• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.11a
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• pp.545-546
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• 2010

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.749-750
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• 2011

• Korean Journal of Food Science and Technology
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• v.46 no.6
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• pp.739-742
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• 2014

This study investigated the effect of perforation by the Indian meal moth (Plodia interpunctella) larvae on various flexible food-packaging films, in relation to their thickness and type. Among the various flexible packaging films, polyethylene (PE), aluminum foil (AF), polypropylene (PP), polystyrene (PS), and polyethylene terephthalate (PET) were selected for this study due to their wide usage in food packaging. Based on their thickness, film penetration by P. interpunctella larvae was measured as in following order: PP, $20{\mu}m$; AF, $9{\mu}m$; PET, $12{\mu}m$; PP, $30{\mu}m$; PS, $30{\mu}m$; PE, $40{\mu}m$; PE, $35{\mu}m$; PS, $60{\mu}m$; and PET, $16{\mu}m$. P. interpunctella larvae rapidly penetrated through the packaging films regardless of their thickness and type. In particular, it was observed that PP of $20{\mu}m$ and PS of $30{\mu}m$ were completely penetrated by P. interpunctella larvae within 72 h, rendering thin PP and PS films less valuable as anti-insect packaging films. Our results show that the perforations by P. interpunctella larvae were observed in the thin films. These results imply that each packaging film has a marginal thickness against the perforations by P. interpunctella larvae.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.25-32
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• 2012

Package for artificial satellite is to produce mass production for high package with reliability certification as well as develop SDRAM (synchronous dynamic RAM) module which has such as miniaturization, mass storage, and high reliability in space environment. It requires sophisticated technology with chip stacking or package stacking in order to increase up to 4Gbits or more for mass storage with space technology. To make it better, we should secure suitable processes by doing design, manufacture, and debugging. Pin type PCB substrate was then applied to QFP-Pin type 3D memory package fabrication. These results show that the 3D memory package for artificial satellite scheme is a promising candidate for the realization of our own domestic technologies.

• Journal of the Semiconductor & Display Technology
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• v.16 no.2
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• pp.19-26
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• 2017

The cure properties of ethoxysilyl bisphenol A type epoxy resin (Ethoxysilyl-DGEBA) systems with different hardeners were investigated, comparing with DGEBA and Diallyl-DGEBA epoxy resin systems. The cure kinetics of these systems were analyzed by differential scanning calorimetry with an isothermal approach, and the kinetic parameters of all systems were reported in generalized kinetic equations with diffusion effects. The Ethoxysilyl-DGEBA epoxy resin system showed lower cure conversion rates than DGEBA and Diallyl-DGEBA epoxy resin systems. The conversion rates of these epoxy resin systems with DDM hardener are lower than those with HF-1M hardener. It can be considered that the optimum hardener for Ethoxysilyl-DGEBA epoxy resin system is Phenol Novolac type. These lower cure conversion rates in the Ethoxysilyl-DGEBA epoxy resin systems could be explained by the retardation of reaction molecule movements according to the formation of organic-inorganic hybrid network structure by epoxy and ethoxysilyl group in Ethoxysilyl- DGEBA epoxy resin system.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1551_1552
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• 2009

In this paper, we presented the packaging technologies of CMOS ISFET(Ion Sensitive Field Effect Transistor) pH sensor using post-CMOS process and MCP(Multi Chip Packaging). We have proposed and developed two types of packaging technology. one is one chip, which sensing layer is deposited on the gate metal of standard CMOS ISFET, the other is two chip type, which sensing layer is separated from CMOS ISFET and connected by bonding wire. These proposed packaging technologies would make it easy to fabricate CMOS ISFET pH sensor and to make variety types of pH sensor.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.3
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• pp.170-174
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• 2017

In 3 electrode reflective displays using a plastic substrate, unstable packaging induces particle clumping and optical degradation due to external air inflow and electronic ink evaporation. In this work, we fabricate 3 electrode electronic paper using glass wafer, ITO/plastic film, and ITO/glass/gas barrier film as an upper substrate after injecting electronic ink onto the lower substrate. Then, we studied its properties. After operating under stress conditions for 336 hours at $85^{\circ}C$ and 75% humidity, the reflectivity of driven e-paper panels with white color was 25.5% for the panels using glass wafer, 22.5% for plastic film including a gas barrier layer, and 16% for plastic film only. From these optical properties, we conclude that gas barrier film improves upper film isolation as a desirable packaging method.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.4 no.2
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• pp.33-38
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• 1998

In point of flexographic printing on generally corrugated fiberboard cartons, the precision of film master and the adequate compression rate are very important factor in bar-code printing. Also, the complete system including scanner is essential for the purpose of enhancing the reading rate. The film master had good precision when the film was prepared by means of printing/developing machine after transformation of input bar-code number through transceiver, and the BWR 100 showed better compression rate than BWR 200. Also considering the bar-code reading, the complete system targeting the reading rate above 99.8% could be configured by Omni-Directional Scanner type accomplishing the reading rate above 99.5%.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.6
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.20 no.2
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• pp.35-39
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• 2014

One-way degassing valves are designed to allow pressure to be released from an air-tight package while preventing air from getting back into the package. Air, especially the oxygen ($O_2$) portion of air, can have negative effects on the package contents and its freshness. The most common application of the one-way degassing valve is for fresh roasted coffee. Demands of one-way degassing valves have been increasing with the high growth of global coffee market. In this study, we have developed one-way degassing valves for coffee and food packaging using ring type rubber disk, named SP valve. Its quality and performance was verified with test results to be equal with that of global top maker's product, Goglio valve. SP valves showed 820~1200 Pa of opening pressure, 10~50 Pa of closing pressure, 1.2~1.6 L/ min of flow rate. And, the SP valve applicable to ferment food packaging is expected to contribute to globalize Korean traditional food.