• Bulletin of the Society of Naval Architects of Korea
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• v.26 no.4
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• pp.3-13
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• 1989

In recent towing tank experiments, it has been observed that a ship moving near the critical speed $\sqrt{gh}$(g=gravitational acceleration, h=water depth) radiates solitons upstream in an almost periodic manner. As a ,consequence, the ship experiences considerable changes in resistance, trim and sinkage, or better known as squat. Mei and Choi(1987) developed a nonlinear theory for a slender ship by using the method of matched asymptotic expansions. For a certain class of channel width and ship slenderness, they found that the waves generated can be described by an inhomogeneous Korteweg-de Vries(KdV) equation. The leading-order solution properly predicts solitons propagating upstream, but it fails to render three-dimensional waves in the wake. In this paper a new approach has been made by choosing a different class of channel width and ship slenderness. The wave equation in the farfield turns out to be a homogeneous Kadomtsev-Petviashvili(KP) equation, which predicts solitons upstream and three-dimensional waves in the wake. Numerical results for the wave resistance, sinkage and trim reflect the experimentally identified phenomena.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.2
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• pp.163-168
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• 2001

Due to aging, adhesively bonded and riveted aircraft lap joints can contain distends, cracks around rivet holes, fatigue induced flaws, and corrosion. It is required for the safety of aircraft to inspect these defects through the whole region of mint in rapid speed. Bond quality or adhesively bonded and riveted aluminum lap splice joints is investigated using non-contact remote ultrasonic nondestructive evaluation (NDE). Non-contact ultrasonic tests are performed using laser generation and air-coupled transducer detection. A Q-switched Nd:YAG laser and a periodic transmission mask are used to generate a selected Lamb mode. The Lamb wave is generated on one side of the lap splice joint, propagates along the plate, interacts with the joint and is detected on the other side by a micromachined air-coupled capacitance transducer. Analysis of recorded signals allows to evaluate the condition of the bond.

• Journal of the Korean Society for Nondestructive Testing
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• v.34 no.3
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• pp.211-219
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• 2014

Closed cracks are difficult to detect using conventional ultrasonic testing because most incident ultrasound passes completely through these cracks. Nonlinear ultrasound inspection using sub-harmonic frequencies a promising method for detecting closed cracks. To implement this method, a sub-harmonic phased array (PA) is proposed to visualize the length of closed cracks in solids. A sub-harmonic PA generally consists of a single transmitter and an array receiver, which detects sub-harmonic waves generated from closed cracks. The PA images are obtained using the total focusing method (TFM), which (with a transmitter and receiving array) employs a full matrix in the observation region to achieve fine image resolution. In particular, the receiving signals are measured using a laser Doppler vibrometer (LDV) to collect PA images for both fundamental and sub-harmonic frequencies. Oblique incidence, which is used to boost sub-harmonic generation, inevitably produces various surface waves that contaminate the signals measured in the receiving transducer. Surface wave interference often degrades PA images severely, and it becomes difficult to read the closed crack's position from the images. Various methods to prevent or eliminate this interference are possible. In particular, enhancing images with signal processing could be a highly cost-effective method. Because periodic patterns distributed in a PA image are the most frequent interference induced by surface waves, spatial frequency filtering is applicable for removing these waves. Experiments clearly demonstrate that the spatial frequency filter improves PA images.

• Journal of Advanced Marine Engineering and Technology
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• v.34 no.2
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• pp.325-331
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• 2010

In this study, highly miniaturized short-wavelength meander line employing eriodically patterned ground structure (PPGS) was developed for application to miniaturized on-chip passive component on GaAs MMIC (monolithic microwave integrated circuit). The meander line employing PPGS showed shorter wavelength and slow-wave characteristic compared with conventional meander line. The wavelength of the meander line employing PPGS structure was 17 % of the conventional meander line on GaAs MMIC. Due to its slow-wave structure, the meander line employing PPGS exhibited large propagation constant than conventional meander line, which resulted in larger phase shift and shunt inductance value. Above results indicate that the meander line employing PPGS is a promising candidate for application to a development of miniaturized on-chip RF components as well as inductor with a high inductance value on GaAs MMIC.

