• Journal of the Korean Society of Floral Art and Design
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• no.41
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• pp.25-44
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• 2019

The purpose of this study is to identify the differences between consumers and suppliers about the necessity and effectiveness of hand-tied bouquet packaging in a retail shop and consumer needs of floristry packaging for sustainable condition were surveyed and analyzed using questionnaire format. In the introduction, the understanding and sustainability of floristry design were considered. The questionnaire consisted of general purchasing type, packaging related items, and consumer and supplier profile. Consumers were middle class residents living on Mokdong apartment complex, a small number of consumers who aren't living on Mokdong and workers and suppliers were florists currently active nationwide. This study suggests an effective and strategic packaging direction that reflects consumer needs, focusing on the similarity and difference of their needs and it presents them as business models. The results of the future research are expected to be the basis for producing and distributing packaging design.

• Korean journal of food and cookery science
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• v.16 no.6
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• pp.548-556
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• 2000

To examine the opinions of consumers concerning the ricecake as a traditional food, we conducted the study of the cognition and interests of children and mothers ricecake for its popularization. Our subjects of study were elementary school children as the future consumers and their mothers as the present consumers. The results were as follows: children favored to eat much more western style food and sweet food than did mothers. All of children and mothers liked traditional food and ricecake, but children did not know how to prepare the traditional food and ricecake, indicating thenecessity of the education of ricecake-making. All of them were satisfied with the taste of ricecake 'on sale, but not with packaging designs and price of ricecake. Development of packaging designs was required for popularization of ricecake to spread worldwide.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.1-10
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• 2020

The technology and market size of image sensors continue to develop thanks to the release of image sensors that exceed 100 million pixels in 2019 and expansion of black box camera markets for vehicles in addition to existing mobile applications. We review the technology flow of image sensors that have been constantly evolving for 40 years since Hitachi launched a 200,000-pixel image sensor in 1979. Although CCD has made inroads into image sensor market for a while based on good picture quality, CMOS image sensor (CIS) with active pixels has made inroads into the market as semiconductor technology continues to develop, since the electrons generated by the incident light are converted to the electric signals in the pixel, and the power consumption is low. CIS image sensors with superior characteristics such as high resolution, high sensitivity, low power consumption, low noise and vivid color continue to be released as the new technologies are incorporated. At present, new types of structures such as Backside Illumination and Isolation Cell have been adopted, with better sensitivity and high S/N ratio. In the future, new photoconductive materials are expected to be adopted as a light absorption part in place of the pn junction.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.2
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• pp.42-58
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• 1999

Packaging materials and articles that are used in food contact applications can transfer constituents in the foodstuffs. This kind of risk of possible health hazards to consumers has been generally recognized for a long time with the consequence of establishing corresponding food regulations in most developed countries. However, the language of these laws, their interpretation, and their level of enforcement vary from country to country. Accordingly, the actual migrating levels from packaging materials can be varied depending on the migration testing methods as prescribed in the national legislation in each countries. Therefore, there are needs of elimination of non-tariff trade barriers raised by sanitary and phytosanitary or technical measures under the Final Act of the UR Agreement. In this connection, the EU and USA are currently in an ongoing process of legislation harmonization to overcome potential barriers to free trade. In general, regulations governing component transfer in the USA are more complicated and comprehensive than similar regulations in Europe. In future, standard migration testing procedures for microwave heat susceptor materials and for the use of fatty food simulant should be established and also harmonized among countries. The objective of this investigation is to compare the current regulations for migration testing for plastic containers and packaging materials in USA, EU and Korea or Japan. For those regulations, Korean standards are required to be kept up with the international standards. By doing this, the related Korean regulation could be amended along with the worldwide progress for harmonization.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.11 no.1
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• pp.1-10
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• 2005

Paper angle, environment friendly packaging material, has been mainly used as an edge protector. But, we have perceived its application to package design of heavy product such as strength reinforcement or unit load system (ULS) in the future. Above all, understanding of buckling behavior for angle itself and compression strength and quality standard have to be accomplished for the paper angle to be used for this purpose. The purpose of this study was to elucidate the buckling behavior through theoretical and finite element analysis, and to develop compression strength model by compression test for symetric and asymetric paper angle. Based on the result of theoretical and finite element analysis, increasing rate of buckling of asymmetric paper angle was higher as applied load level was bigger and/or the length of angle was longer than that of symmetric paper angle. Decreasing rate of minimum principal moment of inertia was remarkably increased as the extent of asymmetric angle is bigger, and buckling orientation of angle was open direction near the small web. Increasing rate of maximum compression strength (MCS) for thickness of angle was smaller as the web size was bigger in symmetric angle. MCS of asymmetric angle of $43{\times}57$ and $33{\times}67$ was decreased $15{\sim}18%$ and $65{\sim}78%$, and change of buckling was increased $12{\sim}13%$ and $62{\sim}66%$, respectively.

