• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.112-112
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• 2008

최근 Ruthenium (Ru) 은 높은 화학적 안정성, 누설전류에 대한 높은 저항성, 저유전체와의 높은 안정성 등과 같은 특성으로 인해 금속층-유전막-금속층 캐패시터의 하부전극으로 각광받고 있다. 또한 Cu와의 우수한 Adhesion 특성으로 인해 Cu 배선에서의 Cu 확산 방지막으로도 주목받고 있다. 그러나 이렇게 형성된 Ru 하부전극의 각 캐패시터간의 분리와 평탄화를 위해서는 CMP 공정이 도입이 필요하다. 이러한 CMP 공정에 공급되는 Slurry 에는 부식액, pH 적정제, 연마입자 등이 첨가되는데 이때 연마입자가 응집하여 Slurry의 분산 안전성 저하에 영향을 줄수 있다. 이로 인해 응집된 Slurry는 Scratch와 Delamination 과 같은 표면 결함을 유발할 수 있으며, Slurry의 저장 안정성을 저하시켜 Slurry의 물리적 화학적 특성을 변화시킬 수 있다. 그리하여 본 연구에서는 Ru CMP Slurry에서의 Surfactant와 같은 분산 안정제에 따른 Surface tension, Zeta potential, Particle size, Sedimentation의 분석을 통해 Slurry 안정성에 대한 영향을 살펴보았다. 그 결과 pH9 조건의 31ppm Dispersant 농도에서 50%이상의 Sedimentation 상승효과를 얻을 수 있었다. 또한 선택된 Surfactant가 첨가된 Ru CMP Slurry를 제조하여 Ru wafer의 Static etch rate, Passivation film thickness 와 Wettability를 비교해 보았다. 그리고 CMP 공정을 실시하여 Ru의 Removal rate와 TEOS에대한 Selectivity를 측정해 보았다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.4
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• pp.378-383
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• 2004

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten(W) on SiO$_2$ layer, the Ti/TiN barrier layer is usually deposited onto SiO$_2$ for increasing adhesion ability with W film. Generally, for the W-CMP(chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidant on the polishing selectivity of W/Ti/TiN layer was investigated. The alumina(A1$_2$O$_3$)-based slurry with $H_2O$$_2$ as the oxidizer was used for CMP applications. As an experimental result, for the case of 5 wt％ oxidizer added, the removal rates were improved and polishing selectivity of 1.4:1 was obtained. It was also found that the CMP characteristics of W and Ti metal layer including surface roughness were strongly dependent on the amounts of $H_2O$$_2$ oxidizer.

• Corrosion Science and Technology
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• v.16 no.2
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• pp.64-68
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• 2017

The interactions between corrosion pits on stainless steel under loading conditions are studied by using a cellular automata model coupled with finite element method at a mesoscopic scale. The cellular automata model focuses on a metal/film/electrolyte system, including anodic dissolution, passivation, diffusion of hydrogen ions and salt film hydrolysis. The Chopard block algorithm is used to improve the diffusion simulation efficiency. The finite element method is used to calculate the stress concentration on the pit surface during pit growth, and the effect of local stress and strain on anodic current is obtained by using the Gutman model, which is used as the boundary conditions of the cellular automata model. The transient current characteristics of the interactions between corrosion pits under different simulation factors including the breakdown of the passive film at the pit mouth and the diffusion of hydrogen ions are analyzed. The analysis of the pit stability product shows that the simulation results are close to the experimental conclusions.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.8
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• pp.479-483
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• 2017

The effect of $NH_3$ plasma treatment on device characteristics was confirmed for an optimized thin film transistor of poly-Si formed by ELA. When C-V curve was checked for MIS (metal-insulator-silicon), Dit of $NH_3$ plasma treated and MIS was $2.7{\times}10^{10}cm^{-2}eV^{-1}$. Also in the TFT device case, it was decreased to the sub-threshold slope of 0.5 V/decade, 1.9 V of threshold voltage and improved in $26cm^2V^{-1}S^{-1}$ of mobility. Si-N and Si-H bonding reduced dangling bonding to each interface. When gate bias stress was applied, the threshold voltage's shift value of $NH_3$ plasma treated device was 0.58 V for 1,000s, 1.14 V for 3,600s, 1.12 V for 7,200s. As we observe from this quality, electrical stability was also improved and $NH_3$ plasma treatment was considered effective for passivation.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.312.2-312.2
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• 2013

