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Factors affecting Amputation Level in Diabetic Foot (당뇨발 환자에서 절단 부위 결정에 영향을 주는 요인에 관한 연구)

  • Park, In-Heon;Song, Kyung-Won;Shin, Sung-Il;Lee, Jin-Young;Lee, Seung-Yong;Song, Si-Young;Park, Jae-Yong
    • Journal of Korean Foot and Ankle Society
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    • v.7 no.1
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    • pp.83-87
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    • 2003
  • Purpose: To evaluate the factors which affect the level of the amputation for treatment of DM foot excluding arterial occlusion. Materials and Methods: We selected 30 patients (10 of major amputations, 20 of minor amputations) who were amputated from May, 1999 to April, 2001 because of DM foot. Major amputation is BK amputation, and minor amputation is amputation below ankle joint. Gender, age, size of the wound, extent of the necrosis, infectious organism, medical com orbidity, duration of DM and blood glucose level, duration of DM foot and treatment history were investigated. Results: In major amputations, male to female ratio was 9:1, average of the age was 63.8, the average of sizes of the wound was 16cm2, duration of DM was 15.0 years, duration of DM foot was 10.6 weeks, and 80% of patients had necrosis and the organisms were S. aureus, E. faecium, Streptococcus, P. vulgaris, average of the blood glucose levels was 301 and 40% of them had been treated for DM foot. In minor amputations, male to female ration was 9:1, average of the age was 56.6, the average of sizes of the wound was 4.8cm2, duration of DM was 11.2 years, duration of DM foot was 5.7 weeks, and 40% of patients had necrosis and the organisms were S. aureus, Streptococcus, M. morganini, E. faecium, average of the blood glucose levels was 257 and 20% of them had been treated for DM foot. Conclusion: In DM foot patients, extents of the necrosis, duration of DM, duration of DM foot, the infectious organism were significant factors to decide extent of the amputation level.

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The Recycling of Nutrient Balance from Small Oranic farming System in Korea (소규모 유기농가단위 경축연계 자원순환 모델연구(I))

