• Journal of the Korean Ceramic Society
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• v.51 no.5
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• pp.498-504
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• 2014

Particulate nitride composites have been fabricated by sintering the compacted powder of AlN and 5 - 64.3 mol% $Al_2O_3$, with a small addition of $Y_2O_3$ ($Y_2O_3$/AlN, 1 wt%), in 1-atm nitrogen gas at $1650-1900^{\circ}C$. The composites were characterized in terms of sintering behavior, phase relations, microstructure and thermal shock resistance. AlN, 27R AlN pseudopolytype, and alminium oxynitride (AlON, $5AlN{\cdot}9Al_2O_3$) were found to existin the sintered material. Regardless of batch composition, the AlN-$Al_2O_3$ powder compacts exhibited similar sintering behavior; however, the degree of shrinkage commonly increased with increasing $Al_2O_3$ content, consequently giving high sintered bulk density. By increasing the $Al_2O_3$ addition up to ${\geq}50 mol%$, the matrix phase in the sintered material was converted from AlN or 27R to AlON. Above $1850^{\circ}C$, a liquid phase was formed by the reaction of $Al_2O_3$ with AlN, aided by $Y_2O_3$ and mainly existed at the grain boundaries of AlON. Thermal shock resistance was superior in the sintered composite consisting of AlON with dispersed AlN or AlN matrix phase.

• Journal of the Korean Ceramic Society
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• v.43 no.8 s.291
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• pp.472-478
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• 2006

The effect of compositional and processing variables on a nitriding reaction of silicon powder compact and subsequent post sintering of RBSN (Reaction-Bonded Silicon Nitride) was investigated. The addition of a nitriding agent enhanced nitridation rate substantially at low temperatures, while the formation of a liquid phase between the nitriding agent and the sintering additives at a high temperature caused a negative catalyst effect resulting in a decreased nitridation rate. A liquid phase formed by solely an additive, however, was found to have no effect on nitridation for the additive amount used in this research. The original site of a decomposing pore former was loosely filled by a reaction product ($Si_3N_4$), which provided a specimen with nitriding gas passage. For SRBSN (Sintered RBSN) specimens of high porosity, only a marginal dimensional change was measured after post sintering. Its engineering implication for near-net shaping ability is discussed.

• Korean Journal of Materials Research
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• v.22 no.3
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• pp.155-158
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• 2012

In this work, AlON-$Al_2O_3$ coatings were prepared on Al2021 alloy by the electrolytic plasma processing (EPP) method. The experimental electrolytes include: 2 g/l NaOH as the electrolytic conductive agent, 10 g/l $Na_2AlO_2$ as the alumina formative agent, and 0.5 g/l $NaNO_2$, $NaNO_3$, and $NH_4NO_3$ as the nitride inducing agents. The effects of different nitrogen inducing agents were studied by a combined compositional and structural analyses of the ceramic coatings carried out by Xray diffractometry (XRD) and scanning electron microscopy (SEM) for the specimens EPP-treated at room temperature for 15 min under a hybrid voltage of 260 DC along with an AC 50 Hz power supply (200 V). Microhardness tests and wear tests were carried out to correlate the evolution of the microstructure and the resulting mechanical properties. Potentiodynamic polarizations and immersion corrosion tests were carried out in 3.5wt% NaCl water solutions under static conditions in order to evaluate the corrosion behavior of the coated samples. The results demonstrate that $NaNO_2$ is proven to be a good nitrogen inducing agent to produce high quality AlON-$Al_2O_3$ ceramic coatings.

• Journal of Sensor Science and Technology
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• v.23 no.2
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• pp.94-98
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• 2014

Aluminum nitride (AlN) thin films with a TiN buffer layer have been fabricated on SUS430 substrate by RF reactive magnetron sputtering at room temperature under 25~75% $N_2$ /Ar. The characterization of film properties were performed using surface profiler, X-ray diffraction, X-ray photoelectron spectroscopy(XPS), and pressure-voltage measurement system. The deposition rates of AlN films were decreased with increasing the $N_2$ concentration owing to lower mass of nitrogen ions than Ar. The as-deposited AlN films showed crystalline phase, and with increasing the $N_2$ concentration, the peak of AlN(100) plane and the crystallinity became weak. Any change in the preferential orientation of the as-deposited AlN films was not observed within our $N_2$ concentration range. But in the case of 50% $N_2$ /Ar condition, the peak of (002) plane, which is determinant in pressure sensing properties, appeared. XPS depth profiling of AlN/TiN/SUS430 revealed Al/N ratio was close to stoichiometric value (45:47) when deposited under 50% $N_2/Ar$ atmosphere at room temperature. The output signal voltage of AlN sensor showed a linear behavior between 26~85 mV, and the pressure-sensing sensitivity was calculated as 7 mV/MPa.

