• Journal of Wetlands Research
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• v.17 no.1
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• pp.75-79
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• 2015

DIWS system was introduced to treat HCl gas from the scrubber of iron and steel industry according as the regulation of air quality is expected to be changed to 2ppm. pH of condensed water at stack was increased to 6.0. While 13.3ppm of inflow HCl was introduced to DIWS system, the average exhaust gas was 0.43ppm with 96.9% of removal efficiency. Compared with HCl data of TMS, the stable removal efficiency was shown in DIWS system, but the phenomenon of data hunting was also observed with different types of TMS apparatus.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.07a
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• pp.151-155
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• 2002

This paper presents a micro fluxgate magnetic sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon with extremely high DC permeability of ∼100,000 and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3${\times}$5.7m㎡. Excellent linear response over the range of -100${\mu}$T to +100${\mu}$T is obtained with 540V/T sensitivity at excitation square wave of 3V$\_$P-P/ and 360kHz. The very low power consumption of ∼8mW was measured. This magnetic sensing element which measures the lower fields than 50${\mu}$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.8
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• pp.702-707
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• 2002

This paper presents a micro fluxgate sensor in printed circuit board (PCB). The fluxgate sensor consists of five PCB stack layers including one layer magnetic core and four layers of excitation and pick-up coils. The center layer as a magnetic core is made of a micro patterned amorphous magnetic ribbon and the core has a rectangular-ring shape. The amorphous magnetic core is easily saturated due to the low coercive field and closed magnetic path for the excitation field. Four outer layers as an excitation and pick-up coils have a planar solenoid structure. The chip size of the fabricated sensing element is 7.3$\times$5.7$\textrm{mm}^2$. Excellent linear response over the range of -100$\mu$T to +100$\mu$T is obtained with 540V/T sensitivity at excitation square wave of 3 $V_{p-p}$ and 360kHz. The very low power consumption of ~8mW was measured. This magnetic sensing element, which measures the lower fields than 50$\mu$T, is very useful for various applications such as: portable navigation systems, military research, medical research, and space research.h.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.272-272
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• 2014

SnO thin films, 100 nm in thickness, were deposited on glass substrates by RF magnetron sputtering. A stack structure of $SnO_2/SnO$, where few nanometers of $SnO_2$ were determined on the SnO thin film by X-ray photoelectron spectroscopy. In addition, XPS depth profile analysis of the pristine and heat treated thin films were introduced. The electrical behavior of the as-sputtered films during the annealing was recorded to investigate the working conditions for the SnO sensor. Subsequently, The NH3 sensing properties of the SnO sensor at operating temperature of $50-200^{\circ}C$ were examined, in which the p-type semiconducting sensing properties of the thin film were noted. The sensor shows good sensitivity and repeatability to $NH_3$ vapor. The sensor properties toward several gases like $H_2S$, $CH_4$ and $C_3H_8$ were also introduced. Finally, a sensing mechanism was proposed and discussed.

• Journal of IKEEE
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• v.13 no.4
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• pp.23-27
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• 2009

Ohmic contact formation and etching processes for the fabrication of MBE (molecular beam epitaxy) grown GaSb-based p-channel HEMT devices on Si substrate have been studied. Firstly, mesa etching process was established for device isolation, based on both HF-based wet etching and ICP-based dry etching. Ohmic contact process for the source and drain formation was also studied based on Ge/Au/Ni/Au metal stack, which resulted in a contact resistance as low as $0.683\;{\Omega}mm$ with RTA at $320^{\circ}C$ for 60s. Finally, for gate formation of HEMT device, gate recess process was studied based on AZ300 developer and citric acid-based wet etching, in which the latter turned out to have high etching selectivity between GaSb and AlGaSb layers that were used as the cap and the barrier of the device, respectively.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.41 no.10
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• pp.788-795
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• 2013

A magnesium bipolar plate whose surface was protected by thinly deposited silver layer was investigated as an alternative to existing graphite bipolar plate of PEM fuel cells. Thin silver layer of $3{\mu}m$ was deposited on a magnesium alloy substrate by physical vapor deposition (PVD) method in an environment of $180^{\circ}C$. A number of tests were conducted on the fabricated magnesium based bipolar plates to determine their suitability for use in PEM fuel cell stacks. The test on corrosion resistance in the same pH condition as in a PEM operation demonstrated the layer protected the magnesium alloy substrate, while unprotected substrate suffered from severe corrosion. The contact resistance of the fabricated bipolar plate was less than $20m{\Omega}-cm^2$ which was superior to the conventional bipolar plates. A single cell was constructed using the fabricated bipolar plates and power output was measured. Due to the enhanced conductivity caused by low contact resistance, slight increase was observed in current density and output voltage. With low density of the magnesium substrate and ease on machining, the weight reduction of the stack of 30~40 % is possible to produce the same power output.