  • Yoon, Sung-Hee;Park, Dong-Ha;Choi, Si-Young;Kim, Jeong-Eun
    • Proceedings of the Korean Society of Organic Agriculture Conference
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    • 2009.12a
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    • pp.307-307
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    • 2009
  • 우리나라에서 농가단위 경축순환농업 모델에 대한 조사와 농장내 순환구조에서 양분수지를 조사한 사례도는 미미한 실정이다. 이에 경축연계 자원순환 유기농업농가의 실천사례 발굴하고, 실천모델별 축산형태 및 경종형태를 조사하여 경종부분의 양분순환과 양분수지를 조사하고자 하였다. 발굴된 농가단위 경축순환농업 사례는 3가지 형태로 모두 한우를 11~21두 범위에서 사육하는 동시에 $15,510m^2$의 밭농사를 수행하는 농가, $8,019m^2$의 밭농사와 $8,250m^2$ 논농사를 동시에 수행하는 농가, $26,400m^2$의 논농사만 수행하는 농가들이었다. 각 모델에서 배합사료는 모두 외부에서 구입하고 있었으며 조사료의 자급율은 25 ~ 100%인 것으로 조사되었다. 특히, 한우 20두와 논농사 $26,400m^2$를 경영하는 농가에서 조사료(볏짚)의 100%를 자급하였고 동시에 한우사육과정에서 발생한 자급퇴비를 전량 논농사에 사용하여 유기농 벼농사를 유지하고 있었다. 밭농사를 함께 수행하는 농가에서는 자급퇴비 외에 외부로부터 유박비료 및 발효유기질비료를 구입하여 양분을 충당하고 있었다. 각 농가의 토양이화학성을 분석한 결과 pH는 5.49~7.61, 유기물 함량은 1.37~1.40%, 유효인산 함량 253.32~329.63 mg/kg, 칼륨 0.24~0.3, 칼슘 3.97~10.1, 마그네슘 0.89~1.77 $Cmol^+$/kg, CEC는 7.92~11 $Cmol^+$/kg 이었므며 토양내 잔류농약은 검출되지 않았다. 농가별로 발생한 우분퇴비의 성분 분석결과는 전질소 0.68 ~ 0.73%, 전인산 0.68 ~ 0.86%, 칼륨 0.70~0.78% 수준이었다. 각 사례농가별 투입한 실제시비량, 토양분석결과와 사용된 자재의 성분 분석결과를 이용한 시비처방법에 따른 시비량 및 표준시비법에 따른 시비량을 산출하여 3요소의 양분수지를 계산하였다. 이와 함께 유기질비료의 무기화율을 감안한 시비량도 산출하였다. 양분수지를 분석한 결과 3농가 모두 실제시비량은 3요소 모두 초과 되는 것으로 나타났으며, 특히 인산과 칼륨이 2배정도 초과되는 경향을 보였다. 그러나 투입된 자급퇴비 및 유기질비료의 무기화율을 감안한 시비량으로 환산할 경우에는 질소성분이 3농가 모두 부족한 것으로 산출되었으며, 인산과 가리 성분은 충분하거나 초과되는 것으로 계산되었다. 농장내 축산경영을 통해 발생하는 자급퇴비만을 이용할 경우에 경종부문의 양분수지를 산출한 결과를 보면 실제시비량 기준으로 질소는 56~186%, 인산은 90~346%, 칼륨은41~221%로 양분수지가 달라졌으며, 무기화를 감안한 기준으로는 질소는 16~53%, 인산은 52~197%, 칼륨은 41~221%로 양분수지가 달라졌다. 소규모 유기농가단위 경축연계 자원순환 모델 연구를 통해 유기경종농업이 유지될 수 있으나, 3요소별 양분수지의 불균형이 발생할 수 있는 것으로 조사되었으며, 유기질비료의 특성상 무기화율을 감안한 시비량을 적용할 경우에는 질소 성분의 부족과 동시에 인산, 칼륨 성분의 과다가 예측되었다. 따라서 이러한 성분의 불균형을 조정할 시비체계 연구가 필요한 것으로 판단되었다. 본 연구는 농촌진흥청의 "유기가축사양 및 유기 순환체계모델" 연구사업의 세부과제로 수행한 1년차 결과입니다.

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Investigation on Agricultural Land Use and Soil Characteristics along Bonghwang-cheon Watershed in Milyang (밀양 봉황천 수계지역의 토지이용현황과 토양특성)

  • Lim, Dong-Kyu;Kang, Hang-Won;Jung, Yeun-Tae;Park, Kyeong-Bae;Park, Moo-Eon
    • Korean Journal of Soil Science and Fertilizer
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    • v.30 no.3
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    • pp.280-287
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    • 1997
  • This study was carried out to investigate agricultural status and soil fertility of Bonghwang-cheon watershed area which is located at Chodong-myeon, Milyang-si. The acreage of arable land was about 1,209ha, and the population was 3,706 people. Out of total arable land, paddy was 64.4%, upland 19.6% and orchard 16.0%. Chicken was the largest in the number of livestock and poultry, but pig seems to contribute most severly to water pollution. The geology in the lower stream was alluvium but andesite and derivated materials from it were occupied most upland areas. Tuff was scattered in the small area near by the alluvium of Nakdong river, and diorite and granodiorite were located at the low hill and mountains respectivately. The principal paddy soils in the area were Geumgog, Jisan and Imgog series etc of fine loamy on sloped valleys and fans. The Pyeongtaeg series, fine silty family of imperfectly drained on plain was irrigated by Chodong reservoir. The clayey Honam series on alluvium was distributed along the low hill while Gyuam series, coarse silty alluvial soil way close to Nakdong river. In chemical properties of soils, the vinyl house soils were higher in EC, and orchard soils in OM, $P_2O_5$, exchangeable canons than other soils.

