• Journal of the Korean Applied Science and Technology
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• v.39 no.5
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• pp.589-595
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• 2022

The white OLED is fabricated with the anthracene-based blue emitting material, 9-(2-naphthyl)-10-(p-tolyl)anthracene (2-NTA) in various volume-ratios of orange dopant, rubrene, which results in pure white emission with C.I.E. coordinate of ~(0.32, 0.39). The devices with <1.5% rubrene show better EL properties (efficiency) than >3% devices. Furthermore the turn-on voltage of 2-NTA WOLED (3.7 V) is lower than that of 2-NTA blue OLED (5.4 V) at the same condition. Conclusively 2-NTA with rubrene less than 1.5% (v/v) could be utilized for the pure WOLED.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.3
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• pp.27-33
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• 1999

We have investigated the ultra-low energy B, P, and As ion implantation using upgraded MDRANGE code to study formation of nanometer junction depths. Even at the ultra-low energies simulated in this paper, it was revealed that ion channeling should be carefully considered. It was estimated that ion channelings have much effect on dopant profiles when B ion implant energies were more than 500 eV, P more than 2 keV and As approximately more than 4 keV. When we compared 2-dimensional dopant profiles of 1 keV B with that of tilted one, 2 keV P with tilt, and 5 keV As with tilt, we could find that most channeling cases occurred not lateral directions but depth directions.

• Proceedings of the Materials Research Society of Korea Conference
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• 1999.11a
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• pp.77-77
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• 1999

• Transactions on Electrical and Electronic Materials
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• v.3 no.3
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• pp.18-20
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• 2002

In sub-l/4 ${\mu}{\textrm}{m}$ NMOSFET with STI (Shallow Trench Isolation), the anomalous hump phenomenon of subthreshold region, due to capped p-TEOS/SiN induced defect, is reported. The hump effect was significantly observed as channel length is reduced, which is completely different from previous reports. Channel boron dopant redistribution due to the defect should be considered to improve hump characteristics besides considerations of STI comer and recess. 130

• Journal of the Korean Institute of Telematics and Electronics
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• v.23 no.3
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• pp.370-375
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• 1986

In this paper, modeling of the conduction mechanism of ion implanted p-type polycrystalline silicon is studied. From this modeling, the resistivity of p-type polycrystalline and its dependence on dopant concentration are calculated. The proposed modeling whose grain size is about 1450 \ulcorneris shwon to agree well with the experimental result.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.5
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• pp.37-42
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• 2004

Shallow $p^{＋}$-n junctions were formed by preamorphization, low-energy ion implantation and dual-step annealing processes. Germanium ions were implanted into silicon substrates for preamorphization. The dopant implantation was performed into the preamorphized and non-preamorphized substrates using B $F_2$2 ions. Rapid thermal anneal (RTA) and furnace anneal (FA) were employed for dopant activation and damage removal. Samples were annealed by one of the following four methods; RTA(75$0^{\circ}C$/10s)＋Ft FA＋RTA(75$0^{\circ}C$/10s), RTA(100$0^{\circ}C$/10s)＋FA, FA＋The Ge Preamorphized sample exhibited a shallower junction depth than the non-preamorphized sample. When the employed RTA temperature was 100$0^{\circ}C$, FA＋RTA annealing sequence exhibited better junction characteristics than RTA＋FA thermal cycle from the viewpoint of junction depth, sheet resistance, $R_{s}$$.$ $x_{j}$, and leakage current.t.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.18 no.5
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• pp.195-199
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• 2008

Production of the silicon feedstock for the semiconductor industry cannot meet the requirement for the solar cell industry because the production volume is too small and production cost is too high. This situation stimulates the solar cell industry to try the lower grade silicon feedstock like UMG (Upgraded Metallurgical Grade) silicon of 5$\sim$6 N in purity. However, this material contains around 1 ppma of dopant atoms like boron or phosphorous. Calculation of the composition profile of these impurities using segregation coefficient during crystal growth makes us expect the change of the type from p to n : boron rich area in the early solidified part and phosphorous rich area in the later solidified part of the silicon ingot. It was expected that the change of the growth speed during the silicon crystal growth is effective in controlling the amount of the metal impurities but not effective in reducing the amount of dopants.

