• Title/Summary/Keyword: paste materials

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Development of transparent dielectric paste for PDP (플라즈마 디스플레이용 투명 유전체 페이스트의 개발)

  • Kim, Hyung-Jong;Chung, Yong-Sun;Joo, Kyoung;Auh, Keun-Ho
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.9 no.1
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    • pp.50-54
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    • 1999
  • Plasma display panel is a potential candidate for HDTV, due to the fact that the screen size can easily be increased by a thick film technology. In this study, transparent dielectric materials which satisfied the requirements of dielectrics for PDP was developed using lead alumina borosilicate glasses. The Paste which had thixotropic behavior suitable for screen printing was made of this glass composition. the paste became more thixotropic as the particle size decreased. After firing, the cross sectional area of the thick film was analyzed by SEM. The voids in the thick film were removed using bimodal particle system. The dielectric thick film showed good adhesion characteristics.

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Heavy Metal Leaching, CO2 Uptake and Mechanical Characteristics of Carbonated Porous Concrete with Alkali-Activated Slag and Bottom Ash

  • Kim, G.M.;Jang, J.G.;Naeem, Faizan;Lee, H.K.
    • International Journal of Concrete Structures and Materials
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    • v.9 no.3
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    • pp.283-294
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    • 2015
  • In the present study, a porous concrete with alkali activated slag (AAS) and coal bottom ash was developed and the effect of carbonation on the physical property, microstructural characteristic, and heavy metal leaching behavior of the porous concrete were investigated. Independent variables, such as the type of the alkali activator and binder, the amount of paste, and $CO_2$ concentration, were considered. The experimental test results showed that the measured void ratio and compressive strength of the carbonated porous concrete exceeded minimum level stated in ACI 522 for general porous concrete. A new quantitative TG analysis for evaluating $CO_2$ uptake in AAS was proposed, and the result showed that the $CO_2$ uptake in AAS paste was approximately twice as high as that in OPC paste. The leached concentrations of heavy metals from carbonated porous concrete were below the relevant environmental criteria.

The Use of Semi-Adiabatic Calorimetry for Hydration Studies of Cement Paste

  • Chung, Chul-Woo;Kim, Ji-Hyun;Lee, Soo-Yong
    • Journal of the Korea Institute of Building Construction
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    • v.16 no.2
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    • pp.185-192
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    • 2016
  • The semi-adiabatic calorimetry technique is a robust and easy technique that can be used to measure the temperature rise of concrete. This method is often used for investigating the maturity of concrete, as well as to predict maximum temperature rise of mass concrete using various heat loss compensating models. Semi-adiabatic calorimetry can also be used for predicting setting time of concrete. However, it has seldom been used to investigate the hydration characteristics of various cement paste samples. In this research, semi-adiabatic calorimetry and X-ray diffraction methods were used to investigate the hydration characteristics of 3 different ASTM type I Portland cements. First derivative of temperature rise (dT/dt) curve was used to isolate individual peaks. Based on the results of the experiments, a combination of dT/dt curve with XRD could be used to successfully identify hydration at a specific time period, showing its potential to be used as an alternative tool for hydration studies of cement-based materials.

Effect of Lead Free Glass Frit Compositions on Properties of Ag System Conductor and RuO2 Based Resistor Pastes (Ag계 도체 및 RuO2계 저항체 페이스트의 특성에 미치는 무연계 글라스 프릿트 조성의 영향)

  • Koo, Bon-Keup
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.3
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    • pp.200-207
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    • 2011
  • Abstract: The effect of lead free glass frit compositions on the properties of thick film conductor and resistor pastes were investigated. Two types lead free frits, HBF-A(without $Bi_2O_3$) and HBF-B(with $Bi_2O_3$) were made from $SiO_2$, $B_2O_3$, $Al_2O_3$, CaO, MgO, $Na_2O$, $K_2O$, ZnO, MnO, $ZrO_2$, $Bi_2O_3$. And Ag based conductor pastes and $RuO_2$ based resistor paste were prepared by mixed with these frits and functional phase(Ag and $RuO_2$), and organic vehicle. The properties of thick film conductor and resistor sintered at $850^{\circ}C$ were studied after printing on $Al_2O_3$ substrate. The morphology of the sintered films surface were SEM and EDS were carried out to analysis the chemical composition on resistor surface and state of Ru atom in frit matrix.

