• The Journal of the Convergence on Culture Technology
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• v.6 no.3
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• pp.377-380
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• 2020

The increase in single households, changes in consumption behavior, and the size of marts are becoming larger, whereas the packaging form is being changed to small packaging containers, small packages are being exported when exporting agricultural products, especially fruits and related crops, leading to CO2 at the time of export. Although it was processed, it was difficult to guarantee the freshness of the crops inside the package during the transportation period. Therefore, it is necessary to provide a new method of maintaining freshness for application to agricultural products distributed in small packaging containers as a freshness retention agent to prevent deterioration of crops by microorganisms due to changes in product temperature during transportation or display during distribution of agricultural products. I was researching ways to bring about innovation.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.17 no.2
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• pp.39-42
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• 2011

The aim of this study was to develop the appropriate packaging method for minimally processed sliced onions. The films of different gas permeabilities (LDPE $30{\mu}m$, PD900 and PD941) were used for packaging 1300g of onion slices cut into octuplicate pieces. Perforated LDPE package was prepared as control for comparison. The package atmosphere and onion quality were measured through storage at $1^{\circ}C$ for 38 days. PD900 package of the lowest gas permeability was the best in keeping the fresh-cut onions by maintaining MA conditions of 1-3% $O_2$ and 4-11% $CO_2$ concentrations. The benefits were reduced discoloration, decay and soakness.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.1
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• pp.7-16
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• 2022

Recently, the automobile industry is rapidly changing due to technological development. Next-generation cars with high technology and new functions are on the market. It is essential to develop electronic devices to meet the condition of next-generation cars. In this study, the authors have reviewed recent trends of automotive electronics and packaging technology. Automotive electronics are used in harsh environments compared with other industries. Thus, it is important to improve the reliability of device junctions that directly affect electronics performance. Soldering, TLP (transient liquid phase bonding), and sintering are introduced for the bonding methods in car electronics.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.8 no.2
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• pp.18-26
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• 2002

Films of methylcellulose(MC), chitosan and their blends were prepared using water and acid solution as a solvent. The transition behavior and miscibility of polymers and their blends were characterized by dynamic mechanical analysis(DMA) and thermogravimetric analysis(TGA). The DMA analysis of PEG400/MC blends has shown that PEG400 was compatible with MC and was effective plasticizer since the curves of $tan{\delta}$ against temperature exhibited single peak, corresponding to single glass transition temperature, which were displaced to lower values with increasing PEG400 content. Results of DMA analysis and TGA analysis of MC/chitosan blends indicate that there are some miscibility between MC and chitosan in the blends, attributed to the similarities between two polysaccharides and interactions of two polymers in the blends. The inclusion of PEG400 in the blends increase the miscibility between two components in the blends.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.43-48
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• 2001

Economical consumption of energy, longer life of lamps, higher lighting comfort and new aesthetic of illumination is subject of numerous research and development works. The halogen lamps are an example of positive solution some of above mentioned problems. The electronic transformers are more frequent used for their supply. In comparison with conventional transformers they have less weight, less volume and 60% less power losses. Their advantages are particular visible, when the hybrid technique is applied. The paper presents the results of engineering research and development works carried out in Private Institute of Electronic Engineering, in R. & D. Center for Hybrid Microelectronics and Resistors and in Technical School of Communications in Krakow, in the field of the design and exploitation tests of hybrid converters 220V AC /12V DC (electronic transformers) and electronic ballasts destined for the supply of halogen lamps 20W to 150W and fluorescent lamps respectively. To perform the converters, thick film technology and surface mount technology were used. For the protection of converter electronic circuit the thick film temperature sensor and transistors were applied. Moreover the paper presents the base application circuits of elaborated converters, their technical parameters and exploitation results. The development perspectives of such domain of hybrid circuits are also discussed.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.4
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• pp.45-50
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• 2012

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.57-65
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• 2001

