• Title/Summary/Keyword: Degree of cure

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Cure Shrinkage Behavior of Polymer Matrix Composite according to Degree of Cure (경화도에 따른 고분자 기지 복합재의 경화 수축률 거동)

  • Kwon, Hyuk;Hwang, Seong-Soon;Choi, Won-Jong;Lee, Jae-Hwan;Kim, Jae-Hak
    • Composites Research
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    • v.27 no.3
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    • pp.90-95
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    • 2014
  • Cure shrinkage during cure process of polymer matrix composites develope residual stress that cause some structural deformation, such as spring-in, spring-out and warpage. The carbon/epoxy prepreg used in this study is Hexply M21EV/34%/UD268NFS/IMA-12K supplied by Hexcel corp. Cure shrinkage and degree of cure measured by TMA(thermomechanical analyzer) and DSC(differential scanning calorimetry). Cure shrinkages are measured by TMA within a temperature range of $140{\sim}240^{\circ}C$ in a nitrogen atmosphere, and degree of cure determined by the heat of reaction using dynamic and isothermal DSC runs in argon atmosphere. As a result, the cure shrinkage is increased dramatically in a degree of cure range between 27~80%. the higher the cure temperature, the lower the degree of cure occurring to begin cure shrinkage.

Dielectric Cure Monitoring for Glass/Polyester Prepreg Composites (유리섬유/폴리에스터 복합재료를 위한 유전 경화 모니터링)

  • Kim, Hyoung-Geun;Kim, Jin-Kook;Lee, Dai-Gil
    • Proceedings of the KSME Conference
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    • 2001.11a
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    • pp.797-803
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    • 2001
  • The on-line cure monitoring of fiber reinforced thermosetting resin matrix composite material was performed for the better quality and productivity during manufacturing. Since the dissipation factor measured by dielectrometry method is dependent on the degree of cure and temperature of resin, in this study, a new method to obtain the degree of cure during on-line cure monitoring for glass/polyester composites was developed by employing a combination function of the temperature and the dissipation factor. Two sensor signals from a K-type thermocouple and an interdigitated dielectric sensor were processed during curing process under various cure cycles. The DSC (Differential Scanning Calorimetry) data was also used for the reference of degree of cure.

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Measurement of the Degree of Cure of Thermosetting Resin Matrix Composite Materials (열경화성수지 복합재료의 경화정도의 측정에 관한 연구)

  • 김진수;이대길
    • Transactions of the Korean Society of Mechanical Engineers
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    • v.19 no.9
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    • pp.2154-2164
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    • 1995
  • In this study, a dielectric cure monitoring system which consists of an electric circuit, a sensor and a personal computer was developed to on-line monitor the dielectric properties of carbon fiber epoxy composite materials. Also, the kinetic model of carbon fiber epoxy composite materials was developed by curve fitting of differential scanning calorimetry data. The start and end points of cure and the relationship between the dissipation factor and the degree of cure were obtained by comparing the dissipation factor from the dielectric properties with the degree of cure from the DSC data. The relationship between the dissipation factor and the degree of cure was tested under various temperature profiles.

Dielectric Cure Monitoring of Thermosetting Matrix Composites (열경화성 수지 복합재료의 유전 정화 모니터링)

  • Kim, Hyoung-Geun;Lee, Dai-Gil
    • Journal of the Korean Society for Nondestructive Testing
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    • v.23 no.5
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    • pp.409-417
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    • 2003
  • Cure monitoring can be used to improve the quality and productivity of thermosetting resin matrix composite products during their manufacturing process. In this work, the sensitivity of dielectrometry was improved by adequate separation the efforts of sensor and externals on the measured signal. A new algorithm to obtain the degree of cure during dielectric cure monitoring of glass/polyester and glass/epoxy composites was developed by employing a function of both temperature and dissipation factor, in which five cure monitoring parameters were used to calculate the degree of cure. The decreasing pattern of dissipation factor was compared with the relationships between the degree of cure and the resin viscosity. The developed algorithm might be employed for the in situ cure monitoring of thermosetting resin composites.

