• Journal of Magnetics
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• v.9 no.1
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• pp.13-16
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• 2004

Magnetic tunnel junctions (MTJs) comprising amorphous CoNbZr layers have been investigated. $Co_{85.5}Nb_8Zr_{6.5}$(in at. %) layers were employed to substitute the traditionally used Ta layers with an emphasis given on under-standing underlayer effect. The typical junction structure was $SiO_2/CoNbZr$ or Ta 2/CoFe 8/IrMn 7.5/CoFe 3/Al 1.6 + oxidation/CoFe 3/CoNbZr or Ta 2 (nm). For both as-deposited state and after annealing, the CoNbZr-underlayered structure showed superior surface smoothness up to the tunnel barrier than Ta-underlayerd one (rms roughness of 0.16 vs. 0.34 nm). CoNbZr-based MTJs was proven beneficial for increasing thermal stability and increasing $V_h$ (the bias voltage where MR ratio becomes half) characteristics than Ta-based MTJs. This is because the CoNbZr-based junctions offer smoother interface structure than the Ta-based one.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.11
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• pp.35-43
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• 1995

To obtain high quality of $Ta_{2}O_{5}$ film, two dielectric layers of $Si_{3}N_{4}$ and $Ta_{2}O_{5}$ were subsequently formed on Si wafer. Silicon nitride films were thermally grown in 10 Torr ammonia ambient by R.F induced heating system. The thickness of thermally grown $Si_{3}N_{4}$ film was able to be controlled in the range of tens $\AA$ due to the self-limited growth property. $Ta_{2}O_{5}$ film of 200$\AA$ thickness was then deposited on the as-grown $Si_{3}N_{4}$ film about 25$\AA$ thickness by sputtering method and annealed at $900^{\circ}C$in $O_{2}$ ambient for 1hr. Stoichiometry film was prepared by the annealing in oxygen ambient. Despite the high temperature anneal process, silicon oxide layer was not grown at the interface of the layered films because of the oxidation barrier effect of Si$_{3}$N$_{4}$ film. The fabricated $Ta_{2}O_{5}$/$Si_{3}N_{4}$ film showed low leakage current less than several nA and high dielectric breakdown strength.

• New & Renewable Energy
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• v.1 no.1 s.1
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• pp.64-71
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• 2005

The stability of alumina-coated NiO cathodes was studied in $Li_{0.62}/K_{0.38}$ molten carbonate electrolyte. Alumina was effectively coated on the porous Ni plate using galvanostatic pulse plating method. The deposition mechanism of alumina was governed by the concentration of hydroixde ions near the working electrode, which was controlled by the temperature of bath solution. Alumina-coated NiO cathodes were formed to $A1_2O_3-NiO$ solid solution by the oxidation process and their Ni solubilities were were than that of NiO up to the immersion time of 100h. However, their Ni solubilities increased and were similar to that of the bare NiO cathode after 100h. It was because aluminum into the solid solution was segregated to $\alpha-LiAlO_2$ on the NiO and its Product did not Play a role of the Physical barrier against NiO dissolution.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.234.2-234.2
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• 2014

Organic light emitting diode (OLED) is considered as the next generation flat panel displays due to its advantages of low power consumption, fast response time, broad viewing angle and flexibility. For the flexible application, it is essential to develop thin film encapsulation (TFE) to protect oxidation of organic materials from oxidative species such as oxygen and water vapor [1]. In many TFE research, the inorganic film by atomic layer deposition (ALD) process demonstrated a good barrier property. However, extremely low throughput of ALD process is considered as a major weakness for industrial application. Recently, there has been developed a high throughput ALD, called 'spatial ALD' [2]. In spatial ALD, the precursors and reactant gases are supplied continuously in same chamber, but they are separated physically using a purge gas streams to prevent mixing of the precursors and reactant gases. In this study, the $Al_2O_3$ thin film was deposited by spatial ALD process. We characterized various process variables in the spatial ALD such as temperature, scanning speed, and chemical compositions. Water vapor transmission rate (WVTR) was determined by calcium resistance test and less than $10-^3g/m^2{\cdot}day$ was achieved. The samples were analyzed by x-ray photoelectron spectroscopy (XPS) and field emission scanning electron microscope (FE-SEM).

