• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.3
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• pp.163-174
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• 2023

Though box compression strength (BCS) is commonly used as a performance criterion for shipping containers, estimating BCS remains a challenge. In this study, artificial neural networks (ANN) are implemented as a new tool, with a focus on building up ANN architectures for BCS estimation. An Artificial Neural Network (ANN) model can be constructed by adjusting four modeling factors: hidden neuron numbers, epochs, number of modeling cycles, and number of data points. The four factors interact with each other to influence model accuracy and can be optimized by minimizing model's Mean Squared Error (MSE). Using both data from the literature and "synthetic" data based on the McKee equation, we find that model estimation accuracy remains limited due to the uncertainty in both the input parameters and the ANN process itself. The population size to build an ANN model has been identified based on different data sets. This study provides a methodology guide for future research exploring the applicability of ANN to address problems and answer questions in the corrugated industry.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.04a
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• pp.143-148
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• 2004

The blister packaging is applied to many fields in recent years for its merit that it enable consumer to see the products. The most of battery packaging are blister type. However, the lithium battery is dealt with very carefully in packaging because of its explosion. The existing packaging machines lot lithium battery are mostly adapted alkaline packaging machine and their capacity is very inferior to other process, either. In this paper, the virtual prototype of the automatic blister packaging system for lithium battery which has new mechanism is developed and its performance is evaluated.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2003.10a
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• pp.149-154
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• 2003

The blister packaging is applied to many fields in recent years for its merit that it enable consumer to see the products. The most of battery packaging are blister type. However, the lithium battery is dealt with very carefully in packaging because of its explosion. The existing packaging machines for lithium battery are mostly adapted alkaline packaging machine and their capacity is very inferior to other process, either. In this paper, the virtual prototype of the automatic blister packaging system for lithium battery which has new mechanism and 240A/min capacity is developed and its performance is evaluated.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.25 no.1
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• pp.1-10
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• 2019

Environmental evaluation of two different oxygen high barrier films were performed using life cycle assessment. One of the films (traditional film) was composed of aluminum oxide coated PET film, ink, LDPE and LLDPE. Another film (new film) was consists of PET, ink, protein based coating material, LDPE, LLDPE. Main layer to achieve the high oxygen barrier for traditional film was aluminum oxide coated PET film, whereas the protein based coating material act as oxygen barrier layer for new film. Functional unit of this study was 1000 pouches made of traditional and new film. System boundary was factory to gate. The results of this study revealed that the new film shows better environmental performance for most of impact indicator than traditional film, except marine eutrophication and fine particulate matter formation due to extra coating process in new film system.

• KSII Transactions on Internet and Information Systems (TIIS)
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• v.16 no.3
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• pp.894-907
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• 2022

The features extracted by convolutional neural networks are more descriptive of images than traditional features, and their convolutional layers are more suitable for retrieving images than are fully connected layers. The convolutional layer features will consume considerable time and memory if used directly to match an image. Therefore, this paper proposes a feature weighting and region integration method for convolutional layer features to form global feature vectors and subsequently use them for image matching. First, the 3D feature of the last convolutional layer is extracted, and the convolutional feature is subsequently weighted again to highlight the edge information and position information of the image. Next, we integrate several regional eigenvectors that are processed by sliding windows into a global eigenvector. Finally, the initial ranking of the retrieval is obtained by measuring the similarity of the query image and the test image using the cosine distance, and the final mean Average Precision (mAP) is obtained by using the extended query method for rearrangement. We conduct experiments using the Oxford5k and Paris6k datasets and their extended datasets, Paris106k and Oxford105k. These experimental results indicate that the global feature extracted by the new method can better describe an image.

• Journal of Institute of Control, Robotics and Systems
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• v.16 no.2
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• pp.172-176
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• 2010

Recently, LCD (Liquid Crystal Display) requires various technical challenges; high definition, high quality, big size, and low price. These demands more pixels in the fixed area of the LCD and very fine lead pitch of the driving IC which controls the pixels. Therefore, a new packaging technology is needed to meet such technical requirement. NCP (Non Conductive Paste) is one of the new packaging methods and has excellent characteristics to overcome the problems of the ACF (Anisotropic Conductive Film). In this paper, we analyzed the process of the NCP for COF (Chip on FPCB) and proposed the key design parameters of the NCP process. Through a series of experiments, we obtained the stable values of the design parameters for successful NCP process.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.3
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• pp.1-10
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• 2009

Carbon nanotube(CNT)s have been considered as one of the most unique materials due to the their superior mechanical, thermal and electrical properties. Therefore, numerous studies have been performed for the utilization of CNTs. This review article focuses on the recent research trends on the utilization of CNTs for new interconnect materials in electronics packaging. Major contents mentioned are the direct interconnection technology using CNTs and the main properties of polymer/CNTs composite materials. This article is aimed at the reviewing of important results from the recent studies and providing the straightforward understanding of the results through the mutual analysis and a industrial viewpoint.

• Journal of Information Display
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• v.2 no.4
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• pp.34-38
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• 2001

We suggested new PDP packaging technology using the direct joint method, which does not need an exhausting hole and tube. The advantages of this method are simple process, short process time and time panel package. To packaging, we drew the seal line of glass frit by dispenser followed by forming the lump, which provide pumping-out path during the packaging process. And, we have performed a pretreatment of glass frit to reduce the out-gases. After which, both front and rear glass plates were aligned and loaded into vacuum packaging chamber. The 4-inch monochrome AC-PDP was successfully packaged and fully emitted with brightness of 1000 $cd/m^2$. Also, glass frit properties for pretreatment condition was investigated by AES and SEM analyses.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.1
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• pp.1-7
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• 2012

Reliability technology has been expected to grow rapidly for new types of electronic equipments. We have selected several reliability issues in electronic package to be reviewed. This paper will provide a view of the current state of technological progress in reliability of electronic package in Japan, and will discuss future prospects for the technology.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.2
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• pp.297-304
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• 2012

Recently RFID (Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve reliability. In this paper, reliability comparison among 11 types of most commonly used epoxy molding in electrical/electronic components packaging has been made through analysis of confidentiality using a humidity sensor. Consequently, the variation of moisture penetration time causes has been verified by the changes in molding thickness for 3 types of epoxy, and from the result, the best experimental results were observed in terms of confidentiality. Moreover we have been confirmed the relationship between confidentiality, the molding thickness, and thermal property of epoxy through thermal analysis.