• Korean Chemical Engineering Research
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• v.43 no.3
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• pp.352-359
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• 2005

This work has studied the changes of pH in both of anodic and cathodic chambers of a divided cell due to the electrolytic split of water during the ammonia decomposition to nitrogen, and has studied the continuous decomposition characteristics of ammonia in a multi-cell stacked electrolyzer. The electrolytic decomposition of ammonia was much affected by the change of pH of ammonia solution which was caused by the water split reactions. The water split reaction occurred at pH of less than 8 in the anodic chamber with producing proton ions, and occurred at pH of more than 11 in the cathodic chamber with producing hydroxyl ions. The pH of the anodic chamber using an anion exchange membrane was sustained to be higher than that using a cation exchange membrane, which resulted in the higher decomposition of ammonia in the anodic chamber. By using the electrolytic characteristics of the divided cell, a continuous electrolyzer with a self-pH adjustment function was newly devised, where a portion of the ammonia solution from a pHadjustment tank was circulated through the cathodic chambers of the electrolyzer. It enhanced the pH of the ammonia solution fed from the pH-adjustment tank into the anodic chambers of the electrolyzer, which caused a higher decomposition yield of ammonia. And then, based on the electrolyzer, a salt-free ammonia decomposition process was suggested. In that process, ammonia solution could be continuously decomposed into the environmentally-harmless nitrogen gas up to 83％, when chloride ion was added into the ammonia solution.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.04a
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• pp.71-72
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• 2007

In this study, we investigated the fabrication of MLR (multi-layer resist) with a very thin diamond-like carbon (DLC) layer. ArF PR/$SiO_2$/DLC MLR structure was investigated and etching characteristics of the DLC layer was patterned using $SiO_2$ hard-mask by varying the process parameters such as different high-frequency/low-frequency combination ($f_{LF}/f_{HF}$), HF/LF power ratio ($P_{HF}/P_{LF}$), $O_2$ flow and $N_2$ flow rate in $O_2/N_2$/Ar plasmas. The results indicated an increased etch rate of DLC for the higher $f_{LF}/f_{HF}$ combination and for the increased low-frequency power ($P_{LF}$). And the etch rate of DLC was decreased with increasing the $N_2$ flow rate in $O_2/N_2$/Ar plasmas. In order to confirm the application of DLC MLR for the etching process of silicon oxide, the stack of ArF PR/BARC/$SiO_2$/DLC/TEOS/Si was investigated.

• Korean Journal of Materials Research
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• v.29 no.8
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• pp.463-468
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• 2019

The electrical and interfacial properties of $HfO_2/Al_2O_3$ and $Al_2O_3/HfO_2$ dielectrics on AlN/p-Ge interface prepared by thermal atomic layer deposition are investigated by capacitance-voltage(C-V) and current-voltage(I-V) measurements. In the C-V measurements, humps related to mid-gap states are observed when the ac frequency is below 100 kHz, revealing lower mid-gap states for the $HfO_2/Al_2O_3$ sample. Higher frequency dispersion in the inversion region is observed for the $Al_2O_3/HfO_2$ sample, indicating the presence of slow interface states A higher interface trap density calculated from the high-low frequency method is observed for the $Al_2O_3/HfO_2$ sample. The parallel conductance method, applied to the accumulation region, shows border traps at 0.3~0.32 eV for the $Al_2O_3/HfO_2$ sample, which are not observed for the $Al_2O_3/HfO_2$ sample. I-V measurements show a reduction of leakage current of about three orders of magnitude for the $HfO_2/Al_2O_3$ sample. Using the Fowler-Nordheim emission, the barrier height is calculated and found to be about 1.08 eV for the $HfO_2/Al_2O_3$ sample. Based on these results, it is suggested that $HfO_2/Al_2O_3$ is a better dielectric stack than $Al_2O_3/HfO_2$ on AlN/p-Ge interface.

• Restorative Dentistry and Endodontics
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• v.16 no.2
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• pp.1-17
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• 1991

The purpose of this study was to analyze the in vivo amalgam corrosion products qualitatively. 30 molars with large, intact amalgam restorations were selected. All the restorations were more than 5 years old. Twenty of the removed amalgams were embedded in acrylic resin block. The exposed surfaces of fifteen embedded amalgams were polished by amalgam polishing kit, and the rest were observed without polishing. The remaining 10 amalgams were fractured centrally and perpendiculary to the occlusal surface with a wire-cutter. After all specimens were cleaned ultrasonically in distilled water, each surface was examined under S.E.M. and E.D.A.X. (Energy Dispersive Micro X-ray Analyzer) to determine the morphology and chemical nature of the corrosion products. The following results were obtained: 1. The surfaces of the unpolished amalgam restorations were covered with thin amorphous layer of Sn-Ca-P-S complex with numerous cracks. 2. In the conventional amalgams, the major corrosion products were Sn-Cl phases however, tin oxide phases were also observed. 3. Only tin oxide phase was identified in the high copper amalgam, but it was less frequently observed than in the conventional amalgam. 4. It was easier to observe the corrosion product morphology in the fractured surfaces than in the polished ones. The morphologies of the corrosion product crystals looked like a stack of slightly bended plates in the Sn-Cl phases and polyhedra or polygonal prisms in the tin oxide phases.