• The monthly packaging world
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• s.138
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• pp.54-55
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• 2004

• The monthly packaging world
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• s.138
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• pp.57-67
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• 2004

• The monthly packaging world
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• s.252
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• pp.88-91
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• 2014

• The monthly packaging world
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• s.180
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• pp.114-135
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• 2008

• The monthly packaging world
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• s.145
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• pp.156-164
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• 2005

• The monthly packaging world
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• s.83
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• pp.162-170
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• 2000

본 고는 지난 달 14일 환경부와 자민련 주최로 열린 '포장폐기물 처리대책 개선방안공청회'에서 발표된 주제 중 하나로 업계의 폐기물재활용체계구축에 정보가 되기를 바란다.

• The monthly packaging world
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• s.315
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• pp.81-84
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• 2019

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.38 no.1 s.113
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• pp.62-69
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• 2006

This study was carried out to measure and analyze the storage condition, distribution route, and packaging method of four selected agricultural products(small tomato, cabbage, peach, and carrot) in the cold chain system. It was shown that dew-forming phenomenon by fruits and vegetables deteriorates the agricultural product quality and physical properties of corrugated fiberboard box during the cold chain system. The compressive strength deterioration in corrugated fiberboard boxes was much greater for single wall(SW) corrugated fiberboard containers than for double wall(DW) in low temperature-high humidity condition. To reduce the deterioration of box and dew-forming phenomenon, water-repellency treatment should be over $R_6$. However, water-resistant treatment of corrugated fiberboard containers would be effective under high relative humidity conditions more than 75% RH. It was suggested that functional corrugated fiberboard box packaging would be an optimum method to reduce the deterioration of agricultural products quality by. It was also achieved controlling the relative humidity and temperature during the storage and physical distribution process.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.1
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• pp.39-44
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• 2008

In this paper, fully embedded 2.4GHz WLAN band pass filter (BPF) was investigated into a multi-layered organic packaging substrate using high Q spiral stacked inductors and high Dk MIM capacitors for low cost RF System on Package (SOP) applications. The proposed 2.4GHz WLAN BPF was designed by modifying chebyshev second order filter circuit topology. It was comprised of two parallel LC resonators for obtaining two transmission zeros. It was designed by using 2D circuit and 3D EM simulators for finding out optimal geometries and verifying their applicability. It exhibited an insertion loss of max -1.7dB and return loss of min -l7dB. The two transmission zeros were observed at 1.85 and 6.7GHz, respectively. In the low frequency band of $1.8GHz{\sim}1.9GHz$, the stop band suppression of min -23dB was achieved. In the high frequency band of $4.1GHz{\sim}5.4GHz$, the stop band suppression of min -l8dB was obtained. It was the first embedded and the smallest one of the filters formed into the organic packaging substrate. It has a size of $2.2{\times}1.8{\times}0.77mm^3$.