• Composites Research
• /
• 제22권4호
• /
• pp.13-19
• /
• 2009

접착제에 의한 접합기술은 다양한 목적과 환경에서 널리 사용되는 방법이다. 그 중 우레탄 접착제는 저온에서의 우수한 접착 특성으로 인하여 액화천연가스 운반선과 같은 극저온 환경의 접착에 사용되고 있다. 유사한 우레탄 접착제라도 각기 다른 기재와의 접착특성을 갖게 된다. 특히 기재에 사용된 수지의 종류와 섬유와의 상응성에 따른 접착력의 변화는 산업현장에서의 접착제 선정에 매우 중요한 인자로 작용된다. 본 연구에서는 서로 다른 제조사의 우레탄 접착제를 사용하여 동일한 리섬유강화복합재료에 접착하였을 때 실험 온도에 따른 다른 경향의 박리강도를 얻었다. 그 원인을 주사전자현미경을 사용하여 검토하였으며, 실혐 결과 극저온에서 접착제와 복합재료 수지간의 접착력은 거의 유사하였으나 접착제와 가재에 노출된 유리섬유간의 접착력이 달라짐에 따른 원인으로 확인하였다.

• 대한기계학회논문집B
• /
• 제35권5호
• /
• pp.445-450
• /
• 2011

본 연구에서는 상압 플라즈마를 발생시켜 고분자 재료의 표면 자유에너지와 접착력의 변화를 조사하였다. 고분자 재질은 PC, PET, EVA 를 사용하였으며 표면자유에너지 변화를 관찰하기 위해 Di water 와 diiodomethane을 사용하여 접촉각을 측정하였다. 플라즈마 처리에 따른 접착력의 변화를 관찰하기 위해 PET 필름에 고분자 필름을 부착시켜 $180^{\circ}$ peel test 를 수행하였다. 그 결과 PET 필름의 표면자유에너지 및 접착력이 가장 큰 것을 확인할 수 있었으며, 상압 플라즈마 표면처리 공정은 필름 계면의 접착력을 크게 증가시켜 주는 것을 확인하였다.

• 접착 및 계면
• /
• 제16권4호
• /
• pp.156-161
• /
• 2015

본 연구에서는 수분산 폴리우레탄 아크릴레이트의 접착력 및 물성을 향상시키기 위하여 polyester polyol, 4,4-dicyclohexylmethane diisocyanate ($H_{12}MDI$), dimethylol propionic acid (DMPA), acrylate monomer를 사용하여 수분산 폴리우레탄 아크릴레이트를 합성하였다. 또한 합성된 수분산 폴리우레탄 아크릴레이트의 물성은 FT-IR, 입도분석, UTM, 접착력 등을 평가하였다. 입도 분석에서 아크릴산의 함량이 증가함에 따라 입자의 크기가 증가하였고, 기계적 물성을 평가한 결과, 아크릴산의 함량이 증가함에 따라 인장강도는 증가하였고 신율은 감소하였다. 접착강도는 PU/acryl 비율 중 acryl의 함량이 증가, 아크릴산의 함량이 증가할수록 증가하였다. 아크릴산의 함량이 0.5 wt%일 때 가장 높은 접착강도를 나타내었다.

• 대한금속재료학회지
• /
• 제47권10호
• /
• pp.675-680
• /
• 2009

Effects of $85^{\circ}C/85%$ Temperature/Humidity (T/H) treatment conditions on the peel strength of an electroless-plated Ni/polyimide system were investigated from a $180^{\circ}$ peel test. Peel strength between electroless-plated Ni and polyimide monotonically decreased from $37.4{\pm}5.6g/mm$ to $22.0{\pm}2.7g/mm$ for variation of T/H treatment time from 0 to 1000 hrs. The interfacial bonding mechanism between Ni and polyimide appears to be closely related to Ni-O bonding at the Ni/polyimide interface. The decrease in peel strength due to T/H treatment appears to be related to polyimide degradation due to moisture penetration through the interface and the bulk polyimide itself.

• 한국응용과학기술학회지
• /
• 제18권4호
• /
• pp.316-324
• /
• 2001

To prepare an acrylic type pressure-sensitive adhesive, quarternary polymers were synthesized from butyl acrylate (BA), 2-ethyl hexyl acrylate (2-EHA), methyl methacrylate (MMA), and 2-hydroxy ethyl methacrylate (2-HEMA). The quarternary polymers were identified by FT-IR and Molecular weight was measured by Gel Pearmeation Chromatography. Also, viscosity, solid content and peel strength were examined. The peel strength was 160 $g_{f}/25$ mm when the volume ratio of feed monomer to solvent was 1.3:1, and the ratio was relevant to commercial usage. The pot life of adhesive was 30 sec at the 50 m/min of heat treatment rate at, and it indicated that the minimum drying time was 30 sec. In weathering resistance test, peel strength of $160{\sim}180$ $g_{f}/25$ mm after 1000 h, with no residual remains on the adhesive surface.

