• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.121-127
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• 2022

Micro-LED is a light-emitting diode smaller than 100 ㎛ in size. It attracts much attention due to its superior performance, such as resolution, brightness, etc., and is considered for various applications like flexible display and VR/AR. Micro-LED display requires a mass transfer process to move micro-LED chips from a LED wafer to a target substrate. In this study, we proposed a vacuum chuck method as a mass transfer technique. The vacuum chuck was fabricated with MEMS technology and PDMS micro-mold process. The spin-coating approach using a dam structure successfully controlled the PDMS mold's thickness. The vacuum test using solder balls instead of micro-LED confirmed the vacuum chuck method as a mass transfer technique.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.31-36
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• 2015

The demand for multi-functionality, high density, high performance, and miniaturization of IC devices has caused the technology paradigm shift for electronic packaging. So, thermal management of new packaged chips becomes a bottleneck for the performance of next generation devices. Among various thermal solutions such as heat sink, heat spreader, TIM, thermoelectric cooler, etc. on-chip liquid cooling module was investigated in this study. Micro-channel was fabricated on Si wafer using a deep reactive ion etching, and 3 different micro-channel designs (straight MC, serpentine MC, zigzag MC) were formed to evalute the effectiveness of liquid cooling. At the heating temperature of $200^{\circ}C$ and coolant flow rate of 150ml/min, straight MC showed the high temperature differential of ${\sim}44^{\circ}C$ after liquid cooling. The shape of liquid flowing through micro-channel was observed by fluorescence microscope, and the temperarue differential of liquid cooling module was measuremd by IR microscope.

• Journal of Biosystems Engineering
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• v.40 no.4
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• pp.409-416
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• 2015

Purpose: This study evaluates a new banana bulk packaging method under the real transport conditions of Sri Lanka. Methods: A field evaluation of optimized 8-mm thick Styrofoam sheets used as the cushioning material was applied. A trial transport was conducted from Thambuttegama to Colombo using a medium-sized open truck, with banana leaves as the control material. Data were recorded at the farmer, transporter, retailer, and consumer stages of the supply chain. Mechanical damage, physiological loss in weight, fruit firmness, total soluble solids, ripeness index, visual quality ratings, and the physical damage index of the bananas were measured at each stage. A cost-benefit analysis was also conducted for both packaging methods. Results: The 8-mm styrofoam sheets significantly reduced (p < 0.05) the mechanical damage from 26.3% to 12.9% compared to the conventional method for long-distance transport, and the physiological loss in weight showed a decrease of 2.88%. The loss of firmness of the fruits followed a simmilar pattern for both methods until reaching the retailer, but at the consumer was significantly higher (p < 0.05) for the control. However, the physical damage index at the retail stage for the control showed symptoms of physical injury, whereas the bananas transported using the cushioning materials exhibited only minor symptoms. Further, the visual quality of the fruits after transport from the farmer to the consumer was preserved, which is one of the main factors affecting consumer preference and retail price. The proposed method increases the profit margin by 51.2% for Embul bananas owing to the reduced postharvest losses. Conclusion: The 8-mm thick Styrofoam sheets reduced the physical damage to the bananas, with the quality parameters maintained at the prefered level. Moreover, profits may be increased.

• Toxicological Research
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• v.17
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• pp.157-166
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• 2001

Almost all currently available retroviral vectors based on murine leukemia virus (MLV) contain one or more viral coding sequences. Because these sequences are also present in the packaging genome, it has been suggested that homologous recombination may occur between the same nucleotide sequence in the packaging genome and the vector, resulting in the production of replication competent retrovirus (RCR). Up until now, it has been difficult to completely remove viral coding sequences since some were thought to be involved in the optimum function of the retroviral vector. For example, the gag coding sequence present in almost all available retroviral vectors has been believed to be necessary for efficient viral packaging, while the pol coding sequence present in the highly efficient vector MFG has been thought to be involved in achieving the high levels of gene expression. However, we have now developed a series of retroviral vectors that are absent of any retroviral coding sequences but produce even higher levels of gene expression without compromising viral titer. In these vectors, the intron and exon sequences from heterologous cellular or viral genes are present. When compared to the well known MLV-based vectors, some of these newly developed vectors have been shown to produce significantly higher levels of gene expression for a longer period. In an experimental system that can maximize the production of RCR, our newly constructed vectors produced an absence of RCR. These vectors should prove to be safer than other currently available retroviral vectors containing one or more viral coding sequences.

• Journal of the Korean Graphic Arts Communication Society
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• v.31 no.1
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• pp.65-78
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• 2013

In gravure printing ink in printed flexible packaging considering the characteristics of the study more accurate color management options and results were as follows. When applying G7 calibration, P2P of the target GRACol G7 evaluate the delta $L^*$ and delta $F^*$, CMY and K-scale average of the results of delta $L^*$ and the highest tolerance G7 average of 1.5 and 3.0 are included in all the best. In addition, the average delta $F^*$ and super delta $F^*$, G7 tolerance by being included within the scope of color management, G7 calibration was possible. Target IT 8.7/4 CMYK, when applied to the calibration G7, Color gravure printing machine is applied to the average of the previous decreased from 12.4 to 3.6. In addition, if a digital proof is EPSON WT 7900 the average color applied to the previous reduction from 5.24 to 0.74 because of the gravure printing color proofing system was effective in the management. G7 calibration by applying the reference print profile of the Epson WT 7900-G-icc, the average was 0.74 coloration, and gravure-G-icc cases, the average color of the 3.60 per GRACol average of all the five colors below were included within the allowable range. Thus, the flexible packaging gravure printing color management of printed after applying the first G7 calibration, the results refer to the press by the profiling, and where best to take advantage of the profile creation was good.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.7-18
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• 2008

