Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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3D SDRAM Package Technology for a Satellite

인공위성용 3차원 메모리 패키징 기술

  • 임재성 (하나마이크론(주) 연구소) ;
  • 김진호 (하나마이크론(주) 연구소) ;
  • 김현주 (하나마이크론(주) 연구소) ;
  • 정진욱 (하나마이크론(주) 연구소) ;
  • 이혁 (하나마이크론(주) 연구소) ;
  • 박미영 (KAIST 인공위성연구센터) ;
  • 채장수 (KAIST 인공위성연구센터)
  • Received : 2012.03.23
  • Accepted : 2012.03.29
  • Published : 2012.03.31
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Abstract

Package for artificial satellite is to produce mass production for high package with reliability certification as well as develop SDRAM (synchronous dynamic RAM) module which has such as miniaturization, mass storage, and high reliability in space environment. It requires sophisticated technology with chip stacking or package stacking in order to increase up to 4Gbits or more for mass storage with space technology. To make it better, we should secure suitable processes by doing design, manufacture, and debugging. Pin type PCB substrate was then applied to QFP-Pin type 3D memory package fabrication. These results show that the 3D memory package for artificial satellite scheme is a promising candidate for the realization of our own domestic technologies.

Keywords

References

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