• Journal of Sensor Science and Technology
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• v.15 no.3
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• pp.168-172
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• 2006

Potentiometric $CO_{2}$ sensors were fabricated using a NASICON ($Na_{1+x}Zr_{2}Si_{X}P_{3-X}O_{12}$, 1.8 < x < 2.4) thick film and auxiliary layers. The powder of a precursor of NASICON with high purity was synthesized by a sol-gel method. By using the NASICON paste, an electrolyte was prepared on the alumina substrate by screen printing and then sintered at $1000^{\circ}C$ for 4 h. A series of $Na_{2}CO_{3}-CaCO_{3}$ auxiliary phases were deposited on the Pt sensing electrode. The electromotive force (emf) values were linearly dependent on the logarithm of $CO_{2}$ concentration in the range between 1,000 and 10,000 ppm. The device attached with $Na_{2}CO_{3}-CaCO_{3}$ (1:2 in mol.%) showed good sensing properties in the low temperatures.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.11a
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• pp.221-221
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• 2006

The SMD type P-N junction diode with ceramic package for diode case were fabricated. It was made this diode with simple process from $Al_2O_3$ ceramic chip, solder preform, diode chip, coating reagent and conductive paste for chip terrmination. Its merit is small size, easy manufacture. fast cooling with ceramic case. The electric characteristics of the diode such as reverse recovery time, breakdown voltage, forward voltage, and leakage current were 5 28ns, 1322V, 1.08V, $0.45{\mu}A$.

• ETRI Journal
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• v.35 no.6
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• Journal of the Korean Ceramic Society
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• v.44 no.1 s.296
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• pp.23-31
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• 2007

To examine the effects of chemical admixture on the fluidity and strength development of high chloride cement, experiments were conducted in which lignosulfonate (LS), naphthalenesulfonate (NS), and polycorboxylate (PC) were each added in standard and excessive amounts, and the results were as follows. 1. Because adding KCl to NS causes a decrease in flow, adding PC is better in maintaining high cement fluidity. 2. When cement contained much chloride comes in contact with water, hydration begins 4 h after contact and securing workability becomes difficult, but by adding PC, workability can be secured to 10 h. 3. The bound water ratio and compressive strength in aging 3 days occupy $70\sim80%$ of those in aging 28 days, and the early compressive strength increases not only by adding KCl, but also by chemical admixture. 4. Although compressive strength development is excellent in NS, PC, if NS is added excessively, hydration becomes slow and while the pore structures become slightly minute, the strength development decreases due to severe setting retardation.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.21-27
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• 2017

A soldering temperature of ($235{\pm}3$) $^{\circ}C$ is described in ISO 9455-15 for the copper corrosion test. However, this temperature is not suitable for performing lead-free solder pastes. We evaluated the compatibility of a lead-free solder paste in the experimental conditions of (Liquidus temperature + ($35{\pm}3$)) $^{\circ}C$. Based on the results after a Cu corrosion test, a proper temperature for Pb-free soldering was (melting point+($35{\pm}3$)) $^{\circ}C$. Criteria used to evaluate corrosion due to discoloration of flux residue is described in ISO 9455-15, but a more quantitative evaluation standard is needed. In this study, experimental error level was estimated by analyzing flux residue after a corrosion test for 72, 500 hours of specimens using EDS analysis with acceleration voltage. It was determined that the copper area at the flux residue boundary is suitable for the EDS analysis area.