• Journal of the Korean Ceramic Society
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• v.39 no.4
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• pp.367-376
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• 2002

Electrical conduction in $SrZr_{1-x}Y_xO_{3-\delta}$((x=0.05, 0.10)-metal electrode system was investigated by impedance spectroscopy and two-probe d.c. conductivity measurement. Electrode conductivity in anodic direction varies with $P_W^{1/2}$( and that in cathodic direction with $P_{O2}^{1/4}$ in oxidizing atmosphere. In hydrogen atmosphere, the addition of water vapor increased the electrode conductivity both in anodic and cathodic direction. Increasing dopant concentration from 5 to 10% showed a more than four times increase in anodic conduction as well as bulk conduction of the solid electrolyte. This observation implies that unfilled oxygen vacancy concentration increases rapidly as the dopant content increases in humid atmosphere. The activation energy of cathodic conduction in Pt and Ag electrode was nearly same below $800^{\circ}C$ which means the rate of cathodic reaction is determined by the reaction in the electrolyte surface rather than on the metal electrodes.

• Journal of Ocean Engineering and Technology
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• v.24 no.6
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• pp.81-85
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• 2010

The effects of co-doping with complex dopants of softeners, $La^{+3}$ and/or $Nb^{+5}$, and a hardener, $Fe^{+3}$, on the microstructural and piezoelectric properties of PZT ceramics with a composition of a rhombohedral-tetragonal morphotropic phase boundary, $PbZr_{0.53}Ti_{0.47}O_3$, were investigated. Unlike single-element doping, the complex doping of both the softener and hardener ions led to various compensation effects for the piezoelectric properties of the PZT ceramics. For 0.5 wt.% $La_2O_3$ softener and/or 0.5 wt.% $Nb_2O_5$ doped compositions, there were apparent hardener doping (compensation) effects for an addition of over 1.0 wt.% $Fe_2O_3$. For the $La_2O_3$ and/or $Nb_2O_5$ doped composition, the co-dopant $Fe_2O_3$ addition led to lower kp and $\varepsilon$r, and increased $Q_m$ values. The prepared PZT ceramics modified with complex soft dopants, $La^{+3}$ and $Nb^+$, as well as a hard dopant, $Fe^{+3}$, showed that the piezoelectric properties were stable with the compositional variations, which made it possible to establish piezoelectric performances with higher reliability and reproducibility. The most improved piezoelectric properties of enhanced $Q_m$ with $\varepsilon_r$ remaining higher $k_p$, were obtained in the PZT composition complexly doped with $La^{+3}$ and $Fe^{+3}$. From the results obtained in this study, the properties of compositionally modified PZT ceramics can also be tailored over a wider range by changing the dopant compositions to meet the specific requirements for underwater or other applications.

• Current Photovoltaic Research
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• v.12 no.2
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• pp.31-36
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• 2024

Passivating contacts are a promising technology for achieving high efficiency Si solar cells by reducing direct metal/Si contact. Among them, a polysilicon (poly-Si) based passivating contact solar cells achieve high passivation quality through a tunnel oxide (SiO_x) and poly-Si. In poly-Si/SiO_x based solar cells, the passivation quality depends on the amount of dopant in-diffused into the bulk-Si. Therefore, our study fabricated cells by inserting silicon oxide (SiO₂) as a doping barrier before doping and analyzed the barrier effect of SiO₂. In the experiments, p⁺ poly-Si was formed using spin on dopant (SOD) method, and samples ware fabricated by controlling formation conditions such as existence of doping barrier and poly-Si thickness. Completed samples were measured using quasi steady state photoconductance (QSSPC). Based on these results, it was confirmed that possibility of achieving high V_oc by inserting a doping barrier even with thin poly-Si. In conclusion, an improvement in implied V_oc of up to approximately 20 mV was achieved compared to results with thicker poly-Si results.