• Journal of the Korean Ceramic Society
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• v.47 no.3
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• pp.205-209
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• 2010

In the last (fourth) section, the discussion will entail a silicon-nitride/silicon-carbide nanocomposite, produced by pyrolysis of liquid polymer precursors, demonstrating one of the lowest creep rates reported so far in ceramics at the comparable temperature of $1400^{\circ}C$. This was first achieved by avoiding the oxynitride glass phase at the intergrain boundaries. One important factor in the processing of these nanocomposites was the use of the electrical field assisted sintering method.

• Journal of the Korean Ceramic Society
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• v.54 no.1
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• pp.33-37
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• 2017

Single phase niobium nitride (NbN) coatings were deposited using asymmetric bipolar pulsed dc sputtering by varying pulse frequency and duty cycle of pulsed plasmas. Crystal structure, microstructure, morphology and mechanical properties were examined using XRD, FE-SEM, AFM and nanoindentation. Upon increasing pulse frequencies and decreasing duty cycles, the coating morphology was changed from a pyramidal-shaped columnar structure to a round-shaped dense structure with finer grains. Asymmetric bipolar pulsed dc sputtered NbN coatings deposited at pulse frequency of 25 kHz is characterized by higher hardness up to 17.4 GPa, elastic modulus up to 193.9 GPa, residual compressive stress and a smaller grain size down to 27.5 nm compared with dc sputtered NbN coatings at pulse frequency of 0 kHz. The results suggest that the asymmetric bipolar pulsed dc sputtering technique is very beneficial to reactive deposition of transition-metal nitrides such as NbN coatings.

• Journal of the Korean Ceramic Society
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• v.45 no.4
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• pp.238-244
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• 2008

Modeling and FEM analysis on Boron Nitride and/or Pyrolytic Carbon coating layers on SiC fibers under indentation contact loadings are investigated. Especially this study attempts to model the mechanical behavior of the SiC fibers with and without coatings. Tyranno S grade and Tyranno LoxM grade of SiC are selected for fiber and Boron Nitride and/or Pyrolytic Carbon as coating material. The modeling is performed by SiC fiber without coating layer, which includs single(BN or PyC) and double(BN-PyC or PyC-BN) coating layer. And then the analysis is performed by changing a type of coating layer, a type of fiber and coating sequence. In this study, the concepts of modeling and analysis techniques for optimum design of BN and PyC coating process on SiC fiber are shown. Results show that stresses are reduced when indentation contact loading applies on the material having lower elastic modulus.

• International Journal of Precision Engineering and Manufacturing
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• v.3 no.1
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• pp.76-82
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• 2002

This paper presents an experimental study of the effect of cutting tool materials on surface quality when turning hardened steels. Machining tests on a lathe are performed using polycrystalline cubic boron nitride (PCBN) and ceramic tools at various cutting conditions without coolant. From the experiments, it is observed that the radial force is the largest force component regardless the type of tool used. The specific cutting energy for the hard turning is estimated to be considerably smaller than the specific grinding energy. It is also found that cutting force and surface roughness with the PCBN tools are higher and better than those with the ceramic tools under the same cutting condition. It is due that the PCBN tools transfer the generated heat more effectively than the ceramic tools due to their higher thermal conductivity. The optimal cutting conditions for the best surface quality are selected by using an orthogonal array concept.

• Journal of the Korean Ceramic Society
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• v.53 no.6
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• pp.575-580
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• 2016

Microstructural design of ceramics has generally focused on information gathered at the micro- and macro-scales and related this to how specific properties could be improved. Ceramic processing serves as the key to optimizes the final microstructure. However, the advent of nano-scale microstructures and highly advanced characterization tools are forcing us to develop new knowledge of what is occurring not just at the micro-scale but also at the atomic level. Thus we are now beginning to be able to address how microstructure is influenced by events at the atomic scale using atomic scale images and data. Theoreticians have joined us in interpreting the mechanisms involved in the "microstructural" evolution at multiple scales and how this can be used to enhance specific properties of ceramics. The focus here is on delving into the various layers the "microstructure" in order understand how atomic-scale events influence the structure and properties of ceramics.

• Journal of the Korean institute of surface engineering
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• v.49 no.6
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• pp.530-538
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• 2016

There is a close relationship between the performance and the heat generation of the electronic device. Heat generation causes a significant degradation of the durability and/or efficiency of the device. It is necessary to have an effective method to release the generated heat. Based on demands of the printed circuit board (PCB) manufacturing, it is necessary to develop a robust and reliable plating technique for substrates with high thermal conductivity, such as alumina ($Al_2O_3$), aluminium nitride (AlN), and silicon nitride ($Si_3N_4$). In this study, the plating of metal layers on an insulating silicon nitride ($Si_3N_4$) ceramic substrate was developed. We formed a Pd-$TiO_2$ adhesion layer and used APTES(3-Aminopropyltriethoxysilane) to form OH groups on the surface and adhere the metal layer on the insulating $Si_3N_4$ substrate. We used an electroless Ni plating without sensitization/activation process, as Pd particles were nucleated on the $TiO_2$ layer. The electrical resistivity of Ni and Cu layers is $7.27{\times}10^{-5}$ and $1.32{\times}10^{-6}ohm-cm$ by 4 point prober, respectively. The adhesion strength is 2.506 N by scratch test.