• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.9-25
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• 2001

Fairchild has been developing a new class IPM called SPM consisting of dramatic Packaging technology to achieve the lowest cost rind better performance for low power home appliances and industrial AC drive applications. The first Fairchild SPM development with IGBT 600V/15A for washing machine application started in 1999 and was completed successfully. Fairchild SPMs are going to be the best solution for low power inverter-driven AC drive system after 2001. The new SPM Packages like SPM ∥ and SPIM for the next generation IPM with the highest competitiveness (cost & performance) shall be continuouslly developed.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.4
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• pp.105-109
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• 2015

In this study, a new airbag sensor packaging technique of directly attachment by adhesive to the automobile frame is introduced. To assess the feasibility for the packaging, a test instrument was manufactured to examine the impact sensibility by drop tests. The conventional sensor module attached mechanically by bolts with plastic housing and the new sensor packaging were installed to aluminum channel, and the results were compared with each other. Numerical analysis was also performed to investigate the signal characteristics created by the sensors. The preliminary results showed that the pattern of the MEMS sensor signal was strongly dependent on the structural behavior of the frame where the sensors were installed, which indicated the complexity of the packaging design for proper airbag deployments.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.2
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• pp.1-10
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• 2020

The technology and market size of image sensors continue to develop thanks to the release of image sensors that exceed 100 million pixels in 2019 and expansion of black box camera markets for vehicles in addition to existing mobile applications. We review the technology flow of image sensors that have been constantly evolving for 40 years since Hitachi launched a 200,000-pixel image sensor in 1979. Although CCD has made inroads into image sensor market for a while based on good picture quality, CMOS image sensor (CIS) with active pixels has made inroads into the market as semiconductor technology continues to develop, since the electrons generated by the incident light are converted to the electric signals in the pixel, and the power consumption is low. CIS image sensors with superior characteristics such as high resolution, high sensitivity, low power consumption, low noise and vivid color continue to be released as the new technologies are incorporated. At present, new types of structures such as Backside Illumination and Isolation Cell have been adopted, with better sensitivity and high S/N ratio. In the future, new photoconductive materials are expected to be adopted as a light absorption part in place of the pn junction.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.29-33
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• 2000

MEMS, Micro Electro-Mechanical Systems, present one of the greatest advanced packaging challenges of the next decade. Historically hybrid technology, generally thick film, provided sensors and actuators while integrated circuit technologies provided the microelectronics for interpretation and control of the sensor input and actuator output. Brought together in MEMS these technical fields create new opportunities for miniaturization and performance. Integrated circuit processing technologies combined with hybrid design systems yield innovative sensors and actuators for a variety of applications from single crystal silicon wafers. MEMS packages, far more simple in principle than today's electronic packages, provide only physical protection to the devices they house. However, they cannot interfere with the function of the devices and often must actually facilitate the performance of the device. For example, a pressure transducer may need to be open to atmospheric pressure on one side of the detector yet protected from contamination and blockage. Similarly, an optical device requires protection from contamination without optical attenuation or distortion being introduced. Despite impediments such as package standardization and complexity, MEMS markets expect to double by 2003 to more than ＄9 billion, largely driven by micro-fluidic applications in the medical arena. Like the semiconductor industry before it. MEMS present many diverse demands on the advanced packaging engineering community. With focused effort, particularly on standards and packaging process efficiency. MEMS may offer the greatest opportunity for technical advancement as well as profitability in advanced packaging in the first decade of the 21st century! This paper explores MEMS packaging opportunities and reviews specific technical challenges to be met.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.35-40
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• 2000

MCM technology languished troughout most of the 1990's due to high costs resulting from low yields and issues with known god die. During the last five years of the decade new developments in chip scale packages and high density, build up multi-layer printed wiring boards created new opportunities to design and produce ultra miniaturized modules using conventional surface mount manufacturing capabilities. Focus on the miniaturization of substrate based packages such as ball grid arrays (BGAs) resulted in chip scale packages (CSPs) offering many of the benefits of flip chip along with the handling, testing, manufacturing and reliability capabilities of packaged deviced. New developments in the PWB industry sought to reduce the size, weight, thickness and cost of high density interconnect (HDI) substrates. Shrinking geometries of vias and new constructions significantly increased the interconnect density available for MCM-L applications. This paper describes the most promising CSP and HDI technologies for portable products, high performance computing and dense multi-chip modules.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.20 no.1
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• pp.7-15
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• 2014

Agar-based composite films were prepared with variety of food processing and agricultural processing waste materials in order to screen natural lingo-cellulosic resources for the value-added utilization of the under-utilized materials. The effect of these waste materials (10 wt% based on agar) on mechanical properties, moisture content (MC), water vapor permeability (WVP), water absorption behavior of biocomposite films were investigated. Biocomposite films prepared with various fibers resulted in significant increase or decrease in color and percent transmittance. The MC, WVP, and surface hydrophobicity of biocomposite films increased significantly by incorporation of fibers, while the water uptake ratio and solubility of the film decreased. SEM images of biocomposite film showed better adhesion between the fiber and agar polymer. Among the tested cellulosic waste materials, rice wine waste, onion and garlic fibers were promising for the value-added utilization as a reinforcing material for the preparation of biocomposite food packaging films.

• Journal of Broadcast Engineering
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• v.9 no.4 s.25
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• pp.322-333
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• 2004

In this paper, a package, that is a new type of contents providing new consumer experience under digital broadcasting environments. is introduced. To present various advantages of package that is in standardization process of TV-Anytime Phase-2, a service scenario for personalized educational content is proposed. Then, TV-Anytime Packaging technology to support the scenario is described. It is also shown that the personalized service that provides interactive and personalized consuming experience independent of the types of content and delivery channels is feasible by using TV-Anytime Packaging technology.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.19 no.1
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• pp.51-56
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• 2013

From the time the product is manufactured until it is carried and ultimately used, the product is subjected to some form of handling and transportations. During this process, the product can be subjected to many potential hazards. One of them is the damage caused by shocks. In order to design a product-package system to protect the product, the peak acceleration or G force to the product that causes damage needs to be determined. When a corrugated fiberboard box loaded with products is dropped onto the ground, part of the energy acquired due to the action of the gravitational acceleration during the free fall is dissipated in the product and the package in various ways. The shock absorbing characteristics of the packaging cushion materials are presented as a family of cushion curves in which curves showing peak accelerations during impacts for a range of static loads are shown for several drop heights. The new method for determining the shock absorbing characteristics of cushioning materials for protective packaging has been described and demonstrated. It has been shown that cushion curves can be produced by combining the static compression and impact characteristics of the material. The dynamic factor was determined by the iterative least mean squares (ILMS) optimization technique in which the discrepancies between peak acceleration data predicted from the theoretical model and obtained from the impact tests are minimized. The approach enabled an efficient determination of cushion curves from a small number of experimental impact data.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.22 no.1
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• pp.7-13
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• 2016

As the foods and household manufacturing technology is developed, the packaging method of products is being changed from single to multi materials and layers. This study were focused on EPR carton packaging, economic and environmental expected effects were predicted by the improvements of packaging materials and structures to reduce effective packaging waste. Especially expected effects were predicted when improving the structure and material of aluminum laminated material was difficult to recycle. Thus, it was assumed the aseptic carton packaging laminated aluminum were replaced with silica laminated films. In conclusion, analysis of economic expected effects were undervalued in this study because of the limitation of assumptions, though this study has significance about a new approach by calculating the data different from the past that the conventional methods like predictive value of government's guidelines or goals.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.