태양전지에서 SiNX층은 반사방지막 역할과 표면 페시베이션의 역할을 동시에 하고 있다. SiNx에서 굴절율과 두께는 반사율과 밀접한 관계가 있으며 동시에 표면 소수캐리어 수명에도 큰 영향을 미친다. 따라서 굴절율과 두께를 조절하여 낮은 반사도와 긴 소수캐리어 수명을 가지는 SiNx 박막을 제조하여야 우수한 효율의 태양전지를 제조할 수 있다. 본 연구에서는 다양한 굴절율과 두께의 SiNx 박막을 결정질 실리콘 태양전지에 적용하여 효율과의 상관관계를 해석하였다. SiNx 박막은 PECVD장비를 이용하여 RF파워, 가스혼합량, 증착시간 등을 각각 변화시키며 형성하였다. RF 파워는 100~500 W로 변화 시켰고 혼합가스 변화는 SiH4가스와 NH3가스, Ar가스를 각각 주입하며 증착하였다. RF 파워 300W, 가스혼합량 SiH4 90sccm, NH3 26sccm, Ar 99sccm과 기판 온도 $300^{\circ}C$, 공정시간 58초에서 포면 반사율 1.09%와 굴절률 1.965, 두께 76nm를 갖는 SiNx층을 형성 할 수 있었다. SiNx층을 증착하여 셀을 제작한 결과, 개방전압: 0.612V, 전류밀도: 38.49 mA/cm2, 충실도: 75.62%, 효율: 17.82%를 얻을 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.246-246
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• 2013

Atomic layer deposition (ALD)에 의해 증착된 알루미늄 산화막($Al_2O_3$)은 고효율 결정질 실리콘 태양전지를 위한 우수한 패시베이션 효과를 보인다. $Al_2O_3$은 고정 음전하를 가지고 있기때문에 p-형 태양전지 후면에서 field effect passivation에 의한 효과적인 표면 패시베이션을 형성한다. 하지만 ALD에 의한 $Al_2O_3$ 증착은 긴 공정시간이 필요하다. 이는 기존의 태양전지 산업에 적합하지 않다. 본 논문에서는 공정 시간의 단축을 위해 plasma-assisted atomic layer deposition (PA-ALD) 기술을 사용함으로서 $Al_2O_3$을 증착했다. PA-ALD 기술은 trimethyaluminum (TMA)와 plasma 분위기에서의 $O_2$ 가스를 사용하여 표면 반응을 한다. $Al_2O_3$ 층의 특성을 최적화하기 위해 증착 온도를 $150{\sim}250^{\circ}C$의 범위에서 가변하고, 열처리 온도와 시간을 변화하였다. 결과적으로, 실리콘 웨이퍼를 이용하여 $1250^{\circ}C$의 공정온도에서 증착한 $Al_2O_3$은 $400^{\circ}C$에서 10분 동안의 열처리 온도와 시간에서 1,610 ${\mu}s$의 최고의 유효 반송자 수명을 보였다.

• Korean Journal of Optics and Photonics
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• v.1 no.1
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• pp.73-86
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• 1990

The technique of Spectroscopic Ellipsometry (SE) has been examined with emphasis on its inherent sensitivity to the existence of thin films or surface equivalents. A brief review of related theories like the Fresnel reflection coefficients, the effect of a multilayer upon reflectivities, together with the validity of the effective medium theory and the modelling procedure, is followed by a short description of the experimental setup of a rotating polarizer type SE as well as the necessful expressions which lead to tan and cos. Out of its numerous, successful applications, a few are exampled to convince a reader that SE can be applied to a variety of research fields related to surface, interface and thin films. Specifically, those are adsorption and/or desorption on metals or semiconductors, oxidation process, formation of passivation layers on an electrode, thickness determination, interface between semiconductor and its oxide, semiconductor heterojunctions, surface microroughness, void distribution of dielectric, optical thin films, depth profile of multilayered samples, in-situ or in-vitro characterization of a solid surface immersed in electrolyte during electrochemical, chemical, or biological treatments, and so on. It is expected that the potential capability of SE will be widely utilized in a very near future, taking advantage of its sensitivity to thin films or surface equivalents, and its nondestructive, nonperturbing characteristics.