This paper reviews the current development of an ultra-slim SiP for Radio Frequency (RF) application, in which three flip chips, additional passive components and Surface Acoustic Wave (SAW) filters are integrated side-by-side. A systematic investigation is carried out for the design optimization, process and reliability improvement of the package, which comprises several aspects: a design study based on the 3D thermo-mechanical finite element analysis of the packaging, the determination of stress, warpage distribution, critical failure zones, and the figuration of the effects of material properties, process conditions on the reliability of package. The optimized material sets for manufacturing process were determined which can reduce the number of testing samples from 75 to 2. In addition the molded underfilling (MUF) process is proposed which not only saves one manufacturing process, but also improves the thermo-mechanical performance of the package compared with conventional epoxy underfilling process. In the end, JEDEC's moisture sensitivity test, thermal cycle test and pressure cooker tests have also been carried out for reliability evaluation. The test results show that the optimized ultra-slim SiP has a good reliability performance.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.31-34
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• 2016

System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.

• Journal of Sensor Science and Technology
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• v.24 no.4
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• pp.264-269
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• 2015

An infrared (IR) bolometer measures the change of resistance by absorbing incident IR radiation and generates a signal as a function of the radiation intensity. Since a bolometer requires temperature stabilization and light filtering except for the infrared rays, it is essential for the device to be packaged meeting conditions that above mentioned. Minimization of heat loss is needed in order to stabilize temperature of bolometer. Heat loss by conduction or convection requires a medium, so the heat loss will be minimized if the medium is a vacuum. Therefore, vacuum packaging for bolometer is necessary. Another important element in bolometer packaging is germanium (Ge) window, which transmits IR radiation to heat the bolometer. To ensure a complete transmittance of IR light, anti-reflection (AR) coatings are deposited on both sides of the window. Although the transmittance of Ge window is high for IR rays, it is difficult to use frequently in low-price IR bolometer because of its high price. In this paper, we fabricated IR window by utilizing silicon (Si) substrate instead of Ge in order to reduce the cost of bolometer packaging. To enhance the IR transmittance through Si substrate, it is textured using Reactive Ion Etching (RIE). The texturing process of Si substrate is performed along with the change of experimental conditions such as gas ratio, pressure, etching time and RF power.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.2
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• pp.17-23
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• 1999

Top-to-bottom compression strength of corrugated fiberboard boxes is partly dependent on the load-carrying ability of the central panel areas. The ability of these central areas to resist bending under load will increase the stacking strength of the box. The difference of box compression strengths, among boxes which are made with identical dimensions and fabricated with same components but different flute sizes, is primarily due to difference of the flexural stiffness of the box panels. Top-to-bottom compression strength of a box is accurately predicted by flexural stiffness measurements and the edge crush test of the combined boards. This study was rallied out to analyze the flexural stiffness, maximum bending force and maximum deflection for various corrugated fiber-boards by experimental investigation. There were significant differences between the machine direction (MD) and the cross-machine direction (CD) of corrugated fiberboards tested. It was about 50% in SW and DW, and $62%{\sim}74%$ in dual-medium corrugated fiberboards(e.g. DM, DMA and DMB), respectively. There were no significant differences of maximum deflection in machine direction among the tested fiberboards but, in cross direction, DM showed the highest value and followed by SW, DMA, DMB and DW in order. For the corrugated fiberboards tested, flexural stiffness in machine direction is about $29%{\sim}48%$ larger than cross direction, and difference of flexural stiffness between the two direction is the lowest in DMA and DMB.

• Proceedings of the Korean Society for Applied Microbiology Conference
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• 2000.10a
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• pp.31-50
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• 2000

Almost all currently available retroviral vectors based on murine leukemia virus (MLV) contain one or more viral coding sequences Because these sequences are also present in the packaging genome, it has been suggested that homologous recombination may occur between the same nucleotide sequence in the packaging genome and the vector, resulting in the production of replication competent retrovirus (RCR). Up until now, it has been difficult to completely remove viral coding sequences since some were thought to be involved in the optimum function of the retroviral vector. For example, the gag coding sequence present in almost all available retroviral vectors has been believed to be necessary for efficient viral packaging, while the pol coding sequence present in the highly efficient vector MFG has been thought to be involved in achieving the high levels of gene e(pression. However, we have now developed a series of reroviral vectors that are absent of any retroviral coding sequences but produce even higher levels of gene expression without compromising viral titer. In these vectors the intron and exon sequences from heterologous cellular or viral genes are present, When compared to the well blown MLV-based vectors, some of these newly developed vectors have been shown to produce significantly higher levels of gene expression for a longer period. In an experimental system that can maximize the production of RCR, our newly constructed vectors produced an absence of RCR. These vectors should prove to be safer than other currently available retroviral vectors containing one or more viral coding sequences