projective projection of inherent X-ray imaging system, obviates the need to attach artifirially constructed material on the body, and requires none of the prior-knowledge regarding to intrinsic and extrinsic parameters of two X-ray imaging systems. The optimum numerical solution is obtained by applying the least mean square estimator to corresponding points on two projected X-ray planes. The performance of this proposed method is Quantitatively analyzed using computer synthesized model of Cochlear implantation electrodes. In simulated experiments, the propnsed method is insensitive to the added random noise, the scaling factor change, the center point change, and rotational angular change between two projection planes, as well as enables the stable 3D reconstruction in least square sense even in worst testing cases.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2001년도 하계학술대회 논문집 C
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• pp.1540-1542
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• 2001

In this paper, the amount of additives in the electrode were investigated the relation of the mechanical properties and surface luminance of copper foil. Especially, organic compound of PEG(Poly-ethylene Glycol) was added from 1 to 20ppm for the propose of increasing the mechanical property and the surface state. The surface luminance of copper foil is appealed 69.25 at 2ppm-15A/$dm^2$ and 68.25 at 2ppm-10A/$dm^2$. It guess that 10ppm-10A/$dm^2$ occurred pin-hole. Tensile strength was not showed the significant difference but elongation appealed the most value at 5ppm-15A. We earned that the most PEG value of mechanical properties is 5 PPM.

• 마이크로전자및패키징학회지
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• 제11권1호
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• pp.43-47
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• 2004

We have been using Moisture Barrier Bags for dry packing of semiconductor packages to prevent moisture from absorbing during shipping. Moisture barrier bag material is required to be waterproof, vapor proof and offer superior ESD (Electro-static discharge) and EMI shielding. Also, the bag should be formed easily to the shape of products for vacuum packing while providing excellent puncture resistance and offer very low gas ＆ moisture permeation. There are some problems like pinholes and punctured bags after sealing and before the surface mount process. This failure may easily result in package pop corn crack during board mounting. The bags should be developed to meet the requirements of excellent electrical and physical properties by means of optimization of their raw material composition and their thickness. This study investigates the performance of moisture barrier bags by characterization of their mechanical endurance, tensile strength and through thermal analysis. By this study, we arrived at a robust material composition (polyester/Aluminate) for better packing.

• 대한기계학회논문집A
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• 제26권9호
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• pp.1914-1922
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• 2002

Operating test of power-transmission plastic spur gears were performed inspecting both characteristics of friction-wear and endurance, and suggesting endurance improvement method that either drills internal holes of tooth or inserts metallic pin in the internal hole of tooth and verifying this newly-provided method. In case of acetal gears, amount of friction-wear is observed to increase by development of plastic deformation and increase of tooth stiffness due to brittle material property of acetal. To the contrary, in case of nylon gears, suggested method is shown to drop down the tooth temperature for about 3∼10$^{\circ}C$ than original gear, thus amount of wear is reduced by over 30% and operating lift prolonged by more than 200%. Hence, suggested method is proved to be practically applicable to the plastic gears made by soft polymers such as Nylon.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.191-195
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• 2003

The formation degree of sustain (ITO pattern) decides quality of PDP (plasma display panel). For this reason. it makes efforts in search defects more than 30 ${\mu}{\textrm}{m}$. Now, the existing inspection process is dependent upon naked eye or SEM equipment in off-line PDP manufacturing process. In this study developed prototype inspection system of PDP ITO glass. This system creates information that detects and sorts kind of defect automatically. Design ed inspection technology adopts line-scan method by slip-beam formation for the minimum of inspection time and image processing algorithm is embodied in detection ability of developed system. Designed algorithm had to make good use of kernel matrix which draws up an approach to geometry. A characteristic of area-shaped defects, as pin hole, substance, protrusion et al, are extracted from blob analysis method. Defects, as open, short, spots, et al, are distinguished by line type inspection algorithm. In experiment results, we could have ensured ability of inspection that can be detected with reliability of up to 95% in about 60 seconds

• 한국공작기계학회논문집
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• 제16권5호
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• pp.151-156
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• 2007

In this paper, the creep characteristics of lead and lead-free solder joint were investigated using the QFP(Quad Flat Package) creep test. Two kind of solder pastes(Sn-3Ag-0.5Cu, Sn-0.2Sb-0.4Ag-37.4Pb) were applied to the QFP solder joints and each specimen was checked the external and internal failures(i.e., wetting failure, void, pin hole, poor-heel fillet) by digital microscope and X-ray inspection. The creep test was conducted at the temperatures of $100^{\circ}C$ and $130^{\circ}C$ under the load of 15$\sim$20% of average pull strength in solder joints. The creep characteristics of each solder joints were compared using the creep strain-time curve and creep strain rate-stress curves. Through the comparison, the Sn-3Ag-0.5Cu solder joints have higher creep resistance than that of Sn-0.3Sb-0.4Ag-37.4Pb. Also, the grain boundary sliding in the fracture surface and the necking of solder joint were observed by FE-SEM.