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Copper Interconnection and Flip Chip Packaging Laboratory Activity for Microelectronics Manufacturing Engineers

  • Moon, Dae-Ho;Ha, Tae-Min;Kim, Boom-Soo;Han, Seung-Soo;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.431-432
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    • 2012
  • In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

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Ridge Formation by Dry-Etching of Pd and AlGaN/GaN Superlattice for the Fabrication of GaN Blue Laser Diodes

  • Kim, Jae-Gwan;Lee, Dong-Min;Park, Min-Ju;Hwang, Seong-Ju;Lee, Seong-Nam;Gwak, Jun-Seop;Lee, Ji-Myeon
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.391-392
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    • 2012
  • In these days, the desire for the precise and tiny displays in mobile application has been increased strongly. Currently, laser displays ranging from large-size laser TV to mobile projectors, are commercially available or due to appear on the market [1]. In order to achieve a mobile projectors, the semiconductor laser diodes should be used as a laser source due to their size and weight. In this presentation, the continuous etch characteristics of Pd and AlGaN/GaN superlattice for the fabrication of blue laser diodes were investigated by using inductively coupled $CHF_3$ and $Cl_2$ -based plasma. The GaN laser diode samples were grown on the sapphire (0001) substrate using a metal organic chemical vapor deposition system. A Si-doped GaN layer was grown on the substrate, followed by growth of LD structures, including the active layers of InGaN/GaN quantum well and barriers layer, as shown in other literature [2], and the palladium was used as a p-type ohmic contact metal. The etch rate of AlGaN/GaN superlattice (2.5/2.5 nm for 100 periods) and n-GaN by using $Cl_2$ (90%)/Ar (10%) and $Cl_2$ (50%)/$CHF_3$ (50%) plasma chemistry, respectively. While when the $Cl_2$/Ar plasma were used, the etch rate of AlGaN/GaN superlattice shows a similar etch rate as that of n-GaN, the $Cl_2/CHF_3$ plasma shows decreased etch rate, compared with that of $Cl_2$/Ar plasma, especially for AlGaN/GaN superlattice. Furthermore, it was also found that the Pd which is deposited on top of the superlattice couldn't be etched with $Cl_2$/Ar plasma. It was indicating that the etching step should be separated into 2 steps for the Pd etching and the superlattice etching, respectively. The etched surface of stacked Pd/superlattice as a result of 2-step etching process including Pd etching ($Cl_2/CHF_3$) and SLs ($Cl_2$/Ar) etching, respectively. EDX results shows that the etched surface is a GaN waveguide free from the Al, indicating the SLs were fully removed by etching. Furthermore, the optical and electrical properties will be also investigated in this presentation. In summary, Pd/AlGaN/GaN SLs were successfully etched exploiting noble 2-step etching processes.

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A Study on the Fabrication of the Solar Cells using the Recycled Silicon Wafers (Recycled Si Wafer를 이용한 태양전지의 제작과 특성 연구)

  • Choi, Song-Ho;Jeong, Kwang-Jin;Koo, Kyoung-Wan;Cho, Tong-Yul;Chun, Hui-Gon
    • Journal of Sensor Science and Technology
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    • v.9 no.1
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    • pp.70-75
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    • 2000
  • The recycled single crystal silicon wafers have been fabricated into solar cells. It can be a solution for the high cost in materials for solar cells and recycling of materials. So, p-type (100) single crystal silicon wafers with high resistivity of $10-14\;{\Omega}cm$ and the thickness of $650\;{\mu}m$ were used for the fabrication of solar cells. Optimistic conditions of formation of back surface field, surface texturing and anti-reflection coating were studied for getting high efficiency. In addition, thickness variation of solar cell was also studied for increase of efficiency. As a result, the solar cell with efficiency of 10% with a curve fill factor of 0.53 was fabricated with the wafers which have the area of $4\;cm^2$ and thickness of $300\;{\mu}m$. According to above results, recycling possibility of wasted wafers to single crystal silicon solar cells was confirmed.

