• Journal of Welding and Joining
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• v.12 no.4
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• pp.110-116
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• 1994

This paper has been researched bondability of electronics devices, such as lead frame and the thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realized fluxless bonding process with filler metal such as plating layers.

• Particle and aerosol research
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• v.8 no.2
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• pp.75-81
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• 2012

The strength of lumped cokes can be represented by some index numbers. Although some indexes are suggested, these indexes are not enough to enlighten fracture mechanism. To find essential mechanism, a computational way, discrete element method, is applied to the uniaxial compression test for cylindrical specimen. The cylindrical specimen is a kind of lumped particle mass with parallel bonding that will be broken when the normal stress and shear stress is over a critical value. It is revealed that the primary factors for cokes fracture are parallel spring constant, parallel bond strength, bonding radius and packing ratio the parallel bond strength and radius of the parallel combination the packing density. Especially, parallel spring constant is directly related with elastic constant and yield strength.

• International Journal of Naval Architecture and Ocean Engineering
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• v.13 no.1
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• pp.136-146
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• 2021

This paper aims to numerically estimate the dynamic ice load on a conical structure. The Discrete Element Method (DEM) is employed to model the level ice as the assembly of numerous spherical particles. To mimic the realistic fracture mechanism of ice, the parallel bonding method is introduced. Cases with four different ice drifting velocities are considered in time domain. For validation, the statistics of time-varying ice forces and their frequencies obtained by numerical simulations are extensively compared against the physical model-test results. Ice properties are directly adopted from the targeted experimental test set up. The additional parameters for DEM simulations are systematically determined by a numerical three-point bending test. The findings reveal that the numerical simulation estimates the dynamic ice force in a reasonably acceptable range and its results agree well with experimental data.

• Steel and Composite Structures
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• v.31 no.3
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• pp.233-242
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• 2019

Early detection of damage bonding state such as insufficient bonding strength and interface partial contact defect for the explosive clad pipe is crucial in order to avoid sudden failure and even catastrophic accidents. A generalized and efficient model of the explosive clad pipe can reveal the relationship between bonding state and vibration characteristics, and provide foundations and priory knowledge for bonding state detection by signal processing technique. In this paper, the slender explosive clad pipe is regarded as two parallel elastic beams continuously joined by an elastic layer, and the elastic layer is capable to describe the non-uniform bonding state. By taking the characteristic beam modal functions as the admissible functions, the Rayleigh-Ritz method is employed to derive the dynamic model which enables one to consider inhomogeneous system and any boundary conditions. Then, the proposed model is validated by both numerical results and experiment. Parametric studies are carried out to investigate the effects of bonding strength and the length of partial contact defect on the natural frequency and forced response of the explosive clad pipe. A potential method for identifying the bonding quality of the explosive clad pipe is also discussed in this paper.

• Ocean Systems Engineering
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• v.11 no.4
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• pp.313-330
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• 2021

In this study, the dynamic interaction between an Arctic Spar and drifting level ice is examined in time domain using the newly developed ice-hull-mooring coupled dynamics program. The in-house program, CHARM3D, which is the hull-riser-mooring coupled dynamic simulator is extended by coupling with the open-source discrete element method (DEM) simulator, LIGGGHTS. In the LIGGGHTS module, the parallel-bonding method is implemented to model the level ice using an assembly of multiple bonded spherical particles. As a case study, a spread-moored Artic Spar platform, whose hull surface near waterline is the inverted conical shape, is chosen. To determine the breaking-related DEM parameter (the critical bonding strength), the four-point numerical bending test is used. A series of numerical simulations is systematically performed under the various ice conditions including ice drift velocity, flexural strength, and thickness. Then, the effects of these parameters on the ice force, platform motions, and mooring tensions are discussed. The simulations reveal various features of dynamic interactions between the drifting ice and moored platform for various ice conditions including the novel synchronous resonance at low ice speed. The newly developed simulator is promising and can repeatedly be used for the future design and analysis including ice-floater-mooring coupled dynamics.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.43-44
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• 2000

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.9
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• pp.98-105
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• 1995

Recent microwave IC's reach to the extent of high operating frequencies at which bonding wires limit their performance as dominant parasitic components. Double bonding wires separated by an internal angle have been firstly characterized using the Method of Moments with the incorporation of the ohmic resistance calculated by the phenomenological loss equivalence method. For a 30$^{\circ}$ internal angle, the calculated total reactance is 45% less than that of a single bonding wire due to the negative mutual coupling effect. The radiation effect has been observed decreasing the mutual inductance, whereas for parallel bonding wires it greatly increases the mutual inductance. This calculation results can be widely used for designing and packaging of high frequency and high density MMIC's and OEIC's.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1994.11a
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• pp.206-209
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• 1994

This paper has been researched bondability of electronic devices, such as lead frame and thick film of Ag/Pd on an alumina substrate by different heat sources. To obtain the bonds with high quality, it is very important to control both the thermal distribution of the bonds and it stability, because electronics components is consist of different materials. Therefore, this paper clarifies not only heat mechanism of micro parallel gap resistance bonding method and pulse heat tip bonding method but also investigates selection of heat sources with micro-electronic materials for bonding. Finally, it is realzed fluxless bonding process with filler metal such as plating layers.

• Korean Journal of Materials Research
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• v.12 no.6
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• pp.508-512
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• 2002

$2000{\AA}-SiO_2/Si(100)$ and $560{\AA}-Si_3N_4/Si(100)$ wafers, which are 10 cm in diameter, were directly bonded using a rapid thermal annealing method. We fixed the anneal time of 30 second and varied the anneal temperatures from 600 to $1200^{\circ}C$. The bond strength of bonded wafer pairs at given anneal temperature were evaluated by a razor blade crack opening method and a four-point bonding method, respectively. The results clearly slow that the four-point bending method is more suitable for evaluating the small bond strength of 80~430 mJ/$\m^2$ compared to the razor blade crack opening method, which shows no anneal temperature dependence in small bond strength.

• Journal of Korean Tunnelling and Underground Space Association
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• v.10 no.2
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• pp.105-118
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• 2008

Shotcrete is one of the main support materials in tunnelling. Its bonding state on excavated rock surfaces controls the safety of the tunnel: De-bonding of shotcrete from an excavated surface decreases the safety of the tunnel. Meanwhile, the bonding state of shotcrete is affected by blasting during excavation at tunnel face as well as bench cut. Generally, the bonding state of shotcrete can be classified as void, de-bonded, or fully bonded. In this study, the state of the back-surface of shotcrete is investigated using impact-echo (IE) techniques. Numerical simulation of IE technique is performed with ABAQUS. Signals obtained from the IE simulations were analyzed at time, frequency, and time-frequency domains, respectively. Using an integrated active signal processing technique coupled with a Short-Time Fourier Transform (STFT) analysis, the bonding state of the shotcrete can be evaluated accurately. As the bonding state worsens, the amplitude of the first peak past the maximum amplitude in the time domain waveform and the maximum energy of the autospectral density are increasing. The resonance frequency becomes detectable and calculable and the contour in time-frequency domain has a long tail parallel to the time axis. Signal characteristics with respect to ground condition were obtained in case of fully bonded condition. As the ground condition worsens, the length of a long tail parallel to the time axis is lengthened and the contour is located in low frequency range under 10 kHz.