• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.608-611
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• 2000

This study is for stabilizer, a parts of automotive suspension system, that would be changed to Plastic Material. The part is designed and analyze by PRO-E. The position of Weld Line is founded by the C-mold, computer software with FEM. Then a Mold is designed by consideration with locating Weld Line. Mechanical property tests, such as tensile test, compression test, ball pull-out test, fatigue test and durability test are done the part by SAE test spec. Most of all the result of the tests show over requirement result without the compression test.

• Progress in Superconductivity
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• 제2권1호
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• pp.15-19
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• 2000

[ $YBa_2Cu_3O_{7-\delta}$ ] thin films were deposited by laser ablation using modified melt-textured grown targets. As the laser energy density was increased, the films showed an increasing c-axis orientation and an improvement of superconducting properties. However, at 4 $J/cm^2$, the degree of c-axis alignment and $J_c$ of the film were considerably reduced. These were attributed to the enhanced a-axis outgrowths. It was shown that the increased laser energy density resulted in the formation of $Y_2O_3$ inclusions during the c-axis film growth, and that these inclusions nucleated the a-axis outgrowths.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.461-462
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• 2006

This paper reports on the development of a scanning probe microscopy(SPM) tip with caborn nanotubes. We used an electric field which causes dielectrophoresis(DEP), to align and deposit CNTs on a metal-coated SPM tip. Using the CNT attached SPM tip, we have obtained an enhanced resolution and wear property compared to that from the bare silicon tip through the scanning of the surface of the bio materials. The carbon nanotube tip align toward the source of the ion beam allowing their orientation to be changed at precise angles. By this technique, metal coated carbon nanotube tips that are several micrometer in length are prepared for scanning probe microscopy.

• 소성∙가공
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• 제18권6호
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• pp.476-481
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• 2009

The present work demonstrates the mechanical and electrical responses of submicrocrystalline Cu-3%Ag alloy as a function of strain imposed by equal channel angular pressing(ECAP). From transmission electron microscope observation, the resulting microstructures of Cu-3%Ag alloy deformed by ECAP for 8-pass or more consist of reasonably fine, equiaxed grains without having a strong preferred orientation, suggesting that microstructure evolution is slower than that of pure-Al and its alloys owing to low stacking fault energy. The results of room temperature tension tests reveal that, as the amount of applied strain increases, the tensile strength of submicrocrystalline Cu-3%Ag alloy increases whereas losing both the ductility and the electrical conductivity. Such phenomenon can be explained based on microstructure featured by the non-equilibrium grain boundaries.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.450-452
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• 2005

The ion beam alignment technique is one of the potential and fascinating methods. However, there are merely a few reports about aligning nematic liquid crystals (NLCs) horizontally for in-plane switching mode (IPS) by means of low energy ion beam exposure on inorganic materials such as DLC. In this study, we have investigated the tilted vertical alignment of NLC by the ion beam technique on the thin films of various amorphous silicon compounds as new inorganic alignment materials. Appropriate pretilt angles of NLC with preferred orientation on these thin films were achieved. And the electro-optic property of vertically aligned single domain cells has been investigated.

• 한국표면공학회지
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• 제49권6호
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• pp.575-579
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• 2016

The metal mesh films with thickness of 1.0, 1.5, $2.0{\mu}m$ were prepared by photolithography using Ag, Al, and Cu metals. Every metal films were showed C(111) preferred orientation and Ag showed the lowest resistivity and followed by Al and Cu. The transmittance of almost films were higher than 90%. But, the Ag film with thickness of $2.0{\mu}m$ was delaminated during photolithography process due to low adhesion. So, Cu and Ti metal films were introduced under Ag film to improve adhesion property. The Cu film showed higher adhesion properties compared to Ti film. Furthermore, the Ti films that deposited on Ag film showed higher acid resistance.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 ITC-CSCC -1
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• pp.474-477
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• 2000

This paper presents an algorithm for simplification of 3D triangular mesh data, based on mesh simplification. The proposed algorithm is first attempt to segment the entire mesh into several parts using the orientation of triangles. Then simplification algorithm is applied to each segment that has similar geometric property. The proposed two step multi-resolution modeling scheme would yield better performance then conventional algorithm like edge collapse technique, since the segmentation step can give global information on the input shape. The experimental results show that the proposed algorithm is performed efficiently.

• 한국전기전자재료학회논문지
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• 제22권1호
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• pp.53-60
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• 2009

$ZrTiO_4$ dielectric thin films were coated by metal-organic decomposition, and annealed by rapid thermal processing up to $900^{\circ}C$ for their crytallization. Crystallized single-phase $ZrTiO_4$ thin films were fabricated above the annealing temperature of $800^{\circ}C$, but their grains were randomly oriented without specific textured orientation. Best dielectric properties were presented by the sample annealed at $800^{\circ}C$ which had crystalline structure and flat surface. Dielectric constant of the film was maintained at 32 throughout full frequency range up to 6 GHz, and dielectric loss was varied between 0.01 and 0.04.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2003년도 하계학술대회 논문집 C
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• pp.1577-1579
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• 2003

AlN thin films are prepared on Si (111) substrate by RF magnetron sputtering. Two-step deposition method is proposed to obtain AlN thin films with high c-axis (002)-TC value and low surface roughnesses. For all the deposited AlN films, the c-axis (002)-orientation, surface mophology, and roughness are characterized in terms of deposition conditions FEAR devices with Al/AlN/Mo/Si(111) configuration are also fabricated. From the frequency response characteristics, the return loss and electromechanical coupling contant($k_t{^2}$) are estimated.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.684-685
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• 2006

In the present study, the powder metallurgical fabrication of $Bi_{0.4}Te_3Sb_{1.6}$ thermoelectric materials has been studied with specific interest to control the microstructure by the mechanical grinding process. The $Bi_{0.4}Te_3Sb_{1.6}$ thermoelectric powders with a various particle size distribution were prepared by the combination of the mechanical milling and blending processes. The specific electric resistivity of the $Bi_{0.4}Te_3Sb_{1.6}$ sintered bodies mainly depended on the orientation of the crystal structure rather than the particle size of the raw powders.