Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2006.11a
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- Pages.221-221
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- 2006
Manufacture and Characteristic of Surface Mounted Device Type Fast Recovery Diode with Ceramic Package
세라믹 패키지를 이용한 표면 실장형 다이오드의 제작과 특성 평가
- Chun, Myoung-Pyo (Advenced Materials and Components Lab, Korea Institute of Ceramic Engineering and Technology) ;
- Cho, Sang-Hyeok (Advenced Materials and Components Lab, Korea Institute of Ceramic Engineering and Technology) ;
- Cho, Jeong-Ho (Advenced Materials and Components Lab, Korea Institute of Ceramic Engineering and Technology) ;
- Kim, Byung-Ik (Advenced Materials and Components Lab, Korea Institute of Ceramic Engineering and Technology) ;
- Yu, In-Ki (Cob-Technology Co., LTd.)
- Published : 2006.11.09
Abstract
The SMD type P-N junction diode with ceramic package for diode case were fabricated. It was made this diode with simple process from