• Title/Summary/Keyword: nanoimprint

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Aligning Method using Concentric $Moir\'{e}$ in Nanoimprint Lithography (나노 임프린트 리소그라피에서 동심원 모아레를 이용한 정렬방법)

  • Kim, Gee-Hong;Lee, Jae-Jong;Choi, Kee-Bong;Park, Soo-Yeon;Cho, Hyun-Taek;Lee, Jong-Hyun
    • Journal of the Korean Society for Precision Engineering
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    • v.23 no.11 s.188
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    • pp.34-41
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    • 2006
  • Nanoimprint lithography is an emerging technology which has an ability to make patterns under 100nm width. Recently many researches have been focused to develop multilayer patterning function in nanoimprint lithography and aligning method is attracting attention as a key technology. $Moir\'{e}$ has been used widely to measure dislocation or deformation of objects and considered one of the best solutions to detect aligning error in nanoimprint lithography. Concentric circular patterns are used to generate a $moir\'{e}$ fringe in this paper and aligning offset and direction are extracted from it. Especially this paper shows the difference of fringe equation of $moir\'{e}$ which can be obtained in nanoimprint process atmosphere from normal one.

Trend of recent research and applications on Nanoimprint Lithography (나노임프린트 리소그래피 기술의 연구 및 응용 동향)

  • Nah, D.B.;Park, J.S.
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2008.10a
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    • pp.325-328
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    • 2008
  • With intensive research and development to mass particular nanostructure of 10nm, Nanoimprint lithography will soon be put to practical use. This paper reviews latest research and application trend and also covers technical articles about Nanoimprint lithography technology Published since 1998, including statistical analysis of collected data(Web of Science DB) and related technical trend.

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Development of UV curable polymer and curing characteristics estimation for UV nanoimprint (UV 나노임프린트를 위한 UV 경화성 수지 개발 및 경화 특성 평가)

  • 이진우;이승재;이응숙;정준호;조동우
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.1220-1223
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    • 2003
  • The UV nanoimprint technology uses the UV light as the energy source. Because the imprint process is carried out in room temperature and low pressure, this technology has its own merits compared to the thermal nanoimprint. However, in UV nanoimprint technology, a resin which has low viscosity is essential for the improvement of accuracy. In this research, a resin (named as IMS01) which has relatively low viscosity was developed. And a measurement system was developed in order to measure the degree of cure of the resin. The measurement system which is composed of FT-IR, UV light source and optical guide can measure the degree of cure in real time. From the experimental results, it was found that the IMS01 is cured more rapidly than existing resin (PAK01).

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A Numerical Analysis of Polymer Flow in Thermal Nanoimprint Lithography

  • Kim, Nam-Woong;Kim, Kug-Weon;Lee, Woo-Young
    • Journal of the Semiconductor & Display Technology
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    • v.9 no.3
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    • pp.29-34
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    • 2010
  • Nanoimprint lithography (NIL) is an emerging technology enabling cost effective and high throughput nanofabrication. To successfully imprint a nanometer scale patterns, the understanding of the mechanism in nanoimprint forming is essential. In this paper, a numerical analysis of polymer flow in thermal NIL was performed. First, a finite element model of the periodic mold structure with prescribed boundary conditions was established. Then, the volume of fluid (VOF) and grid deformation method were utilized to calculate the free surfaces of the polymer flow based on an Eulerian grid system. From the simulation, the velocity fields and the imprinting pressure for constant imprinting velocity in thermal NIL were obtained. The velocity field is significant because it can directly describe the mode of the polymer deformation, which is the key role to determine the mechanism of nanoimprint forming. Effects of different mold shapes and various thicknesses of polymer resist were also investigated.

