Journal of the Microelectronics and Packaging Society (마이크로전자및패키징학회지)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Trends of Packaging and Micro-joining Technologies for Car Electronics

자동차용 전장품의 패키징 및 마이크로 접합기술 동향

  • Lee, Gyeong Ah (Department of Materials Science and Engineering, University of Seoul) ;
  • Cho, Do Hoon (Department of Materials Science and Engineering, University of Seoul) ;
  • Sri Harini, Rajendran (Department of Materials Science and Engineering, University of Seoul) ;
  • Jung, Jae Pil (Department of Materials Science and Engineering, University of Seoul)
  • Received : 2022.03.04
  • Accepted : 2022.03.21
  • Published : 2022.03.30
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Abstract

Recently, the automobile industry is rapidly changing due to technological development. Next-generation cars with high technology and new functions are on the market. It is essential to develop electronic devices to meet the condition of next-generation cars. In this study, the authors have reviewed recent trends of automotive electronics and packaging technology. Automotive electronics are used in harsh environments compared with other industries. Thus, it is important to improve the reliability of device junctions that directly affect electronics performance. Soldering, TLP (transient liquid phase bonding), and sintering are introduced for the bonding methods in car electronics.

최근 자동차 산업은 친환경, 편리함, 안전성과 같은 키워드를 중심으로 기술 발전이 이뤄지면서 빠르게 변화하고 있다. 친환경에 대한 관심과 맞물려 그린 카(green car)가 이목을 끌고 사용자 편의를 위한 첨단 기술 및 기능을 갖춘 고성능 자동차가 시장에 출시되고 있다. 발전하는 차량 성능으로 인해서 이에 맞는 전장품의 개발 또한 필수적이다. 자동차용 전장품은 고온, 고습, 열충격, 진동, 오염 등 복합적인 환경에서 사용되기 때문에 여타 산업에 비해 높은 수준의 신뢰성 검증이 필요하다. 특히, 부품 내 접합부의 신뢰성을 확보하여 무리없이 기능을 수행하고 운전자의 안전을 보장하는 것이 핵심이다. 따라서 저자는 차량 전장품의 최근 동향을 살펴보고 신뢰성을 향상시킬 수 있는 접합 방법으로 솔더링, TLP 접합 및 소결접합을 소개하였다.

Keywords

Acknowledgement

본 연구는 산업통상자원부 및 산업기술평가관리원(KEIT)의 소재부품기술개발사업 연구비 지원에 의해 수행되었습니다('20010580', 미니-LED 미세전극 접합을 위한 도전성 나노소재 기술 개발).

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