Rheology Characteristics of Cement Paste with Blast Furnace Slag Depending on CBS-Dust Contents (CBS-Dust 치환율에 따른 고로슬래그 미분말을 함유한 시멘트 페이스트의 레올로지특성)

  • Park, Byoung-Joo;Sin, Se-Jun;Lee, Dong-Joo;Kim, Jong;Han, Min-Cheol;Han, Cheon-Goo
    • Proceedings of the Korean Institute of Building Construction Conference
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    • 2020.06a
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    • pp.144-145
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    • 2020
  • Recently, the cement industry has been using various wastes as raw materials and fuel for cement as an eco-friendly business. However, most of these waste resources contain large amounts of chloride and alkali, which are concentrated in manufacturing facilities and adversely affect cement production products. Accordingly, in the cement production process, the chlorine ion contained in cement is managed by introducing the Chlorine Bypass System (CBS) into the manufacturing facility and releasing the dust. However, the processing volume of CBS-Dust has been limited due to the shortage of domestic processing companies, and the cost has also been raised, requiring measures to be taken in dealing with CBS-Dust. In this study, rheological properties of CBS-Dust incorporated paste are tested. With the increase of CBS-Dust, flow was decreased due to enhanced viscosity.

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Evaluation Method for Snap Cure Behavior of Non-conductive Paste for Flip Chip Bonding (플립칩 본딩용 비전도성 접착제의 속경화거동 평가기법)

  • Min, Kyung-Eun;Lee, Jun-Sik;Lee, So-Jeong;Yi, Sung;Kim, Jun-Ki
    • Journal of Welding and Joining
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    • v.33 no.5
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    • pp.41-46
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    • 2015
  • The snap cure NCP(non-conducive paste) adhesive material is essentially required for the high productivity flip chip bonding process. In this study, the accessibility of DEA(dielectric analysis) method for the evaluation of snap cure behavior was investigated with comparison to the isothermal DSC(differential scanning calorimetry) method. NCP adhesive was mainly formulated with epoxy resin and imidazole curing agent. Even though there were some noise in the dielectric loss factor curve measured by DEA, the cure start and completion points could be specified clearly through the data processing of cumulation and deviation method. Degree of cure by DEA method which was measured from the variation of the dielectric loss factor of adhesive material was corresponded to about 80% of the degree of cure by DSC method which was measured from the heat of curing reaction. Because the adhesive joint cured to the degree of 80% in the view point of chemical reaction reveals the sufficient mechanical strength, DEA method is expected to be used effectively in the estimation of the high speed curing behavior of snap cure type NCP adhesive material for flip chip bonding.

Application of DEM with Coarse Graining Method to Fluidal Material Behavior Analysis (유동성 재료의 동적 거동 해석을 위한 입자확대법 기반 DEM의 적용)

  • Yun, Taeyoung
    • International Journal of Highway Engineering
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    • v.19 no.6
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    • pp.23-30
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    • 2017
  • PURPOSES : In this paper, the applicability of DEM to a coarse graining method was evaluated by simulating a series of minicone tests for cement paste. METHODS : First, the fundamental physical quantities that are used in a static liquid bridge model were presented with three basic quantities based on the similarity principle and coarse graining method. Then, the scale factors and surface tensions for six different sizes of particles were determined using the relationship between the physical quantities and the basic quantities. Finally, the determined surface tensions and radii were utilized to simulate the fluidal behavior of cement paste under a minicone test condition, and the final shape of the cement paste with reference DEM particle radii was compared with the final shape of the others. RESULTS : The simulations with adjusted surface tensions for five different radii of particles and surface tension showed acceptable agreement with the simulation with regard to the reference size of the particle, although disagreement increases as the sizes of the particle radii increase. It seems reasonable to increase the particle radii by at least 0.196 cm considering the computational time reduction of 162 min. CONCLUSIONS : The coarse graining method based on the similarity principle is applicable for simulating the behavior of fluidal materials when the behavior of the materials can be described by a static liquid bridge model. However, the maximum particle radius should be suggested by considering not only the scale factor but also the relationship of the particle size and number with the radius of the curve of the boundary geometry.

