Design & Manufacturing
- Volume 8 Issue 2
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- Pages.46-49
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- 2014
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- 2800-0323(pISSN)
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- 2733-452X(eISSN)
Cure simulation in LED silicone lense using dynamic reaction kinetics method
승온 반응속도식을 이용한 LED용 실리콘 렌즈의 경화공정해석
-
Song, Min-Jae
(Molds & Dies Technology R&DB Group, Korea Institute of Industrial Technology)
;
-
Hong, Seok-Kwan
(Molds & Dies Technology R&DB Group, Korea Institute of Industrial Technology)
;
-
Park, Jeong-Yeon
(Molds & Dies Technology R&DB Group, Korea Institute of Industrial Technology)
;
-
Lee, Jeong-Won
(Molds & Dies Technology R&DB Group, Korea Institute of Industrial Technology)
;
- Kim, Heung-Kyu (Department of Automotive Engineering, Kookmin University)
-
송민재
(한국생산기술연구원 금형기술연구실용화그룹)
;
-
홍석관
(한국생산기술연구원 금형기술연구실용화그룹)
;
-
박정연
(한국생산기술연구원 금형기술연구실용화그룹)
;
-
이정원
(한국생산기술연구원 금형기술연구실용화그룹)
;
- 김흥규 (국민대학교 자동차공학과)
- Published : 2014.12.01
Abstract
Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.
Keywords