Dielectric sensor for cure monitoring of composite materials (복합재료 경화도 측정을 위한 유전 센서)

  • 김학성;권재욱;김진국;이대길;최진경;김일영
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2001.05a
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    • pp.219-223
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    • 2001
  • The on-line cure monitoring during the cure process of composite materials is important for better quality and productivity. The dielectric sensor for cure monitoring consists of base film and electrodes. Because the characteristic of dielectric sensor for the on-line cure monitoring is dependent on the base material, width and number of electrode, etc, the dielectric sensor should be standardized. And the selection of base film material of sensor is very important. In order to prevent the measuring errors generated from the increase of environmental temperature, the base film material should have stable dielectric constant with respect to environmental temperature. In this study, the newly developed dielectric sensor for cure monitoring was designed and the dissipation factor which is function of degree of cure was measured using the sensor. The relationship between the dissipation factor and degree of cure with respect to environmental temperature was investigated.

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AN EXPERIMENTAL STUDY OF THE DEGREE OF CONVERSION AND CYTOTOXICITY OF DUAL CURE RESIN CEMENTS (수종 이원중합 레진 씨멘트의 중합률 및 세포 독성에 관한 실험적 연구)

  • Roh, Byoung-Duck;Park, Seong-Ho;Lee, Chung-Suck
    • Restorative Dentistry and Endodontics
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    • v.20 no.1
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    • pp.33-54
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    • 1995
  • The degree of conversion of composite resin was known to have influence on the mechanical properties of composite materials such as hardness, strength, wear resisitance, dimensional and color stability. Also unreacted monomer was reported to be harmful to the pulp. So the degree of conversion was a very important factor in the success of composite resin restorations. In recent, the dual cure resin cement was developed with the advocations that it could increase the curing rates in the sites where the curing ligt could not reach. Moreover many manufactors added some adhesive components in the resin cement. This study was undertaken to observe the effects of curing depth and light curing times on the degree of conversion of dual cure resin cements. CR INLAY CEMENT, DUAL CEMENT and OPTEC BOND, by the Fourier transform Infrared analysis, changing the curing depth 1mm, 2mm and 3mm, and varying the light curing time 20 seconds, 40 seconds and 80 seconds at each depth. The cytotoxicity of dual cure resin cements was tested by the in vitro MTT method using L929 cell. The results was evaluated and compared statistically. The results were obtained as follows : 1. The dual cure resin cements reavealed various degree of conversion, CR INLAY CEMENT and DUAL CEMENT had a tendency to be more reactive to the light cure and OPTEC BOND was a more chemical one. 2. CR INLAY CEMENT and DUAL CEMENT showed the lowest degree of conversion in 2 mm depth, and in 3mm depth the degree of conversion increased, which were due to the chemical cure of dual cures, but OPTEC BOND showed decreasing degree of conversion with increasing curing dept h and all experimental groups showed lower degree of conversion than CHEMICAL group which cured in dark room with no light, so the weak light-curing of dual cure resin cement prevented the chemical cure. (P<0.05) 3. CR INLAY CEMENT and DUAL CEMENT showed increasing degree of conversion in 1 mm and 3 mm, according to the increasing cure times, but in 2 mm depth the degree of conversion decreased with increasing light-curing times and OPTEC BOND showed contrary tendency, but there was no ststistical importance in the differences among the experimental group.(P>0.05) 4. The optical density by MTT assay of extractions of CR INLAY CEMENT, DUAL CEMENT and OPTEC BOND revealed no statitically important differences comparing with optical density of negative control.(P>0.05) 5. CR INLAY CEMENT showed a tendency of increaing cytotoxicity with days and DUAL CEMENT and OPTEC BOND showed higher cytotoxicity in 2 days than in 4 days, but there was no statistical importance in the differences.(P>0.05).

