• 전기학회논문지
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• 제59권3호
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• pp.609-613
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• 2010

In this paper, we optimized and simulated the heatsink of 75W LED module for street lighting and evaluated the optical properties with the manufactured heatsink. the structure of LED package make simple as chip and heatslug and thermal flow is analyzed by using the FEM(Finite Element Method) with CFdesign V10. Also, we measured the temperature of heatsink and evaluated the optical properties with infrared thermal image camera and integrated sphere system for luminous flux in $1\;[m^3]$ box. As results, Heatsink optimized in 3 mm pin thickness, 6 mm base thickness and 16 number of pin count by using Heatsink-designer and got the results which is the temperature of $47.37\;[^{\circ}C]$ and thermal resistance of $0.48407\;[W/^{\circ}C]$. In thermal flow simulation, the temperature of heatsink decreased from $51.54\;[^{\circ}C]$ to $51.51\;[^{\circ}C]$ and the temperature of heatsink by the time in real measurement decreased from $47.03\;[^{\circ}C]$ to $46.87\;[^{\circ}C]$. Moreover, we improve 0.68 % in the decreased ratio of the luminous flux.

• Design & Manufacturing
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• 제8권2호
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• pp.46-49
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• 2014

Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

• 통합자연과학논문집
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• 제3권3호
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• pp.168-173
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• 2010

Novel porous silicon chip exhibiting dual optical properties, both Frbry-Perot fringe (optical reflectivity) and photoluminescence had been developed and used as chemical sensors. Porous silicon samples were prepared by an electrochemical etch of p-type sillicon wafer (boron-doped, <100> orientation, resistivity 1 - 10 ${\Omega}$). The ething solution was prepared by adding an equal volume of pure ethanol to an aqueous solution of HF (48% by weight). The porous silicon was illuminated with a 300 W tungsten lamp for the duration of etch. Ething was carried out as a two-electrode Kithley 2420 preocedure at an anodic current. The surface of porous silicon was characterized by FT-IR instrument. The porosity of samples was about 80%. Three different types of porous silicon, fresh porous silicon (Si-H termianated), oxidized porous silicon (Si-OH terminated), and surface-derivatized porous silicon (Si-R terminated), were prepared by the thermal oxidation and hydrosilylation. Then the samples were exposed to the wapor of various organics vapors. such as chloroform, hexane, methanol, benzene, isopropanol, and toluene. Both reflectivity and photoluminescence were simultaneously measured under the exposure of organic wapors.

• Journal of Welding and Joining
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• 제21권2호
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• pp.97-101
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• 2003

The change of microstructures in the base metal during transient liquid phase bonding process of directionally Ni base superalloy, GID-111 was investigated. Bonds were fabricated using a series of holding times(0~7.2ks) at three different temperatures. The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of samples was evaluated. A TiW/Cu/electroplated Cu UBM structure was selected and the samples were aging treated to analyze the effect of intermetallic compounds with the time variations. An FIB technique was applied to the preparation of samples for TEM observations. An FIB technique is very useful to prepare TEM thin foil specimens from the solder joint interface. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the solder and the UBM was observed by using SEM, TEM and EDS. As a result, the shear strength was decreased of about 21% in the 100${\mu}{\textrm}{m}$ sample at 17$0^{\circ}C$ aging compared with the maximum shear strength of the sample with the same pad size. In the case of the 12$0^{\circ}C$ aging treatment, 18% of decrease in shear strength was measured at the 100${\mu}{\textrm}{m}$ pad size sample. An intermetallic compound of Cu6Sn5 and Cu3Sn were also observed through the TEM measurement by using.

• Journal of the Optical Society of Korea
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• 제18권6호
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• pp.633-638
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• 2014

We report experimental behaviors of condensed $^{87}Rb$ atoms responding to changes in the trap potential of the atomchip. The two-types of adiabatic and non-adiabatic overall changes were implemented by changing the ramp-down speed of the chip-wire current, which can dominantly modify the one-axis magnetic field gradient. Under the adiabatic process, a pure condensate stayed in the initial spin state and collectively oscillated with both monopole and dipole modes, while an atomic cloud above the critical temperature exhibited sound waves in a dense ultracold gas. On the other hand, Bose-Einstein condensate atoms with non-adiabatic perturbation were split into spatially different positions by spin states through spin-flip. We investigated the split ratio among spin states depending on final evaporation frequency. Potential changes, of course, cause collective oscillations regardless of the changing process.

