• 한국포장학회지
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• 제26권3호
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• pp.139-145
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• 2020

The purpose of this study is to share the experience of online education with departments related to the servic industry, such as distribution and logistics, in the New Normal Age of COVID-19 pandemics. The graduation presentation project, which is the capstone design subject and the most urgent subject for face-to-face classes, was selected as the online education subject of this study. The results of this study are as follows : First, several online class tools, such as Zoom, Microsoft Teams, and Google Meet, have also been shown to be applicable to capstone design subjects such as graduation presentation projects. Second, it is essential to reorganize the curriculum to enhance students' ability to practice and utilize online contents. Third, continuous education and training are needed to make easy use of the aforementioned online teaching tools. Meanwhile, fourth, further research is needed to solve the learning effects caused by online learning, and difficulties in communication.

• 마이크로전자및패키징학회지
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• 제21권4호
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• pp.1-13
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• 2014

The paper gives an overview of the concepts, basic requirements, and trends regarding packaging technologies of power modules in hybrid (HEV) and electric vehicles (EV). Power electronics is gaining more and more importance in the automotive sector due to the slow but steady progress of introducing partially or even fully electric powered vehicles. The demands for power electronic devices and systems are manifold, and concerns besides aspects such as energy efficiency, cooling and costs especially robustness and lifetime issues. Higher operation temperatures and the current density increase of new IGBT (Insulated Gate Bipolar Transistor) generations make it more and more complicated to meet the quality requirements for power electronic modules. Especially the increasing heat dissipation inside the silicon (Si) leads to maximum operation temperatures of nearly $200^{\circ}C$. As a result new packaging technologies are needed to face the demands of power modules in the future. Wide-band gap (WBG) semiconductors such as silicon carbide (SiC) or gallium nitride (GaN) have the potential to considerably enhance the energy efficiency and to reduce the weight of power electronic systems in EVs due to their improved electrical and thermal properties in comparison to Si based solutions. In this paper, we will introduce various package materials, advanced packaging technologies, heat dissipation and thermal management of advanced power modules with extended reliability for EV applications. In addition, SiC and GaN based WBG power modules will be introduced.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2003년도 International Symposium
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• pp.3-17
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• 2003

.Package Trend -> Memory : Lighter, Thinner, Smaller & High Density => SiP, 3D Stack -> MPU : High Pin Counts & Multi-functional => FCBGA .Interposer Trend -> Via - Unfilled Via => Filled Via - Staggered Via => Stacked Via -> Emergence of All-layer Build-up Processes -> Interposer Material Requirement => Low CTE, Low $D_{k}$, Low $D_{f}$, Halogen-free .New Technology Concept -> Embedded Passives, Imprint, MLTS, BBUL etc.

• 식품산업과 영양
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• 제4권2호
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• pp.1-4
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• 1999

• 한국포장학회지
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• 제25권3호
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• pp.111-116
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• 2019

Thermal insulation performance of new insulation packaging made of recycled PET nonwoven (thickness : 10 mm) was verified by conducting comparative experiment with an EPS box (thickness : 25 mm) and a double wall corrugated box (thickness : 7 mm). Three ice packs (300 g) were positioned 200 mm above the bottom inside each box, all of which are placed side by side and temperature change of 2 points (5mm under middle icepack and 130 mm under middle icepack) was recorded by data logger (GL-840, Graphtec) for 16 hours under the environment of 29℃. The new packaging box showed 75% higher insulation performance than the EPS box and 180% higher than the corrugated box. In order to figure out the reason for insulation performance difference among boxes, thermal conductivities of each box material were measured using heat flow meter (HFM436 lamda, Netzsch). U-value (thermal conductivity divided by thickness) of EPS was lower than recycled pet nonwoven by 57%, which seemed to be opposite to the result of insulation test of boxes. This was explained by high water vapor transmission rate of EPS (6 times higher than PET insulation) and air pocket effect of PET insulation.

• 한국식생활문화학회지
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• 제30권1호
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• pp.1-7
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• 2015

Traditional cuisine reflects cooking traditions shaped by political, economic, social, cultural, and environmental conditions characterized by authenticity and uniqueness. Traditional food is not only a part of our cultural heritage but also a knowledge resource. Application of food science and technology in Korean traditional foods was reviewed from six points of view, including food preservation, fermentation, changes in food materials, utilization of food functionality, and packaging and development of cooking appliances. Books from disparate times were chosen in order to cover a wide range of materials from the past to the present. Food preservation and fermentation techniques were applied to various food materials. Combination of science and skills contributes to the accessibility of diverse food materials and better quality foods. Koreans use assorted and resilient plants, which have an abundance of functional substances such as food materials. Among cooking appliances, microwave oven and refrigerator are the most innovative products with huge influences on food eating patterns as well as lifestyle. Packaging effectively reduces post-harvest preservation losses, and better packaging has technical improvements for storage and distribution. Kimchi was chosen as an example in order to study technology from the past to the present. Availability of Kimchi cabbage, enrichment of functional ingredients, identification of useful microbial species, standardization of recipe for commercialization, prevention of texture softening, introduction of salted Kimchi cabbage and Kimchi refrigerators, and packaging were reviewed. The future of traditional foods in the market will be competitive. First, traditional foods market should be maintained to protect the diversity of food materials. Secondly, tailored foods for individuals should be considered using foods with functional properties. Information on health benefits would provide insights into health and traditional food products. Third, speedy transfer of new technology to the traditional food industry is needed to ensure food quality production and new opportunities in the market. Fourth, safety of traditional foods should be ensured without sacrificing the essential characteristics of culturally important foods. Improvement of logistics, distribution, and facility should be carried out. As demand for convenience foods increases, traditional foods should be developed into products.