• Journal of Microbiology and Biotechnology
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• v.22 no.4
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• pp.547-554
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• 2012

Chromium is generated from several industrial processes. It occurs in different oxidation states, but Cr(III) and Cr(VI) are the most common ones. Cr(VI) is a toxic, soluble environmental contaminant. Some bacteria are able to reduce hexavalent chromium to the insoluble and less toxic Cr(III), and thus chromate bioremediation is of considerable interest. An indigenous chromium-reducing bacterial strain, Rb-2, isolated from a tannery water sample, was identified as Ochrobactrum intermedium, on the basis of 16S rRNA gene sequencing. The influence of factors like temperature of incubation, initial concentration of Cr, mobility of bacteria, and different carbon sources were studied to test the ability of the bacterium to reduce Cr(VI) under variable environmental conditions. The ability of the bacterial strain to reduce hexavalent chromium in artificial and industrial sewage water was evaluated. It was observed that the mechanism of resistance to metal was not due to the change in the permeability barrier of the cell membrane, and the enzyme activity was found to be inductive. Intracellular reduction of Cr(VI) was proven by reductase assay using cell-free extract. Scanning electron microscopy revealed chromium precipitates on bacterial cell surfaces, and transmission electron microscopy showed the outer as well as inner distribution of Cr(VI). This bacterial strain can be useful for Cr(VI) detoxification under a wide range of environmental conditions.

• Progress in Superconductivity
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• v.3 no.1
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• pp.49-55
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• 2001

Josephson junction arrays were fabricated by DC magnetron sputtering, self-aligning and reactive ion etching technique. The Al native oxide, formed by thermal oxidation, was used as the tunneling barrier of Nb/$Al-A1_2$$O_3$Nb trilayer. The arrays have 2,000 Josephson junctions with the area of $14\mu\textrm{m}$ $\times$ $46\mu\textrm{m}$. The gap voltages were in the range of 2.5 ~2.6 mV and the spread of critical current was $\pm$11~14%. When operated at 70~94 ㎓, the arrays generated zero-crossing steps up to 2.1~2.4 V. To improve transmission of microwave power and prevent diffusion of oxygen into Nb ground-plane while depositing $SiO_2$dielectric, we applied a plasma nitridation process to the Nb ground-plane. The microwave power was well propagated in Josephson junction arrays with nitridation. The difference in microwave transmission 7an be interpreted by the surface impedance change depending on nitridation.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.47 no.6
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• pp.5-21
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• 2015

The common production methods of nanocellulosic (cellulosic nanofibrils, CNF) materials from wood are being reviewed, together with large scale applications and particularly papermaking applications. The high energy demand for producing CNF has been one particular problem, which has been addressed over the years and can now be considered solved. Another problem was the clogging of homogenizers/microfluidizers, and the different routes to decrease the energy demand. The clogging tendency, related to the flocculation tendency of fibres is discussed in some detail. The most common methods to decrease the energy demand are TEMPO-oxidation, carboxymethylation and mechanical/enzymatic pre-treatments in the order of increased energy demand for delamination. The rheology characteristics of CNF materials, i.e. the high shear viscosity, shear thinning and the thixotropic properties are being illuminated. CNF materials are strength adjuvants that enhance the relative bonded area in paper sheets and, hence increase the sheet density and give an increased strength of the paper, particularly for chemical pulps. At the same time papers obtain a lower light scattering, higher hygroexpansion and decreased air permeability, similar to the effects of beating pulps. The negative effects on drainage by CNF materials must be alleviated through the appropriate use of microparticulate drainage aids. The use of CNF in films and coatings is interesting because CNF films and coatings can provide paper/board with good oxygen barrier properties, particularly at low relative humidities. Some other high volume applications such as concrete, oil recovery applications, automotive body applications and plastic packaging are also briefly discussed.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.420-420
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• 2011

