• 한국세라믹학회지
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• 제35권4호
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• pp.364-370
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• 1998

광집적회로용 평면도파로를 구현하기 위한 $B_2O_3-P_2O_5-SiO_2$ 실리카 광도파막을 실리콘 기판위에 FDH(Flame Hydrolysis Depositon)법으로 제조하여 미립자의 미세구조, 실리카막의 굴절률과 조성을 고찰하였다. FHD법에서 도펀트(dopant)물질로, $B_1\;P_1\;Ge$ 등의 산화물이 사용되며, $B_1$ Ge 산화물의 경우 $SiO_2$와의 결합특성이 우수하여 비교적 도핑(doping)이 용이하지만 P의 경우 $P_2O_5$의 낮은 융점에 의한 증발 등으로 효과적인 도핑이 어렵다. 수직형 FHD 토치를 사용하고 화염온도, 기판온도, 토치와 기판간의 거리를 최적화하여 P 농도가 3.3 Wt%이상이고 고밀화 온도가 $1180^{\circ}C$ 이하인 양질의 실리카막을 얻었다. 실리카막의 굴절률은 $1.55\;\mu\textrm{m}$ 파장에서 $1.4480{\pm}1{\times}10^{-1}$로 측정되었으며, $22{\pm}1\;\mu\textrm{m}$의 두께를 보였다.

• 한국재료학회지
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• 제23권5호
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• pp.255-259
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• 2013

An effect of thermal annealing on activating phosphorus (P) atoms in ZnO nanorods (NR) grown using a hydrothermal process was investigated. $NH_4H_2PO_4$ used as a dopant source reacted with $Zn^{2+}$ ions and $Zn_3(PO_4)_2$ sediment was produced in the solution. The fact that most of the input P elements are concentrated in the $Zn_3(PO_4)_2$ sediment was confirmed using an energy dispersive spectrometer (EDS). After the hydrothermal process, ZnO NRs were synthesized and their PL peaks were exhibited at 405 and 500 nm because P atoms diffused to the ZnO crystal from the $Zn_3(PO_4)_2$ particles. The solubility of the $Zn_3(PO_4)_2$ initially formed sediment varied with the concentration of $NH_4OH$. Before annealing, both the structural and the optical properties of the P-doped ZnO NR were changed by the variation of P doping concentration, which affected the ZnO lattice parameters. At low doping concentration of phosphorus in ZnO crystal, it was determined that a phosphorus atom substituted for a Zn site and interacted with two $V_{Zn}$, resulting in a $P_{Zn}-2V_{Zn}$ complex, which is responsible for p-type conduction. After annealing, a shift of the PL peak was found to have occurred due to the unstable P doping state at high concentration of P, whereas at low concentration there was little shift of PL peak due to the stable P doping state.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.141-142
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• 2005

To investigate the ZnO thin films which is interested in the next generation of short wavelength LEDs and Lasers, our ZnO thin films were deposited by RF sputtering system. At sputtering process of ZnO thin films, substrate temperature, work pressure respectively is $300^{\circ}C$ and 5.2 mTorr, and the purity of target is ZnO 5N. The thickness of ZnO thin films was about $1.9{\mu}m$ at SEM analysis after sputtering process. Phosphorus (P) and arsenic (As) were diffused into ZnO thin films sputtered by RF magnetron sputtering system in ampoule tube which was below $5\times10^{-7}$ Torr. The dopant sources of phosphorus and arsenic were $Zn_3P_2$ and $ZnAs_2$. Those diffusion was perform at 500, 600, and $700^{\circ}C$ during 3hr. We find the condition of p-type ZnO whose diffusion condition is $700^{\circ}C$, 3hr. Our p-type ZnO thin film has not only very high carrier concentration of above $10^{19}/cm^3$ but also low resistivity of $5\times10^{-3}{\Omega}cm$.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1992년도 하계학술대회 논문집 B
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• pp.721-723
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• 1992

The electrical resistivity and piezoelectric properties have been studied for Lead Zirconate-Titanate(PZT) with $Nb_2O_5$ dopant, fabricated from conventional mixed-oxide powders and molten salt synthesis. The resistivity and electromechanical coupling factor(Kp) were increased with increasing Nb contents. The reason for increasing of the electrical resistivity below the Curie Temperature(Tc), It is believed that the p-type electrical conduction in PZT is caused by the lead vacancies. The electromechanical coupling factor(Kr) and piezoelectric constant $d_{33}$ were improved by Nb additives. This behavior can be explained as a compensation effect and $Nb^{5+}$ can serve as a donar and contribute electrons to the conduction process. As a result, the optimized $Nb_2O_5$ dopants on the PZT specimens were 0.75 wt%.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.828-831
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• 2001