• Journal of Animal Science and Technology
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• v.61 no.1
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• pp.47-53
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• 2019

This study was performed to evaluate the microbial and temperature changes of boxed beef during transport and distribution under vacuum and modified atmosphere packaging (MAP), and to compare between excision and swab sampling for 15 days. The top round and striploin (quality grade 1) from Hanwoo steers at 2 days post-slaughter were obtained from a local meat processing plants and chilled at $4{\pm}2^{\circ}C$ in a cold room. The boxes were transported under refrigeration ($4{\pm}2^{\circ}C$) to the laboratory within half an hour. Vacuum and MAP packs were subsequently taken out from cool boxes, and microbiological examinations were carried out at 0, 6, 12, and 24 h of storage time. MAP was more effective than vacuum packaging for the inhibition of total aerobic, lactic acid bacteria and Pseudomonas (p < 0.05). Microbial loads of swab methods were slightly lower than those of excision ones (p < 0.05). The results of this study could be utilized by meat consumers in future studies as well as by manufacturers to determine the ideal storage conditions for cool boxed meat, thus ensuring reduced economic losses due to spoilage.

• Journal of the Mineralogical Society of Korea
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• v.29 no.2
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• pp.35-45
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• 2016

Clays, which are abundant in nature and eco-friendly, have been utilized throughout human history due to their characteristic physicochemical properties. Recently, a variety of clays such as montmorillonite, kaolinite, sepiolite and layered double hydroxide with or without chemical modification have been extensively studied for potential application in industries. Clays that possess a large specific surface area, high aspect ratio, nanometer sized layer thickness and controllable surface charge could be utilized as polymer fillers after appropriate chemical modifications. These modified clays can improve mechanical and gas barrier properties of polymer materials but also provide sustained antibacterial activity to polymer films. Furthermore, engineered clays can be utilized as scavengers for chemical or biological pollutants in water or soil, because they have desirable adsorption properties and chemical specificity. In this review, we are going to introduce recent researches on engineered clays for potential applications in future industries such as food packaging and environmental remediation.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.4
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• pp.73-76
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• 2010

A two-facet approach was used to investigate the parametric performance of functional high-speed DDR3 (Double Data Rate) DRAM (Dynamic Random Access Memory) die placed in different types of BGA (Ball Grid Array) packages: wire-bonded BGA (FBGA, Fine Ball Grid Array), flip-chip (FCBGA) and lead-bonded $microBGA^{(R)}$. In the first section, packaged live DDR3 die were tested using automatic test equipment using high-resolution shmoo plots. It was found that the best timing and voltage margin was obtained using the lead-bonded microBGA, followed by the wire-bonded FBGA with the FCBGA exhibiting the worst performance of the three types tested. In particular the flip-chip packaged devices exhibited reduced operating voltage margin. In the second part of this work a test system was designed and constructed to mimic the electrical environment of the data bus in a PC's CPU-Memory subsystem that used a single DIMM (Dual In Line Memory Module) socket in point-to-point and point-to-two-point configurations. The emulation system was used to examine signal integrity for system-level operation at speeds in excess of 6 Gb/pin/sec in order to assess the frequency extensibility of the signal-carrying path of the microBGA considered for future high-speed DRAM packaging. The analyzed signal path was driven from either end of the data bus by a GaAs laser driver capable of operation beyond 10 GHz. Eye diagrams were measured using a high speed sampling oscilloscope with a pulse generator providing a pseudo-random bit sequence stimulus for the laser drivers. The memory controller was emulated using a circuit implemented on a BGA interposer employing the laser driver while the active DRAM was modeled using the same type of laser driver mounted to the DIMM module. A custom silicon loading die was designed and fabricated and placed into the microBGA packages that were attached to an instrumented DIMM module. It was found that 6.6 Gb/sec/pin operation appears feasible in both point to point and point to two point configurations when the input capacitance is limited to 2pF.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.7-13
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• 2019

In this paper, the principles, types and characteristics of the laser and laser soldering are introduced. Laser soldering methods for electronics, metals, semiconductors are also presented. Laser soldering is a non-contact process that transfers energy to solder joint by a precisely controlled beam. Demands for laser soldering are increasing due to bonding for complex circuits and local heating in micro joint. Laser absorption ratio depends on materials, and each material has different absorption or reflectivity of the laser beam, which requires fine adjustment of the laser beam. Laser types and operating conditions are also important factors for laser soldering performance. In this paper, the performance of Nd:YAG laser soldering is compared to the hot blast reflow. Meanwhile, a diode laser gives different wavelength and smaller parts with high performance, but it has various reliability issues such as heat loss, high power, and cooling technology. These issues need to be improved in the future, and further studies for laser micro-joining and soldering are required.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2006.10a
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• pp.37-45
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• 2006

The mobile-phone which Camera was put on was released at the end of 2000 and dramatically puts up the deployment ratio because not only simple Camera but also a function that the photograph which I took is dispatched was added. It is the force that demand in this year presses 600,000,000 sale of a mobile-phone is estimated to be 960,000,000 of them in 2006, and to be able to include two errands with a support model after 3G. A person of entry to a camera-module appear much. In addition, the various kinds of products open markedly which a product comes to be known widely in the world, and the application range has opened widely, and considered QCDT come to be key issues for answer to market demand. By manufacturing industry, there is peculiar culture to each industry, camera-module is the composition the various industries. The construction of true Supply-chain becomes unavoidable to make a good product. I describe the point that the situation of each supply-chain and the direction for the future by the view point of module assembly maker.