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Characteristics of Adhesive Disks in Parthenocissus tricuspidata during Attachment (착생에 따른 담쟁이덩굴 흡착근의 부착 특성)

  • Lee, Myung-Hui;Kim, In-Sun
    • Applied Microscopy
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    • v.41 no.2
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    • pp.139-145
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    • 2011
  • Parthenocissus tricuspidata is an epiphyte that lacks a main axial stem, but develops adhesive disks along the stem for climbing support. In this study, scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDS) were utilized to examine the brick wall surface and the adhesive disks of P. tricuspidata that attached to the surface successfully. The study was mainly focused the outermost layers of both structures before and after adhesion to find out whether there has been some structural and/or physical interactions between the two. The adhesive disks adhered firmly to the brick wall by secreting adhesive materials that help them for a tight attachment to the surface. The rough wall surface appeared facilitating better attachment of the adhesive disks by infiltrating the materials into those spaces leading to some degree of interactions at the interface. EDS analysis on the outermost layers of the adhesive disks that were separated from the substrates was also consistent with the SEM data on the interaction between the adhesive disks and the substrate surface. EDS analysis of the brick wall surface and the adhesive disks demonstrated similar elements of O, Si, Fe, Al, K, Mg, and Na in their components.

A Study on the Grazing Behavior of Thoroughbred Colts Grazed in Pasture at Summer Season of Jeju Island (제주지역에서 사육중인 경주 육성마의 여름철 방목행동에 관한 연구)

  • Jeon, Byong-Tae;Kim, Myeong-Hwa;Park, Jae-Hyun;Kim, Sung-Jin;Sung, Si-Heung;Lee, Sang-Moo;Moon, Sang-Ho
    • Journal of The Korean Society of Grassland and Forage Science
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    • v.29 no.4
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    • pp.365-374
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    • 2009
  • This study was carried out in thoroughbred colts grazed in pasture at summer season of Jeju island, Korea, from June 23 to 29 in 2007. We investigated the behavioral pattern of the thoroughbred colts (n=23) at the age of 3-year-old (n=11) and 1-year-old (n=12). The group behavioral pattern of thoroughbred colts was different according to the age. It was shown that eating 56%, standing 23%, lying 10%, walking 5%, running 2.5% and drinking 3% in the 1-year-old thoroughbred colts group. Especially, it was significantly individual difference (P<0.05) in the average behavioral expression ratio of 1-year-old thoroughbred colts (n=3), which was eating 53%, standing 29%, lying 11%, walking 5%, drinking 1% and running 1%. On the other hand, it was investigated that eating 54%, standing 27%, walking 13%, running and drinking 1.5%, lying 1% in the 3-year-old thoroughbred colts group. Also, the individual behavioral expression ratio of the 3-year-old thoroughbred colts was eating 53%, standing 32%, walking 10%, running and drinking 1%, which was a similar pattern to the result of 1-year-old colts. It is considered that this is the first study regarding a pasturage action of a racehorse produced in Korea. These data cannot be enough, but this data will be based on the production of racehorses and fostered in the management.

Surface Morphology of PEO-treated Ti-6Al-4V Alloy after Anodic Titanium Oxide Treatment (ATO 처리후, 플라즈마 전해 산화 처리된 Ti-6Al-4V 합금의 표면 형태)