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A Study of the Effect of Degree of Cure on the Physical Properties of Rubber Compounds (가교정도에 따른 고무복합체의 물리적 특성에 관한 연구)

  • Kim, Hyeon-Jae;Kaang, Shin-Young;Nah, Chang-Woon
    • Elastomers and Composites
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    • v.33 no.4
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    • pp.281-289
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    • 1998
  • Tensile properties including Young's modulus and tear strength were measured for four different rubber compounds; natural rubber(NR), styrene-butadiene copolymer(SBR), ethylene-propylene diene monomer (EPDM), and brominated isobutylene-p-methyl-styrene copolymer(BIMS) as a function of temperature and degree of cure. To see the effect of over cure, a measurement was made of the tensile strength and swelling behavior of the over-cured rubber compounds. Young's modulus, E, was found to have linear dependency on the degree of cure for all rubber compounds. EPDM and BIMS showed the highest and lowest slopes, respectively. The slope of NR and SBR lay between EPDM and BIMS. Tear strength, Gc, decreased in the order of NR>BIMS>SBR>EPDM. As the cure time was extended the degree of cure of NR and SBR decreased, while that of BIMS increased. EPDM showed little change in the degree of cure.

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Cure Monitoring of Composite Materials Using Dielectrometry (유전기법을 이용한 복합재료의 경화 모니터링)

  • 권재욱;김진국;김학성;이대길;최진경
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2000.11a
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    • pp.42-45
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    • 2000
  • The properties of thermosetting resins are dependent on the degree of cure and consolidation quality. Since the consolidation process of thermosetting resin matrix fiber composites is much dependent on the viscosity of resin in the composites, in this study, the dissipation factor which is a function of viscosity was measured by the newly developed Lacomtech dielectrometry apparatus and sensors. Using the measured dissipation factors, the relationship between the dissipation factor and degree of cure with respect to environmental temperature was investigated.

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Cure Monitoring for Prototyping of Reaction Injection Molding (RIM 시작공정을 위한 경화 모니터링)

  • 권재욱;이대길
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2001.04a
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    • pp.32-36
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    • 2001
  • Recently, reaction injection molding has been used broadly for rapid prototyping, because of its convenience and versatility. Since the properties of molded products are dependent on the process variables and the production is very short(less than 2minutes), the control of process variables is important. Generally, the two significant process variables are degree of cure and temperature of the reactants. In this paper, the relation between the degree of cure and the temperature of reactants was investigated to find the optimal curing condition of reaction injection molding for rapid prototyping. The degree of cure during reaction injection molding was measured by the Lacomtech sensor and dielectrometry equipment employing Wheatstone bridge type circuit.

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A Study on Cure Monitoring of Fast Cure Resin RTM Process Using Dielectrometry (유전기법을 이용한 속경화 수지 RTM 공정의 경화 모니터링에 대한 연구)

  • Park, Seul-Ki;Kim, Cheol-Hwan;Choi, Jin-Ho
    • Composites Research
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    • v.30 no.3
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    • pp.202-208
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    • 2017
  • Resin transfer molding (RTM) is a mass production process that allows the fabrication of composites ranging in size from small to large. Recently, fast curing resins with a curing time of less than about 10 minutes have been used in the automotive and aerospace industries. The viscosity of resin is bound up with the degree of cure, and it can be changed rapidly in the fast-cure resin system during the mold filling process. Therefore, it is advantageous to experimentally measure and evaluate the degree of cure because it requires much effort to predict the flow characteristics and cure of the fast curing resin. DMA and dielectric technique are the typical methods to measure the degree of cure of composite materials. In this paper, the resin flow and degree of cure were measured through the multi-channel dielectric system. A total of 8 channels of dielectric sensors were used and resin flow and degree of cure were measured and compared with each other under various pressure conditions.