• Corrosion Science and Technology
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• v.17 no.6
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• pp.310-316
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• 2018

The effect of passive film on corrosion of metals and alloys in a static corrosive environment has been studied by many researchers and is well known, however few studies have been conducted on the electrochemical measurement of metals and alloys during cavitation corrosion conditions, and there are no test standards for electrochemical measurements 'During cavitation' conditions. This study used commercially additive manufactured(AM) pure titanium in tests of anodic polarization, corrosion potential measurements, AC impedance measurements, and repassivation. Tests were performed in 3.5% NaCl solution under three conditions, 'No cavitation', 'After cavitation', and 'During cavitation' condition. When cavitation corrosion occurred, the passive current density was greatly increased, the corrosion potential largely lowered, and the passive film revealed a small polarization resistance. The current fluctuation by the passivation and repassivation phenomena was measured first, and this behavior was repeatedly generated at a very high speed. The electrochemical corrosion mechanism that occurred during cavitation corrosion was based on result of the electrochemical properties 'No cavitation', 'After cavitation', and 'During cavitation' conditions.

• Corrosion Science and Technology
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• v.20 no.6
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• pp.412-425
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• 2021

Because austenitic stainless steel causes localized corrosion such as pitting and crevice corrosion in environments containing chlorine, corrosion resistance is improved by surface treatment or changes of the alloy element content. Accordingly, research using cyclic potentiodynamic polarization experiment to evaluate the properties of the passivation film of super austenitic stainless steel that improved corrosion resistance is being actively conducted. In this investigation, the electrochemical properties of austenitic stainless steel and super austenitic stainless steel were compared and analyzed through cyclic potentiodynamic polarization experiment with varying temperatures. Repassivation properties were not observed in austenitic stainless steels at all temperature conditions, but super austenitic stainless steels exhibited repassivation behaviors at all temperatures. This is expressed as α values using a relational formula comparing the localized corrosion rate and general corrosion rate. As the α values of UNS S31603 decreased with temperature, the tendency of general corrosion was expected to be higher, and the α value of UNS N08367 increased with increasing temperatures, so it is considered that the tendency of localized corrosion was dominant.

• Journal of Sensor Science and Technology
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• v.32 no.6
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• pp.425-431
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• 2023

An asymmetric metal-semiconductor-metal Al_0.24Ga_0.76N ultraviolet (UV) sensor was fabricated, and the effects of local Joule heating were investigated. After dielectric breakdown, the current density under a reverse bias of 2.0 V was 1.1×10^-9 A/cm², significantly lower than 1.2×10^-8 A/cm² before dielectric breakdown; moreover, the Schottky behavior of the Ti/Al/Ni/Au electrode changed to ohmic behavior under forward bias. The UV-to-visible rejection ratio (UVRR) under a reverse bias of 7.0 V before dielectric breakdown was 87; however, this UVRR significantly increased to 578, in addition to providing highly reliable responsivity. Transmission electron microscopy revealed interdiffusion between adjacent layers, with nitrogen vacancies possibly formed owing to local Joule heating at the AlGaN/Ti/Al/Ni/Au interfaces. X-ray photoelectron microscopy results revealed decreases in the peak intensities of the O 1s binding energies associated with the Ga-O bond and OH-, which act as electron-trapping states on the AlGaN surface. The reduction in dark current owing to the proposed local heating method is expected to increase the sensing performance of UV optoelectronic integrated devices, such as active-pixel UV image sensors.