• 멤브레인
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• 제25권2호
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• pp.85-98
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• 2015

고분자의 용이한 가공성과 우수한 투명성, 그리고 합리적인 비용 효율로 인해 식품 포장 산업에서 금속이나 유리용기들을 고분자 기반의 포장 소재들로 대체하려는 경향이 전 세계적으로 널리 퍼지고 있다. Barrier 고분자들은 산소, 이산화탄소, 수증기 등 대기 가스에 대한 낮은 투과성을 나타내고 있어 식품 포장 산업 이용에 유용하다. 이러한 식품 포장 산업의 전반적인 추세와 함께, 산소에 민감한 주스, 착향 음료, 그리고 에너지 음료 등 새로운 식품 산업의 성장으로 인해 고성능의 barrier 특성, 특히 $O_2$와 $CO_2$에 대해 낮은 투과성을 지닌 고분자 포장 소재의 개발이 시급한 상황이다. 기존의 고분자에 기반한 barrier의 성능 향상은 새로운 식품 포장 산업에 급격한 변화를 줄 것이다. 본 총설에서는 (1) antiplasticization을 유도한 barrier 소재들, (2) antiplasticization과 crystallization을 사용한 barrier 성능 상승 효과, (3) 새로운 barrier 고분자들, (4) 나노합성 소재, (5) 혼합 고분자 등과 더불어, 차세대 포장 소재들의 특성 분석을 소개하고자 한다.

• 반도체디스플레이기술학회지
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• 제1권1호
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• pp.15-19
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• 2002

A new vacuum packaging process in wafer level is developed for the surface micromachining devices using glass silicon anodic bonding technology. The inside pressure of the packaged device was measured indirectly by the quality factor of the mechanical resonator. The measured Q factor was about 5$\times10^4$ and the estimated inner pressure was about 1 mTorr. And it is also possible to change the inside pressure of the packaged devices from 2 Torr to 1 mTorr by varying the amount of the Ti gettering material. The long-term stability test is still on the way, but in initial characterization, the yield is about 80% and the vacuum degradation with time was not observed.

• 마이크로전자및패키징학회지
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• 제23권1호
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• pp.1-10
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• 2016

Nowadays, the importance of role of the international standardization keeps increasing substantially. We have already known that international standards have a huge impact on many companies, industries and nations. So far, it has been thought that standardizations are needed after the new products come into the market and are mass-produced in order to encourage the use of the products, systems and services. Standardization will make the products more safe, efficient, and environmentally friendly for the users. However, in these days, a paradigm of the standardization has been changed. International standard becomes a tool for dominating global market and is the most important ingredients of the competitiveness and economic progress of the nation and enterprises. Many countries like Japan, Germany and U.S. use the standardization as an effective method to dominate the market and monopolized the new technologies. Therefore, worldwide competition for the standardization of the new technology become fierce. Korea is leading the technology in semiconductor field. However, activities of international standardization are not sufficient. In order to boost the standardization activities in Korea from industry, academia, and research institute, this paper briefly introduce the international standard organization and some critical issues for next-generation semiconductor memory such as flexible semiconductor, automobile semiconductor and wearable devices.

• 마이크로전자및패키징학회지
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• 제25권4호
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• pp.9-15
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• 2018

This paper shows the principles and characteristics of the transient liquid phase (TLP) bonding technology for power modules packaging. The power module is semiconductor parts that change and manage power entering electronic devices, and demand is increasing due to the advent of the fourth industrial revolution. Higher operation temperatures and increasing current density are important for the performance of power modules. Conventional power modules using Si chip have reached the limit of theoretical performance development. In addition, their efficiency is reduced at high temperature because of the low properties of Si. Therefore, Si is changed to silicon carbide (SiC) and gallium nitride (GaN). Various methods of bonding have been studied, like Ag sintering and Sn-Au solder, to keep up with the development of chips, one of which is TLP bonding. TLP bonding has the advantages in price and junction temperature over other technologies. In this paper, TLP bonding using various materials and methods is introduced. In addition, new TLP technologies that are combined with other technologies such as metal powder mixing and ultrasonic technology are also reviewed.