Economical consumption of energy, longer life of lamps, higher lighting comfort and new aesthetic of illumination is subject of numerous research and development works. The halogen lamps are an example of positive solution some of above mentioned problems. The electronic transformers are more frequent used for their supply. In comparison with conventional transformers they have less weight, less volume and 60% less power tosses. Their advantages are particular visible, when the hybrid technique is applied. The paper presents the results of engineering research and development works carried out ill Private Institute of Electronic Engineering, in R. & D. Center for Hybrid Microelectronics and Resistors and in Technical School of Communications in Krakow, in the field of the design and exploitation tests of hybrid converters 220V AC /12V DC (electronic transformers) and electronic ballasts destined for the supply of halogen lamps 20W to 150W and fluorescent lamps respectively. To perform the converters, thick film technology and surface mount technology were used. For the protection of converter electronic circuit the thick film temperature sensor and transistors were applied. Moreover the paper presents the base application circuits of elaborated converters, their technical parameters and exploitation results. The development perspectives of hybrid domain of hybrid circuits are also discussed.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.1
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• pp.1-8
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• 2022

With the spread of COVID-19 worldwide, non-face-to-face services have grown rapidly, but at the same time, the problem of plastic waste is getting worse. Accordingly, eco-friendly policies such as carbon neutrality and sustainable circular economy are being promoted worldwide. Due to the high demand for eco-friendly products, the packaging industry is trying to develop eco-friendly packaging materials using PLA and PBAT and create new business models. On the other hand, Ulva australis occurs in large quantities in the southern seas of Korea and off the coast of Jeju Island, causing marine environmental problems. In this study, lactic acid was produced through dilute acid pretreatment, enzymatic saccharification, and fermentation processes to utilize Ulva australis as a new alternative energy raw material. In general, seaweeds vary in carbohydrate content and sugar composition depending on the species, harvest location, and time. Seaweed is mainly composed of polysaccharides such as cellulose, alginate, mannan, and xylan, but does not contain lignin. It is difficult to expect high extraction yield of the complex polysaccharide constituting Ulva australis with only one process. However, the fusion process of dilute acid and enzymatic saccharification presented in this study can extract most of the sugars contained in Ulva australis. Therefore, the fusion process is considered to be able to expect high lactic acid production yield when a commercial-scale production process is established.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.29 no.2
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• pp.95-102
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• 2023

Despite the easing of social distancing, demand for non-face-to-face services continues to rise. Recently, the EU is pursuing a comprehensive plastic use reduction by expanding the scope of plastic use regulations for packaging plastics according to the New Cyclical Economy Action Plan(NCEAP). In response to this trend, the packaging industry is moving away from conventional non-degradable/petroleum-based plastics and conducting research on packaging materials using biodegradable plastics such as PLA(Poly Lactic Acid), PBAT(Poly Butylene Adipate-co-butylene Terephthalate). On the other hand, ginkgo leaves occur in large quantities in Korea and act as a cause of slip accidents and flooding. In this study, a method to utilize ginkgo biloba leaf as a new alternative biomass resource was proposed by producing lactic acid through pretreatment, enzymatic saccharification, and fermentation processes. For the efficiency of lactic acid production, a comparative analysis of lignin content from before and after browning was performed. In addition, the degree of glucan extraction was evaluated by applying a pretreatment method using three catalysts: hot water, sulfuric acid, and sodium hydroxide. It is difficult to expect high production of lactic acid with single process. Therefore, an integrated process operation using both the pretreated hydrolyzate and the residual solid enzymatic saccharification solution must necessarily be applied.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.71-78
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• 2014

Silicon has been most widely used semiconductor material for power electronic systems. However, Si-based power devices have attained their working limits and there are a lot of efforts for alternative Si-based power devices for better performance. Advances in power electronics have improved the efficiency, size, weight and materials cost. New wide band gap materials such as SiC have now been introduced for high power applications. SiC power devices have been evolved from lab scale to a viable alternative to Si electronics in high-efficiency and high-power density applications. In this article, the potential impact of SiC devices for power applications will be discussed along with their Si counterpart in terms of higher switching performance, higher voltages and higher power density. The recent progress in the development of high voltage power semiconductor devices is reviewed. Future trends in device development and industrialization are also addressed.