• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2003.09a
• /
• pp.93-100
• /
• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.7 no.1
• /
• pp.1-8
• /
• 2001

This study was carried out to develop a new insolubilizer for water resistency enhancement and to evaluate its optimum apply method to corrugated paper. The addition of polyvinyl alcohol(PVA) backbone polymer to conventional starch glue caused a poor dispersibility, but flavonoid resin addition showed a good runnability and water resistency. The double coatings(top & under) of water-proof chemicals to corrugating liner made even better the water resistency of corrugating paper. This study suggested that water-proof chemical treatments be an effective method in water-resistant corrugating paper manufacturing for a cold chain system.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.21 no.3
• /
• pp.91-96
• /
• 2015

Fruit and vegetables are subjected to complex dynamic stresses in the transportation environment. During a long journey from the production area to customers using parcel delivery service, there is always some degree of vibration present. Vibration inputs are transmitted from the vehicle through the packaging to the fruit. Inside, these cause sustained bouncing of fruits against each other and container wall. These steady state vibration input may cause serous fruit injury, and this damage is particularly severe whenever the fruit inside the package is free to bounce, and is vibrated at its resonance frequency. The determination of the resonance frequencies of the fruit and vegetables may help the packaging designer to determine the proper packaging system providing adequate protection for the fruit, and to understand the complex interaction between the components of fruit when they relate to expected transportation vibration inputs. Instrumentation and technologies are described for determining the vibration response characteristics of the fruits with frequency range 3 to 150 Hz. The resonance frequency of the pear ranged from 53 to 102 Hz and the amplitude at resonance was between 1.08 and 2.48 G. The resonance frequency and amplitude at resonance decreased with the increase of the sample mass, and they were slightly affected by mechanical properties such as bioyield deformation and rupture deformation. Regression analysis was performed among the relatively high correlated parameters from the results of correlation coefficient analysis.

• Food Science and Preservation
• /
• v.10 no.4
• /
• pp.574-583
• /
• 2003

There have been a lot of research efforts on development of active food packaging structures and materials in the form of plastic films and containers, along with investigating novel polymers and bioactive compounds for packaging purpose, in order to improve storage stability and safety of foods during distribution and sale. Recently, great interests focus on antimicrobial package films, as an active packaging system, made from synthetic plastic polymer% and natural biopolymers containing various antimicrobial substances for food packaging applications. In this active system, substances are slowly released onto the food surface. However, antimicrobial activity as well as physical properties of the films can be significantly influenced by several factors such as polymer matrix, antimicrobial compounds, and interactions between polymers and compounds. Thus, this study reviews present status of antimicrobial food packaging films in overall performance aspects including types of polymers and active substances, test for antimicrobial activity, and changes in mechanical and antimicrobial properties by preparation method.

• Journal of the Microelectronics and Packaging Society
• /
• v.23 no.3
• /
• pp.1-6
• /
• 2016

The Internet of Things (IoT) is a new technology paradigm demanding one packaged system of various semiconductor and MEMS devices. Therefore, the development of electronic packaging technology with very high connectivity is essential for successful IoT applications. This paper discusses both fan-out wafer level packaging (FOWLP) and 3D stacking technologies to achieve the integrattion of heterogeneous devices for IoT. FOWLP has great advantages of high I/O density, high integration, and design flexibility, but ultra-fine pitch redistribution layer (RDL) and molding processes still remain as main challenges to resolve. 3D stacking is an emerging technology solving conventional packaging limits such as size, performance, cost, and scalability. Among various 3D stacking sequences wafer level via after bonding method will provide the highest connectivity with low cost. In addition substrates with ultra-thin thickness, ultra-fine pitch line/space, and low cost are required to improve system performance. The key substrate technologies are embedded trace, passive, and active substrates or ultra-thin coreless substrates.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.24 no.3
• /
• pp.113-120
• /
• 2018