A Study on the Filling Process and Residual Layer Formation in Nanoimprint Lithography Process (나노임프린트 공정에서의 충전과정과 잔류층 형성에 관한 연구)

  • Lee, Ki-Yeon;Kim, Kug-Weon
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.13 no.9
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    • pp.3835-3840
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    • 2012
  • Nanoimprint lithography (NIL) is an emerging technology enabling cost-effective and high-throughput nanofabrication. Recently a lot of research for the nanoimprint have been carried out, but almost are about merely experimental result relating to the material operation and the imprint fabrication, and numerical analysis relating to the understanding of the imprint process with R&D level. In this paper, the viscoelasticity analysis model is developed using the finite element method. With this model, the filling process and residual layer formation in nanoimprint are analyzed, which is evaluated by a nanoimprint experiment.

UV/Thermal Hybrid Nanoimprint System for Flexible Substrates (유연기판을 위한 UV/Thermal 하이브리드방식 나노임프린트 시스템)

  • Lim, Hyung-Jun;Lee, Jae-Jong;Choi, Kee-Bong;Kim, Gee-Hong;Ahn, Hyun-Jin;Ryu, Ji-Hyeong
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.20 no.3
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    • pp.245-250
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    • 2011
  • An UV/thermal hybrid nanoimprint lithography system was designed and implemented for the pattern transfer to flexible substrates. This system can utilize a plate stamp, roll stamp, and film stamp. For all cases of using those stamps, this system is also switchable an UV or thermal nanoimprint lithography mode. This paper shows how to design the heating and UV curing plates and proposes how to change them easily. Because the pressure condition and the speed of the press roller varies by the characteristics of the stamp and substrate, all the parameters related to the nanoimprint lithography have to adjustable. Some transferred patterns are shown in this paper to verify the performance of the hybrid nanoimprint lithography system. The flexible substrates with nano-scale patterns on them will be key components for next generation technologies such as flexible displays, bendable semi-conductors, and solar cells.

NUMERICAL SIMULATION OF THERMAL CONTROL OF A HOT PLATE FOR THERMAL NANOIMPRINT LITHOGRAPHY MACHINES (고온 나노임프린트 장비용 핫플레이트의 열제어에 대한 수치모사)

  • Park, G.J.;Kwak, H.S.;Shin, D.W.;Lee, J.J.
    • 한국전산유체공학회:학술대회논문집
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    • 2007.04a
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    • pp.153-158
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    • 2007
  • Since the introduction of Nanoimprint in the mid-1990s, Nanoimprint lithography, a low-cost, non-convential method, has been the dominant lithography technology that guarantees high-throughput patterning of nanostructures. Based on the mechanical embossing mechanism, Nanoimprint lithography creates the nanopatterns on the polymer material cast on the substrate. In essence, the process needs nanofabrication equipment for printing with the adequate control of temperature, pressure and control of parallels of the stamp and substrate. This article introduce the possibility and reality of the thermal control on the hot plate using a CFD code. Numerical computation has been conducted for assessing the feasibility of a hot plate($120{\times}120\;mm2$). PID control is adopted to ensure high temperature uniformity in several zones. Parallel experiments have also been performed for verifying thermal performance. Not only show the results the optimum number of thermocouples related to controllers but also suggest that the thermal simulation using a CFD code would be an alternative method to design and develop the thermal control equipment in the financial aspect.

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A Study on Adhesion in Diamond Nanoimprint Lithography Using Molecular Dynamics Simulation (분자동역학 시뮬레이션을 이용한 다이아몬드 나노임프린트 리소그라피에서의 점착에 관한 연구)

  • Kim Kwang-Seop;Kang Ji-Hoon;Kim Kyung-Woong
    • Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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    • 2004.11a
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    • pp.83-89
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    • 2004
  • In this paper, molecular dynamics simulations are performed to analyze the adhesion between a diamond mould and a copper substrate in diamond nanoimprint lithography. The diamond nanoimprint lithography process is simplified as punch-type nanoindentation. The copper substrates are assumed to monocrystalline and defect free and consist of $22500\~80000$ atoms depending on their dimension. The diamond moulds consist of 916 or 2414 atoms, which is assumed to be rigid. The consistent results lot the maximum normal force and the adhesion force are obtained regardless of the size of substrates and the adhesion hysteresis is shown in all cases. It is found that the friction acting on the sidewalls of the mould affects the adhesion significantly when the mould is released from the substrate.

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