CIGS 태양전지 용액전구체 paste공정 연구

  • Park, Myeong-Guk;An, Se-Jin;Yun, Jae-Ho;Kim, Dong-Hwan;Yun, Gyeong-Hun
    • Proceedings of the Materials Research Society of Korea Conference
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    • 2009.05a
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    • pp.27.1-27.1
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    • 2009
  • Chalcopyrite구조의CIS 화합물은 직접천이형 반도체로서 높은 광흡수 계수 ($1\times10^5\;cm^{-1}$)와 밴드갭 조절의 용이성 및 열적 안정성 등으로 인해 고효율 박막 태양전지용 광흡수층 재료로 많은 관심을 끌고 있다. CIS 계 물질에 속하는 $Cu(InGa)Se_2$ (CIGS) 태양전지의 경우 박막 태양전지 중 세계 최고 효율인 20%를 달성한 바 있으며, 이는 기존 다결정 웨이퍼형 실리콘 태양전지의 효율에 근접하는 수치이다. 그러나 이러한 우수한 효율에도 불구하고 박막 증착시 동시증발장치 혹은 스퍼터링장치와 같은 고가 진공장비를 사용하게 되면 공정단가가 높을 뿐만 아니라 사용되는 재료의 20-50%의 손실을 감수해야만 한다. 또한 대면적 Cell제작에 어려움이 있기 때문에 기술개발 이후의 상용화 단계를 고려할 때 광흡수층 박막 제조 공정단가를 획기적으로 낮출 수 있고 대면적화가 용이한 신 공정 개발이 필수적이다. 이러한 관점에서 비진공 코팅방법에 의한 CIS 광흡수층 제조 기술은 CIS 태양전지의 저가화 및 대면적화를 가능케 하는 차세대 기술로 인식되고 있고 최근 급속한 발전을 이루고 있는 미세 입자 합성, 제어 및 응용 기술에 부합하여 많은 세계 연구기관 및 기업체에서 활발히 연구를 진행하고 있다. 비진공 방식에 의한 CIS 광흡수층 제조 기술은 전구체 물질의 형태에 따라 크게 입자형 전구체를 사용하는 방법과 용액 전구체를 사용하는 방법으로 나눌 수 있다. 본 연구에서는 용액 전구체를 paste 공정으로 실험하였다. 이는 용액전구체 물질 제조가 입자형 전구체 제조에 비해 매우 간단하고, 전구체 물질 내 구성원소의 원자비를 쉽게 조절할 수 있다는 장점 및 사용효율이 높아 소량의 source로도 박막 제작이 가능해 공정 단가 절감에 큰 효과가 기대되기 때문이다. 실험에 사용 된 용액전구체는 $Cu(NO_3)$$InCl_3$, $Ga(NO_3)$를 Cu, In, Ga 출발 물질로 선정하여 이를 메탄올에 완전히 용해시켜 binder인 셀룰로오즈와 메탄올을 섞은 용액과 혼합하여 전구체 슬러리를 형성하였다. 이 슬러리를 paste공정으로 precursor막을 입히고 저온 건조 후 Se 분위기에서 열처리하여 CIGS박막을 얻을 수 있었다. 박막의 특성을 XRD, SEM, AES, TGA등으로 분석하였다.

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