• Korean Journal of Materials Research
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• v.13 no.8
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• pp.503-508
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• 2003

The purpose of this study is to investigate the effect of $V_2$$O_{5}$ addition on the Ag and Cu precipitation in the NiCuZn ferrite layers of 7.7${\times}$4.5${\times}$1.0 mm sized multi-layer chip inductors prepared by the screen printing method using 0∼0.5 wt% $V_2$$O_{5}$ -doped ferrite pastes. With increasing the $V_2$$O_{5}$ content and sintering temperature, Ag and Cu oxide coprecipitated more and more at the polished surface of ferrite layers during re-annealing at $840^{\circ}C$. It was thought that during the sintering process, V dissolved in the NiCuZn ferrite lattice and the Ag-Cu liquid phase of low melting point was formed in the ferrite layers due to the Cu segregation from the ferrite lattice and Ag diffusion from the internal electrode. During re-annealing at $840^{\circ}C$, the Ag-Cu liquid phase came out the polished surface of ferrite layers, and was decomposed into the isolated Ag particles and the Cu oxide phase during the cooling process.

• Korean Journal of Materials Research
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• v.28 no.11
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• pp.615-619
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• 2018

To produce carbon electrodes for use in perovskite solar cells, electrode samples are prepared by mixing various weight ratios of 35 nm nano carbon(NC) and $1{\mu}m$ graphite flakes(GF), GF/(NC+GF) = 0, 0.5, 0.7, and 1, in chlorobenzene(CB) solvent with a $ZrO_2$ binder. The carbon electrodes are fabricated as glass/FTO/carbon electrode devices for microstructure characterization using transmission electron microscopy, optical microscopy, and a field emission scanning electron microscopy. The electrical characterization is performed with a four-point probe and a multi tester. The microstructure characterization shows that an electrode with excellent attachment to the substrate and no surface cracks at weight ratios above 0.5. The electrical characterization results show that the sheet resistance is <$70{\Omega}/sq$ and the interface resistance is <$70{\Omega}$ at weight ratios of 0.5 and 0.7. Therefore, a carbon paste electrode with microstructure and electrical properties similar to those of commercial carbon electrodes is proposed with an appropriate mixing ratio of NC and GF containing a CB solvent and $ZrO_2$.

• ETRI Journal
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• v.41 no.3
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• pp.396-407
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• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

• Journal of the Architectural Institute of Korea Structure & Construction
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• v.34 no.3
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• pp.37-42
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• 2018

The use of fly ash in construction materials is increasing worldwide due the various advantages of using it, such as to produce durable concrete, or to use less cement and thus lower carbon dioxide emissions. The quality of fly ash is often determined by loss on ignition value (LOI), where an upper limit of LOI is set in each country for quality control purpose. However, due to many reasons, production of high LOI fly ash is increasing that cannot be utilized in concrete, ending up in landfill. In this study, the effect of fly ash use in cementitious materials on nitrogen oxides adsorption is examined. In particular, the effect of using high LOI, and thus high carbon content fly ash on nitrogen oxides adsorption is investigated. The results suggest that the higher carbon content fly ash is related to higher nitrogen dioxide adsorption, although normal fly ash was also more effective in nitrogen dioxide adsorption than ordinary portland cement. Also, higher replacement rate of up to 40% of fly ash is beneficial for nitrogen dioxide adsorption. These results demonstrate that high carbon fly ash can be used as construction materials in an environmentally friendly way where strength requirement is low and where nitrogen oxides emissions are high.

• Corrosion Science and Technology
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• v.20 no.6
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• pp.475-483
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• 2021

Additively manufactured titanium alloy is one of the promising materials in advanced medical industries. However, these additively manufactured alloys show corrosion properties different from those of conventional materials due to their unique microstructure. In this study, the effect of surface roughness and masking conditions on the results of the potentiodynamic polarization tests on additively manufactured or conventional Ti-6Al-4V alloys in artificial saliva solution with or without fluoride was investigated. The results showed that the corrosion potential was slightly lower with a flat cell with an O-ring than with masking tape. The corrosion rate was decreased with decreases in the surface roughness. Localized corrosion involving delamination of the surface layer occurred at 7 ~ 9 V (SSC) on the additively manufactured alloy in solution with or without fluoride when the samples were finished with 1000-grit SiC paper, whereas localized corrosion was not observed in the specimens finished with 1-㎛ alumina paste.