  • Kim, Seung-Pyo;Choe, Han-Cheol
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2018.06a
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    • pp.75-75
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    • 2018
  • Commercially pure titanium (CP-Ti) and Ti-6Al-4V alloys have been widely used in implant materials such as dental and orthopedic implants due to their corrosion resistance, biocompatibility, and good mechanical properties. However, surface modification of titanium and titanium alloys is necessary to improve osseointegration between implant surface and bone. Especially, when titanium oxide nanotubes are formed on the surface of titanium alloy, cell adhesion is greatly improved. In addition, plasma electrolytic oxide (PEO) coatings have a good safety for osseointegration and can easily and quickly form coatings of uniform thickness with various pore sizes. Recently, the effects of bone element such as magnesium, zinc, strontium, silicon, and manganese for bone regeneration are researching in dental implant field. The purpose of this study was researched on the surface morphology of PEO-treated Ti-6Al-4V alloy after anodic titanium oxide treatmentusing various instruments. Ti-6Al-4V ELI disks were used as specimens for nanotube formation and PEO-treatment. The solution for the nanotube formation experiment was 1 M $H_3PO_4$ + 0.8 wt. % NaF electrolyte was used. The applied potential was 30V for 1 hours. The PEO treatment was performed after removing the nanotubes by ultrasonics for 10 minutes. The PEO treatment after removal of the nanotubes was carried out in the $Ca(CH_3)_2{\cdot}H_2O+(CH_3COO)_2Mg{\cdot}4H_2O+Mn(CH_3COO)_2{\cdot}4H_2O+Zn(CH_3CO_2)_2Zn{\cdot}2H_2O+Sr(CH_2COO)_2{\cdot}0.5H_2O+C_3H_7CaO_6P$ and $Na_2SiO_3{\cdot}9H_2O$ electrolytes. And the PEO-treatment time and potential were 3 minutes at 280V. The morphology changes of the coatings on Ti-6Al-4V alloy surface were observed using FE-SEM, EDS, XRD, AFM, and scratch tester. The morphology of PEO-treated surface in 5 ion coating solution after nanotube removal showed formation or nano-sized mesh and micro-sized pores.

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COMPARATIVE STUDY OF DIGITAL AND CONVENTIONAL RADIOGRAPHY FOR THE DIAGNOSTIC ABILITY OF ARTIFICIAL PROXIMAL SURFACE CARIES (디지털방사선사진과 구내방사선사진의 인접면 인공우식진단능에 관한 비교연구)

  • Cho, Young-Gon;Park, Si-Seung
    • Restorative Dentistry and Endodontics
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    • v.27 no.2
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    • pp.113-121
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    • 2002
  • Conventional intraoral radiography continues to be the most widely used image modality for the diagnosis of dental caries. But, conventional intraoral radiography has several shortcomings, including the difficulty of exposing and processing intraoral film of consistently acceptable quality. In addition, radiographic retaking that was the result of processing errors, may result in increased discomfort and radiation dose to the patient. Recently, various digital radiographies substitute for conventional intraoral radiography to overcome these disadvantages. The advantages of digital radiography are numerous. One of advantages Is the elimination of processing errors. In addition, the radiation dose for digital system is approximately 20% to 25% of that required for conventional intraoral radiography Another potential advantage of digital imaging is the ability to perform image quality enhancements such as contrast and density modulation, which may increase diagnostic accuracy. The purpose of this study was to compare the diagnostic ability of artificial proximal defects to conventional intraoral radiography, direct digital image(CDX2000HQ$^{\circledR}$) and indirect digital image(Digora$^{\circledR}$). Artificial defects were made in proximal surfaces of 60 extracted human molars using #1/2, #1, #2 round bur. Five dentists assessed proximal defects on conventional intraoral radiography, direct digital image(CDX2000HQ$^{\circledR}$) and indirect digital image(Digora$^{\circledR}$). ROC(Receiver Operating Characteristic) analysis and Two-way ANOVA test were used for the evaluation of detectability, and following results were acquired. 1. The mean ROC area of conventional intraoral radiography, direct digital image(CDX2000HQ$^{\circledR}$) and indirect digital Image(Digora$^{\circledR}$) were 0.6766, 0.7538, 0.6791(Grade I), 0.7176, 0.7594, 0.7361(Grade II), and 0.7449, 0.7608, 0.7414(Grade III), respectively. 2. Diagnostic ability of direct digital image was higher than other image modalities. But, there was no statistically significant difference among other imaging modalities for Grade I, II, III lesion(p>0.05). In conclusion, when direct and indirect digital system are comparable with conventional intraoral radiography. these systems may be considered an alternative of conventional intraoral radiography for the diagnosis of proximal surface caries.