결정질 태양전지에서 고효율 달성을 위한 LBC(Local Back Contact) 구조의 중요성이 강조되고 있다. LBC 구조에서 후면 passivation 형성을 위한 SiNX layer를 PECVD로 형성 시, 실리콘 bulk 내로 H+ 원자가 침투하여 Boron과 결합하게 되면 Boron이 bulk 내에서 dopant로 작용을 하지 못하게 되어, 후면에서 p-층을 형성하고, 이는 VOC의 저하를 야기 시킨다. 본 연구에서는 LBC 구조에서 후면 passivation 시 bluk 내 B-H결합으로 인한 태양전지 특성 저하 문제를 해결하기 위해, SiNX를 증착하기 전에 얇은 산화막 barrier를 성장시켜 Bulk 내에 H+ 침투를 최소화 하였다. PECVD를 이용한 N2O 플라즈마 처리, HNO3 Wet Chemical Oxidation의 방법을 통해 substrate와 SiNX 사이에 얇은 oxide 층을 형성하였으며, 각각의 조건에 대해 lifetime 측정을 실시하였다. 그 결과 SiON/SiNx를 이용한 막의 lifetime이 $94.5{\mu}s$로 가장 우수하였고, Reference에 비해 25.4% 증가함을 확인할 수 있었다. 그러나 HNO3/SiNx에서는 30.6%, SiON에서는 84.3% 감소함을 확인하였다. Voc 측정 결과 또한 SiON/SiNx를 이용한 막이 670mV로 가장 우수함을 확인할 수 있었다. 본 연구를 통해 LBC구조에서 후면에 얇게 SiON/SiNx막을 형성함으로서 H+이온의 침투를 저지하여 후면 B-H결합을 막아 태양전지 특성 저하를 감소시키는 것을 확인할 수 있었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.255-255
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• 2011

$SiO_2$는 유전체 물질로서 고온에 강하고 열 변화에 민감하지 않으며 자외선을 잘 투과시키는 특성 때문에 각종 광전자 소자에 많이 응용되고 있다. 최근에는 classical thermal oxidation 방식을 이용하여 태양전지의 효율을 증가하기 위한 표면 보호막, 유기발광다이오드의 보호막 및 barrier로 적용되고 있다. $SiO_2$ 박막의 경우 RF-DC sputtering, thermal evaporation, plasma enhanced chemical vapor deposition, E-beam evaporation 등의 다양한 방법을 통하여 제작되고 있다. 이들 중 E-beam evaporation 법은 높은 증착속도, 증착방향성, 낮은 불순물농도 등 많은 장점을 가지고 $SiO_2$ 박막 증착이 가증하다. 따라서 본 연구에서는 Si 기판위에 $SiO_2$를 증착각도를 0$^{\circ}$, 25$^{\circ}$, 50$^{\circ}$, 70$^{\circ}$로 변화시켜 증착하였고, 증착속도, 빔 세기, 기판 회전속도 등을 변화시켰다. 또한, 증착 각도에 따른 유전율 차이를 무반사 특성 향상에 응용하기 위해 다양한 layer 층을 순차적으로 성장시켰다. 제작된 $SiO_2$의 나노구조의 구조적, 광학적 특성은 field emission scanning microscopy, atomic force microscopy, UV-VIS-NIS spectrophotometer를 이용하여 분석되었다.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.133-133
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• 2011

최근 나노입자를 이용한 비휘발성 메모리 소자의 제작에 대한 연구가 진행되고 있다. 특히, 실리사이드 계열의 나노입자를 적용한 소자는 일함수가 크지만 실리콘 내의확산 문제를 가지고 있는 금속 나노입자와 달리 현 실리콘 기반의 반도체 공정 적용이 용이한 잇 점을 가지고 있다. 따라서 본 연구에서는 실리사이드 계열의 화합물 중에서 4.63 eV인 Vanadium Silicide ($V_3$Si) 박막을 열처리 과정을 통하여 수 nm 크기의 나노입자로 제작하였다. 소자의 제작은 p-Si기판에 5 nm 두께의 $SiO_2$ 터널층을 dry oxidation 방법으로 성장시킨 후 $V_3$Si 금속박막을 RF magnetron sputtering system을 이용하여 3~5 nm 두께로 tunnel barrier위에 증착시켰다. Rapid thermal annealing법으로 질소 분위기에서 $1000^{\circ}C$의 온도로 30초 동안 열처리하여 $V_3$Si 나노 입자를 형성 하였으며. 20 nm 두께의 $SiO_2$ 컨트롤 산화막층을 ultra-high vacuum magnetron sputtering을 이용하여 증착하였다. 마지막으로 thermal evaporation system을 통하여 Al 전극을 직경 200, 두께 200nm로 증착하였다. 제작된 구조는 metal-oxide-semiconductor구조를 가지는 나노 부유 게이트 커패시터 이며, 제작된 시편은 transmission electron microscopy을 이용하여 $V_3$Si 나노입자의 크기와 균일성을 확인했다. 소자의 전기적인 측정은 E4980A capacitor parameter analyzer와 Agilent 81104A apulse pattern generator system을 이용한 전기용량-전압 측정을 통해 전하저장 효과를 분석하였다.