• Current Optics and Photonics
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• 제3권6호
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• pp.531-540
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• 2019

Spectral Amplitude Coding Optical Code Division Multiple Access (SAC OCDMA) is an advanced technique in asynchronous environments. This paper proposes design and implementation of a novel quantum logic gate (QLG) code, with code construction algorithm generated without following any code mapping procedures for SAC system. The proposed code has a unitary matrices property with maximum overlap of one chip for various clients and no overlaps in spectra for the rest of the subscribers. Results indicate that a single algorithm produces the same length increment for codes with weight greater than two and follows the same signal to noise ratio (SNR) and bit error rate (BER) calculations for a higher number of users. This paper further examines the performance of a QLG code based SAC-OCDMA system with NAND and direct detection techniques. BER analysis was carried out for the proposed code and results were compared with existing MDW, RD and GMP codes. We demonstrate that the QLG code based system performs better in terms of cardinality, which is followed by improved BER. Numerical analysis reveals that for error free transmission (10^-9), the suggested code supports approximately 170 users with code weight 4. Our results also conclude that the proposed code provides improvement in the code construction, cross-correlation and minimization of noises.

• 소성∙가공
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• 제14권3호
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• pp.245-250
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• 2005

Recently, micro machining technology for high precision mold becomes more interested for mass production of high performance optical parts micro-grooved on the surface, which is under very active development due to its effectiveness in the view point of optical performance. Mechanical micro machining technology now has more competitiveness on lithography, MEMS or LIGA processes which have some problems to fabricate especially cylinder type of groove in such as lenticular lens for illumination angle modulation system. In this study. a lenticular lens mold with U-type micro groove is fabricated making utilizing of the benefit of the mechanical micro machining technology. A shaping machining process is adapted using 3 axis degree of freedom micro machining system and single crystal natural diamond tool. A brass and a electroless nickel materials are used for mold fabrication. Machining force, chip shape and machined surface are investigated from the experiment and an optimal machining condition is found based on the examined problems from the micro cutting process.

• 한국콘텐츠학회:학술대회논문집
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• 한국콘텐츠학회 2005년도 춘계 종합학술대회 논문집
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• pp.443-447
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• 2005

텔레매틱스를 위한 임베디드 이동체 자동화시스템(EMAST : Embedded Mobile Automatic System for Telematics)인 EMAST는, CAN(Controller Area Network)과 ARM Processor를 이용한 임베디드 이동체 자동화 시스템을 단일 칩(System-on-Chip)으로 구현된다. EMAST가 범용적으로 사용되기 위해서는 다음 두 조건을 만족해야만 한다. 첫째, 이동체 내부 인터페이스는 Differential Transceiver와 Optical Transceiver, Wireless Transceiver를 지원하도록 설계되어야하며, 둘째, EMAST와 텔레매틱스 망을 사용하는 단말기들 간의 인터페이스를 지원해야만 한다. 본 논문에서는 텔레매틱스를 위한 임베디드 이동체 자동화 시스템 구조 및 EMAST와 이동체각 Unit들과의 효율적인 인터페이스 구조를 제안하였다.

• 한국광학회지
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• 제20권4호
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• pp.236-240
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• 2009

LED 조명과 액정 후면 배광 장치와 같이 고방열, 고출력 광원이 요구되는 응용제품에 적합한 LED 광원 모듈을 제작하였다. 제안한 LED 광원 모듈은 기존 패키지 구조의 LED 광원과 다르게 LED 칩을 응용제품의 필요에 따른 배광 분포 제어와 광자재흡수를 개선하기 위해 반사컵 구조를 적용한 금속 기판의 표면에 LED 칩을 바로 실장하였다. 또한 기존 금속기판에 적용하던 알루미늄 산화막 절연층의 문제점을 개선하여 방열 특성을 향상시켰다. 나아가 방열 특성 개선으로 LED 칩에서 발생하던 열에 의해 발생하던 광효율 저하 문제를 개선하는 결과를 얻었다.

• 조명전기설비학회논문지
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• 제19권2호
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• pp.1-6
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• 2005

본 연구에서는 광고 조명으로 인한 에너지 소비를 극소화하기 위하여 OF-LED(Optical-Fiber LED)를 이용한 에너지 절약형 광고 조명 시스템에 대하여 연구하였다. 제안한 OF-LED광고 조명 시스템은 에너지 소비가 획기적으로 저감되고 시스템의 소형화가 가능하며, 부조일이 높은 장마철을 제외하고는 태양광 발전만으로 운영하는 큰 장점을 가진다. 태양전지의 출력 특성에 의한 배터리의 최단$\cdot$최적 충전을 위해 정전류$\cdot$정전압 제어법(CCVC)과, IncCond알고리즘을 병행하여 적용하였다 그리고 원칩 마이크로프로세서로 디스플레이 제어와 충 방전제어를 동시에 수행하도록 하였다. 이를 실험을 통하여 제시된 시스템의 유용성을 입증하였다.