• 한국염색가공학회지
• /
• 제17권6호
• /
• pp.36-41
• /
• 2005

The effects of low temperature plasma treatment on the properties of three types of foams, polyurethane(PU), injection phylon(IP), and phylon(PH) that used for footwear mid-sole were examined. The change of surface properties of foams were characterized by electron scanning microscope, contact angle measurement, and universal testing machine. Adhesion was tested by T-peel tests of plasma treated foams/polyurethane adhesive joints. The contact angle of three types of foams were decreased dramatically with the plasma treatment time, specifically noticeable in the case of phylon(Ph). It has shown the relationship with the contact angle of phylon(PH) and the distance between electrode and samples. The peel strength of foams were increased with the increase of plasma treatment time.

• 한국전기전자재료학회논문지
• /
• 제18권5호
• /
• pp.450-456
• /
• 2005

In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and Surface Roughness Tester. Adhesion was obtained from T-peel tests of semiconductive layer haying different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the creation of O-H and C=O. It is observed that adhesion performance was determined by surface energy and roughness level of silicone surface. It is found that at dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

• 한국표면공학회지
• /
• 제29권3호
• /
• pp.157-162
• /
• 1996

The effects of microstructural change on the adhesion strength between Cu/Cr film and polyimide have been studied. Cr films (50 nm thick) and Cu films (500 or 1000 nm thick) were deposited on polyimide by DC magnetron sputtering. During Cu deposition the Ar pressure was 5 or 100 mtorr. The microstructure was observed by SEM and the adhesion was measured by T-peel test. Plastic deformation of peeled metal strips was characterized quantitatively by using XRD technique. The film in which Cu is deposited at 100 mtorr has higher adhesion strength than the film in which Cu is deposited at 5 mtorr. And in the film with same deposition pressure of 100 mtorr, the adhesion strength is increased as the deposited thickness increases from 500 to 1000 nm. The adhesion change of Cu/Cr can be interpreted as the difference in plastic deformation.

• 한국재료학회지
• /
• 제19권11호
• /
• pp.625-630
• /
• 2009

Embedding of active devices in a printed circuit board has increasingly been adopted as a future electronic technology due to its promotion of high density, high speed and high performance. One responsible technology is to embedded active device into a dielectric substrate with a build-up process, for example a chipin-substrate (CiS) structure. In this study, desmear treatment was performed before Cu metallization on an FR-4 surface in order to improve interfacial adhesion between electroless-plated Cu and FR-4 substrate in Cu via structures in CiS systems. Surface analyses using atomic force microscopy and x-ray photoemission spectroscopy were systematically performed to understand the fundamental adhesion mechanism; results were correlated with peel strength measured by a 90o peel test. Interfacial bonding mechanism between electrolessplated Cu and FR-4 substrate seems to be dominated by a chemical bonding effect resulting from the selective activation of chemical bonding between carbon and oxygen through a rearrangement of C-C bonding rather than from a mechanical interlocking effect. In fact, desmear wet treatment could result in extensive degradation of FR-4 cohesive strength when compared to dry surface-treated Cu/FR-4 structures.

• 한국전기전자재료학회논문지
• /
• 제19권2호
• /
• pp.153-157
• /
• 2006

In this work, the effects of plasma treatment on surface properties of semiconductive silicone rubber were investigated in terms of X-ray photoelectron spectroscopy (XPS) and contact angles, The adhesion characteristics of semiconductive-insulating interface layer of silicone rubber were studied by measuring the T-peel strengths, The results of the chemical analysis showed that C-H bonds were broken due to plasma discharge and Silica-like bonds(SiOx, x=3${\~}$4) increased, It is thought that semiconductive silicone rubber surfaces treated with plasma discharge led to an increase in oxygen-containing functional groups, resulting in improving the degree of adhesion of the semiconductive-insulating interface layer of silicone rubber. However, the oxygen plama for 20 minute produces a damaged oxidized semiconductive silicone rubber layer, which acts as a weak layer producing a decrease in T-peel strength, These results are probably due to the modifications of surface functional groups or polar component of surface free energy of the semiconductive silicone rubber.