• Journal of the Korean Society of Fisheries and Ocean Technology
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• v.40 no.4
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• pp.360-366
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• 2004

This paper presents a method analyzing the motion of cylindrical buoy moored at 2 points and tensions action on each mooring line under the action of periodic waves. It was found that submersible buoy was more effective than floating one in the severe conditions considering its dynamic motions, wave forces, and mooring line tensions. The wave induced its dynamic responses and mooring line tensions peak when the ratio d/${\lambda}$ of the buoy length d to the waves length ${\lambda}$ was 0.66 due to its natural frequency. The results of this study were in agreement with the existing measurement ones, however, further verifications are needed considering resonance of cylindrical buoy and its displacements to wave height by a series of model tests.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.35 no.8
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• pp.957-964
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• 2011

This investigation presents a finite element method to obtain the transmission properties of bulk elastic waves in piezoelectric band gap structures(phonon crystals) for varying frequencies and modes. To this end, periodic boundary conditions are imposed on a three-dimensional model while both in-plane and out-of-plane modes are included. In particular, the mode decoupling characteristics between in-plane and out-of-plane modes are identified for each electric poling direction and the results are incorporated in the finite element modeling. Through numerical simulations, the proposed modeling method was found to be a useful, effective one for analyzing the wave characteristics of various types of piezoelectric phononic band gap structures.

• Korean Journal of Metals and Materials
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• v.48 no.7
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• pp.667-673
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• 2010

Copper filling into TSV (through-silicon-via) and reduction of the filling time for the three dimensional chip stacking were investigated in this study. A Si wafer with straight vias - $30\;{\mu}m$ in diameter and $60\;{\mu}m$ in depth with $200\;{\mu}m$ pitch - where the vias were drilled by DRIE (Deep Reactive Ion Etching) process, was prepared as a substrate. $SiO_2$, Ti and Au layers were coated as functional layers on the via wall. In order to reduce the time required complete the Cu filling into the TSV, the PPR (periodic pulse reverse) wave current was applied to the cathode of a Si chip during electroplating, and the PR (pulse-reverse) wave current was also applied for a comparison. The experimental results showed 100% filling rate into the TSV in one hour was achieved by the PPR electroplating process. At the interface between the Cu filling and Ti/ Au functional layers, no defect, such as a void, was found. Meanwhile, the electroplating by the PR current showed maximum 43% filling ratio into the TSV in an hour. The applied PPR wave form was confirmed to be effective to fill the TSV in a short time.

• Korean Journal of Metals and Materials
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• v.49 no.5
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• pp.388-394
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• 2011

High speed copper filling into TSV (through-silicon-via) for three dimensional stacking of Si chips was investigated. For this study, a tapered via was prepared on a Si wafer by the DRIE (deep reactive ion etching) process. The via had a diameter of 37${\mu}m$ at the via opening, and 32${\mu}m$ at the via bottom, respectively and a depth of 70${\mu}m$. $SiO_2$, Ti, and Au layers were coated as functional layers on the via wall. In order to increase the filling ratio of Cu into the via, a PPR (periodic pulse reverse) wave current was applied to the Si chip during electroplating, and a PR (pulse reverse) wave current was applied for comparison. After Cu filling, the cross sections of the vias was observed by FE-SEM (field emission scanning electron microscopy). The experimental results show that the tapered via was filled to 100% at -5.85 mA/$cm^2$ for 60 min of plating by PPR wave current. The filling ratio into the tapered via by the PPR current was 2.5 times higher than that of a straight via by PR current. The tapered via by the PPR electroplating process was confirmed to be effective to fill the TSV in a short time.

• Proceedings of the Acoustical Society of Korea Conference
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• spring
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• pp.287-290
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• 2000

In periodic structures where two or more materials of different density and sound speeds are arranged, there exist stop bands, in which waves cannot propagate. In this paper noise and vibration reduction by using band gap phenomena is discussed. The general theoretical background is presented and experimental results for acoustic wave attenuation in 2D cylinder arrays are described.

• Journal of the Korean Society for Nondestructive Testing
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• v.12 no.1
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• pp.9-15
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• 1992

Ultrasonic spectroscopy is likely to become a very powerful NDE method for detection of microfects and thickness measurement of thin film below the limit of ultrasonic distance resolution in the opaque materials, provides a useful information that cannot be obtained by a conventional ultrasonic measuring system. In this paper, we considered a thin film below the limit of ultrasonic distance resolution sandwitched between two substances as acoustical analysis model, demonstrated the usefulness of ultrasonic spectroscopic analysis technique using information of ultrasonic frequency for measurements of thin film thickness, regardless of interference phenomenon and phase reversion of ultrasonic waveform. By using frequency intervals(${\triangle}f$) of periodic minima from the ratio of reference power spectrum of reflective waveform obtained a sample to power spectrum of multiple reflective waves obtained interference phenomenon caused by ultrasonic waves reflected at the upper and lower surfaces of a thin layer, can measured even dimensions of interest are smaller than the ultrasonic wave length with simplicity and accuracy.