A simple and versatile method of manufacturing semiconductor devices with pn-junctions used the silicon direct bonding technology with simultaneous impurity diffusion is suggested . Formation of p- or n- type layers was tried during the bonding procedure by attaching two wafers in the aqueous solutions of Al(NO$_3$)$_3$, Ga(NO$_3$)$_3$, HBO$_3$, or H$_3$PO$_4$. An essential improvement of bonding interface structural quality was detected and a model for the explanation is suggested. Diode, Dynistor, and BGGTO structures were fabricated and examined. Their switching characteristics are presented.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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• pp.1311-1314
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• 2008

We have developed new electrical dopants of rhenium oxide ($ReO_3$) and cupper iodide (CuI) as p-dopants and rubidium carbonate ($Rb_2CO_3$) as an n-dopant, respectively. $ReO_3$ has advantage of low temperature evaporation (about $300^{\circ}C$) with enhanced device stability. Various kinds of high performance organic light emitting diodes have been realized, including bottom emission, tandem, and top-emission OLEDs.

• 한국세라믹학회지
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• 제28권7호
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• pp.517-524
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• 1991

The CVD process of BPSG (BoroPhosphoSilicate Glass) and its thin film properties were studied. B2H6, PH3, SiH4 and O2 gases were reacted in a AP (Atmospheric Pressure) CVD system in the temperature range of 300℃ and 460℃. The interaction of B2H6 and PH3 was studied from the deposition rate and dopant incorporation change point of view. The dependency of BPSG step coverage on the temperature was changed with different O2/(B2H6+PH3+SiH4) ratio. Finally, the boundary which distinguishes the stable BPSG's from the ones that react with Di (Deionized) water or cleaning chemicals such as H2SO4, HCl, H2O2, NH4OH etc could be defined.

• JSTS:Journal of Semiconductor Technology and Science
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• 제13권6호
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• pp.662-667
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• 2013

The effect of fluorine ions, which can be reacted with boron in high-doped BPSG, is investigated on the contact sidewall wiggling profile in semiconductor process. In the semiconductor device, there are many contacts on $p^+/n^+$ source and drain region. However these types of wiggling profile is only observed at the $n^+$ contact region. As a result, we find that the type of plug implantation dopant can affect the sidewall wiggling profile of contact. By optimizing the proper fluorine gas flow rate, both the straight sidewall profile and the desired electrical characteristics can be obtained. In this paper, we propose a fundamental approach to improve the contact sidewall wiggling profile phenomena, which mostly appear in high-doped BPSG on next-generation DRAM products.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 C
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• pp.1494-1496
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• 2002

내열 충격성 및 적외선 투과를 갖는 LAS($Li_2O-Al_2O_3-SiO_2$)계 글라스세라믹스를 제조하였다. 본 연구에서는 LAS계에 $TiO_2$를 핵형성제로, 점도를 감소시키기 위해 $P_2O_5$를 첨가하여 유리를 제조한 후, 글라스세라믹 결정상을 석출시켰다. 석출된 주 결정상은 ${\beta}$-eucryptite(SS)이었으며, 열팽창 계수가 거의 제로에 가까운 값을 얻었다. 또한 선택적인 스펙트럼의 흡수를 위한 color dopants에 대한 기초 자료 등이 조사되었다.

• 한국세라믹학회지
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• 제38권9호
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• pp.782-786
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• 2001

Cobalt silicide has been employed to Embedded DRAM (Dynamic Random Access Memory) and Logic (EDL) as contact material to improve its speed. We have investigated the influences of Ti and TiN capping layers on cobalt-silicided Complementary Metal-Oxide-Semiconductor (CMOS) device characteristics. TiN capping layer is shown to be superior to Ti capping layer with respect to high thermal stability and the current driving capability of pMOSFETs. Secondary Ion Mass Spectrometry (SIMS) showed that the Ti capping layer could not prevent the out-diffusion of boron dopants. The resulting operating current of MOS devices with Ti capping layer was degraded by more than 10%, compared with those with TiN.