• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.19 no.1
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• pp.1-6
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• 2013

Confectionary and food products were collected from Korea and Japan. Types of packaging structure, amount of packaging materials used, basis weight of paperboard, and product to packaging ratio were evaluated for understanding confectionery and food packaging in both countries. Also, new packaging samples were designed and fabricated for reducing the use of packaging resources and for optimizing the product to packaging ratio. Korean confectionary products showed much higher empty space inside package than that of Japanese products, while food products were not significantly different between tow countries. There were no significant differences in the basis weight of paperboard collected. All of the re-designed confectionary products showed more than 15% saving in packaging resource compared to current confectionary products.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.7 no.2
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• pp.12-18
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• 2001

Increasing use of plastics in food packaging materials has led to the issue of food-plastic packaging materials mutual interactions. Rapid development of new microwavable ready-to-meal products requires suitable plastic packaging materials for safe heating with the contained food. However, data is still required to diminish consumers' safety concern about ready to meal packaging materials. Amounts and patterns of extracted materials from the ready-to-meal packaging materials of Korea and Japan by heat treatments ($120^{\circ}C$ for 30 min.) was investigated and compared by using Gas chromatography. Total peak number of extracted materials from Korea packaging materials was six while that of extracted materials from Japan's was only two. Moreover, the extracted amounts of packaging materials from Korea company was much higher than those of Japan's. Additional research is needed to justify the reason why extracted materials from packaging materials from Korea be much more occurred, and how the amounts from Korea packaging materials can be reduced.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.25-29
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• 2016

The semiconductor industry has been developed mainly by micronization process due to many advantages of miniaturization of devices. Mass production of semiconductors of 10 nm class has been started recently, and it is expected that the technology generation of 5 nm & 7 nm technology will come. However, excessive linewidth reduction affects physical limits and device reliability. To solve these problems, new process technology development and new concept devices are being studied. In this review, we introduce the next generation technology and introduce the advanced research for the new concept device.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.2
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• pp.32-38
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• 2002

In order to improve the transportability and safety of fishery products during distribution process, we developed new containers made of polyethylene polypropylene copolymers. Two types are developed; two color type and bar type. As the result, the stacking efficiency improved by 27.6% while providing great transportability and decreasing sanitation problems.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.10a
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• pp.7-38
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• 2000

Performance, reliability, form factor drive flip chip use. BGAs and CSPs will provide stepping stone to FC DCA .Growing vendor infrastructure - Low cost, high density organic substrates -New generations of fluxes and underfills .Adhesives flip chip technology as a low cost flip chip alternatives -Low cost Au stud or Electroless Ni bumps -Reliable thermal cycling and electrical performance.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.21 no.3
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• pp.507-515
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• 2012

Recently RFID(Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve productivity and reliability. This study is performed on FMEA, reliability at development level and analysis failure mode through environment and mechanical test. Robust design is applied to search the optimized condition of factor and RFID tag packaging should be satisfied with high MTTF.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.2
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• pp.73-78
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• 2023

The cosmetics industry faces a significant challenge in addressing the decreased recycling rate of cosmetic containers due to the composite materials used to meet consumers' aesthetic satisfaction. To address thees issues, eco-friendly packaging solutions such as refill packaging and single-material use have been developed. However, the market for eco-friendly cosmetics packaging requires a product that meets consumers' demands for aesthetics, sensitivity, and eco-friendliness while also performing as well as existing products. This study presents a solution to the challenge of the decreased recycling rate of cosmetic containers by developing a new cosmetic packaging product for cream formulations. The product features an easily separable and dischargeable internal refill container, while maintaining the design aesthetics of the external container. Through various tests, the product was shown to be of equivalent quality and performance to existing cream cosmetic packaging, with no leakage or defects observed. Furthermore, the use of a single-material polypropylene refill container is expected to contribute to the improvement of the plastic recycling rate.

• Electronics and Telecommunications Trends
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• v.35 no.4
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.7 no.1
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• pp.1-8
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• 2001

This study was carried out to develop a new insolubilizer for water resistency enhancement and to evaluate its optimum apply method to corrugated paper. The addition of polyvinyl alcohol(PVA) backbone polymer to conventional starch glue caused a poor dispersibility, but flavonoid resin addition showed a good runnability and water resistency. The double coatings(top & under) of water-proof chemicals to corrugating liner made even better the water resistency of corrugating paper. This study suggested that water-proof chemical treatments be an effective method in water-resistant corrugating paper manufacturing for a cold chain system.