The one-way gas valve developed in this study was designed to prevent the breakage of packages from increased internal pressure, which is a problem in packaged Kimchi, and simultaneously reduce the outflow of the offodor release. The effect of the one-way gas valve on the headspace atmospheric compositions was investigated in the packaging system. The changes of atmospheric compositions and quality factors of Kimchi, such as $CO_2$ accumulation, pH, titratable acidity, and salinity, were measured during a 4-week storage period at $4^{\circ}C$. The Kimchi package with the one-way gas valve dramatically reduced pressure build-up in the pouch by allowing the controlled flow of gas to the atmosphere. In addition, the package design allows the possibility of controlling the gas generated from Kimchi by adjusting the viscosity of the open pressure control oil. The one-way gas valve did not affect the sensory characteristics of Kimchi products during the storage period. Furthermore, the deodorizing capability of the activated carbon contained in the one-way gas valve effectively reduced the off-odor of Kimchi products released along with carbon dioxide. The novel one-way gas valve is considered to be an active packaging system that can solve major problems of expansion and off-odor leakage in the packaging of Kimchi.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.30 no.2
• /
• pp.107-120
• /
• 2024

This study compared the production systems and packaging methods as pre- and post-harvest factors for Korean head cabbage, which is minimally processed at the industry locus. It examined how different crop production systems, specifically winter and spring cultivations, affect the characteristics of the Korean head cabbage after harvest. The quality of changes in cabbage characteristics was evaluated over 4 weeks at 10℃. After harvesting, soluble solids content (SSC), hardness, and DPPH (2,2-diphenyl-1-picrylhydrazyl) levels exhibited variations depending on the crop production system, with winter kimchi cabbage maintaining higher levels. These attributes were also influenced by the crop systems and packaging methods. Significant differences were observed in the changes in fresh weight of the Korean head cabbage depending on the packaging method; the extent of these changes was reduced with polypropylene (PP) film packaging. Although the freshness of Korean head cabbage decreased during storage, the appearance was somewhat preserved through film packaging after harvest. The results indicated that the properties of stored Korean head cabbages experienced different effects on pre- and post-harvest quality and characteristics, depending on the measurement items.

• Proceedings of the International Microelectronics And Packaging Society Conference
• /
• 2005.09a
• /
• pp.23-34
• /
• 2005

Electronic interconnection and packaging is mainly performed in a planar, 2D design style. Further miniaturization and performance enhancement of electronic systems will more and more require the use of 3D interconnection schemes. Key technologies for realizing true 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnect with embedded die. Different applications require different complexities of 3D-interconnectivity. Therefore, different technologies may be used. These can be categorized as a more traditional packaging approach, a wafer-level-packaging, WLP ('above' passivation), approach and a foundry level ('below' passivation) approach. We define these technologies as respectively 3D-SIP, 3D-WLP and 3D-SIC. In this paper, these technologies are discussed in more detail.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
• /
• v.26 no.1
• /
• pp.25-31
• /
• 2020

Recently, applications of biomass-based plastics have increased according to the eco-friendly policy of the reduction of carbon dioxide emissions in domestic and foreign government. In this study, a paper plastic composite was produced by compounding polypropylene and micronized paper powder that was prepared using dry pulverization technology. Subsequently, the specimen of paper plastic was verified with mechanical properties, formability and product safety test to confirm the suitable packaging materials for food packaging. Paper plastics showed slightly lower mechanical properties than currently commercialized PP composites. However, paper plastics are valuable materials as environmentally friendly carbon-reducing material because of high biocarbon content, light weight features and applicability of existing manufacturing machines or system.

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.1
• /
• pp.31-38
• /
• 2003

In the current electronic technology atmosphere, MEMS (Microelectromechanical System) technology is regarded as one of promising device manufacturing technologies to realize market-demanding device properties. In the packaging of MEMS devices, the packaged structure must maintain hermeticity to protect the devices from a hostile atmosphere during their operations. For such MEMS device vacuum packaging, we introduce the LTCC (Low temperature Cofired Ceramic) packaging technology, in which embedded passive components such as resistors, capacitors and inductors can be realized inside the package. The technology has also the advantages of the shortened length of inner and surface traces, reduced signal delay time due to the multilayer structure and cost reduction by more simplified packaging processes owing to the realization of embedded passives which in turn enhances the electrical performance and increases the reliability of the packages. In this paper, the leakage rate of the LTCC package having several interfaces was measured and the possibility of LTCC technology application to MEMS devices vacuum packaging was investigated and it was verified that improved hermetic sealing can be achieved for various model structures having different types of interfaces (leak rate: stacked via; $4.1{\pm}1.11{\times}10^{-12}$/ Torrl/sec, LTCC/AgPd/solder/Cu-tube; $3.4{\pm}0.33{\times}10^{-12}$/ Torrl/sec). In real application of the LTCC technology, the technology can be successfully applied to the vacuum packaging of the Infrared Sensor Array and the images of light-up lamp through the sensor way in LTCC package structure was presented.